Applications for Maskless E-Beam Lithography between ... - Sematech
Applications for Maskless E-Beam Lithography between ... - Sematech
Applications for Maskless E-Beam Lithography between ... - Sematech
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<strong>Applications</strong> <strong>for</strong> Mask-less E-<strong>Beam</strong> <strong>Lithography</strong><br />
<strong>between</strong> R&D and Manufacturing<br />
May 24, 2006<br />
Johannes Kretz<br />
<strong>Lithography</strong> Forum
Table of Contents<br />
E-<strong>Beam</strong> <strong>Lithography</strong> at Qimonda in Dresden<br />
Project Environment (Qimonda, Fraunhofer, VISTEC, IMS)<br />
Technical Results<br />
Future: ML2<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 2 Confidential
Table of Contents<br />
E-<strong>Beam</strong> <strong>Lithography</strong> at Qimonda in Dresden<br />
Project Environment (Qimonda, Fraunhofer, VISTEC, IMS)<br />
Technical Results<br />
Future: ML2<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 3 Confidential
Motivation<br />
• Decision Mid 2004 <strong>for</strong> acquisition of a Variable Shaped Electron <strong>Beam</strong><br />
<strong>Lithography</strong> in Dresden <strong>for</strong> shared use of Infineon and AMD<br />
• E-<strong>Beam</strong> Business Cases <strong>for</strong> support of R&D existing<br />
• E-<strong>Beam</strong> has great potential to facilitate optical litho, technology<br />
development and product engineering (mask cost, time to silicon)<br />
• Further, more sophisticated applications to a later date conceivable<br />
� There<strong>for</strong>e participation of Infineon/Qimonda in European Programs<br />
<strong>for</strong> Mask less Lithograph (ML2)<br />
• Manufacturing <strong>Lithography</strong> Strategy of Qimonda unchanged<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 4 Confidential
Center of Competence E-<strong>Beam</strong> at QD P RDC<br />
• Own Group at Qimonda Dresden Research & Development Center<br />
(Head: Berndt Tropper) with additional resources from optical litho<br />
department, integration and etch (total: 9 persons)<br />
• Main objective: device learning
E-<strong>Beam</strong> Direct Write: Possible <strong>Applications</strong><br />
Test Structures <strong>for</strong> technology learning and tool qualification<br />
Personalization<br />
ASIC Structuring<br />
Ground rule, cell concept and device learning<br />
Metal fix applications <strong>for</strong> 130nm and 90nm technologies<br />
Chip shuttle <strong>for</strong> macro verification<br />
Main focus Qimonda Main focus <strong>for</strong> logic companies<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 6 Confidential<br />
Increasing complexity
2005<br />
Timeline E-<strong>Beam</strong> Project<br />
4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12<br />
Site Accept E-<strong>Beam</strong><br />
Tool Delivery CNT<br />
Transfer Resist Process<br />
Final Acceptance<br />
2006 2007<br />
Support Device 1 layer<br />
Ready <strong>for</strong> Service Center <strong>for</strong> (external) customers<br />
Column Upgrade<br />
Support Device >1 layer<br />
45nm node capability 32nm node capability<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 7 Confidential
E-<strong>Beam</strong> Cluster in CNT Clean room<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 8 Confidential
Table of Contents<br />
E-<strong>Beam</strong> <strong>Lithography</strong> at Qimonda in Dresden<br />
Project Environment (Qimonda, Fraunhofer, VISTEC, IMS)<br />
Technical Results<br />
Future: ML2<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 9 Confidential
Project Construct<br />
• Collaboration <strong>between</strong> Qimonda, CNT and external Partners<br />
• Resist benchmarking & process development @ IMS Chips<br />
• Timeframe: October 04 – Mid 08<br />
• National Funding (BMBF with Fraunhofer: SWITCH, SOHAR)<br />
• European Programs (FOREMOST)<br />
• Synergies to other (NGL) technologies<br />
– Mask applications<br />
– Nano-imprint (resist process)<br />
–EUV<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 10 Confidential<br />
S<br />
J<br />
DD
Mission or Fraunhofer CNT<br />
Center<br />
Nanoelectronic<br />
Technologies<br />
� a public-private partnership<br />
� the most efficient plat<strong>for</strong>m to develop<br />
� innovative processing solutions<br />
� <strong>for</strong> fast implementation in microelectronic devices<br />
� in the nanoelectronic era in Germany / Europe<br />
page 11
Research Challenge: … Fast Integration of Innovative<br />
Processes/Technologies and Equipment into Manufacturing<br />
Sequential<br />
Basic Research<br />
Integrated<br />
Basic<br />
Research<br />
Applied Research<br />
> 5 years<br />
Applied Research<br />
~ 3 years<br />
Development<br />
Product<br />
Technology<br />
CNT<br />
Development<br />
Product<br />
Technology<br />
Pilot<br />
Product<br />
Pilot<br />
Product<br />
Volume<br />
Ramp<br />
Volume<br />
Ramp<br />
• No Feedback<br />
• Independent<br />
• Technology driven<br />
• Fast Feedback<br />
from market<br />
• Interacting<br />
• Application driven<br />
page 12
European Nanotechnology Plat<strong>for</strong>m - Concept<br />
page 13
CNT Competence Areas<br />
<strong>for</strong> High-Per<strong>for</strong>mance Data Processing and Logic<br />
Materials<br />
Unit Process &<br />
Modules<br />
Areas Competence Reference Fab<br />
Equipment<br />
� New materials<br />
- storage cell<br />
- isolation concepts<br />
- conductor<br />
-transistor<br />
� Metrology and Analytics<br />
� Innovative Process Solutions<br />
� Enabling Patterning<br />
AMD Fab 36<br />
300mm<br />
IFX SC300<br />
300mm<br />
page 14
CNT Layout<br />
acces to<br />
CNT offices<br />
page 15
Table of Contents<br />
E-<strong>Beam</strong> <strong>Lithography</strong> at Qimonda in Dresden<br />
Project Environment (Qimonda, Fraunhofer, VISTEC, IMS)<br />
Technical Results<br />
Future: ML2<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 16 Confidential
Resist Benchmarking at IMS Chips<br />
Extensive benchmarking of >30 positive and negative chemically amplified<br />
resists <strong>for</strong> direct write applications per<strong>for</strong>med at IMS Chips<br />
• Multiple (small volume) samples supplied by all major resist vendors<br />
• Identification of p& n-CARs <strong>for</strong> 50nm DRAM node applications meeting basic<br />
resist requirements<br />
• Resist improvement clearly visible<br />
– Multiple learning cycles observed with several suppliers<br />
– Commercialization of most advanced samples<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 17 Confidential
P-CAR Benchmarking Result (dense<br />
pattern)<br />
Resist<br />
F<br />
Resist<br />
G<br />
Resist<br />
I<br />
Resist<br />
J<br />
Resist<br />
K<br />
50nm 55nm 60nm 70nm 100nm<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 18 Confidential
Status Exposure Results: Negative Resist<br />
50nm<br />
L/S<br />
70nm<br />
Dots<br />
iso dense (7-lines) dense (wide lines)<br />
(Pitch 180nm)<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 19 Confidential
Status Exposure Results: Positive Resist<br />
50nm<br />
L/S<br />
70nm<br />
CH<br />
iso dense (7-lines) dense (wide lines)<br />
(Pitch 180nm)<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 20 Confidential
Table of Contents<br />
E-<strong>Beam</strong> <strong>Lithography</strong> at Qimonda in Dresden<br />
Project Environment (Qimonda, Fraunhofer, VISTEC, IMS)<br />
Technical Results<br />
Future: ML2<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 21 Confidential
IMS<br />
Nanofabrication<br />
PML2 Project Status<br />
IMS-Jena
PML2<br />
SEMATECH Litho Forum<br />
Vancouver, 22-May-2005<br />
E - beam evolution at Vistec<br />
Device engineering Fast prototyping Low volume production<br />
Litho ++ Litho+ Litho<br />
VB6 SB350DW PML2 R&D Project<br />
Gaussian <strong>Beam</strong><br />
1 Gaussian pixel / flash <strong>Beam</strong><br />
Shaped Shaped <strong>Beam</strong> <strong>Beam</strong><br />
100 pixels / flash<br />
Multi <strong>Beam</strong> Array<br />
Multi <strong>Beam</strong><br />
> 10,000 pixels / flash<br />
Increasing throughput<br />
Increasing complexity<br />
IMS<br />
Nanofabrication<br />
23
PML2<br />
SEMATECH Litho Forum<br />
Vancouver, 22-May-2005<br />
Multi e-beam, single column<br />
5keV<br />
100keV<br />
Single Electron source<br />
Condenser Optics<br />
Programmable Aperture Plate<br />
System (APS)<br />
200x Reduction Projection<br />
Electrostatic / Magnetic Optics<br />
Scanning Wafer Stage<br />
IMS<br />
Nanofabrication<br />
24
PML2<br />
SEMATECH Litho Forum<br />
Vancouver, 22-May-2005<br />
Throughput estimation<br />
Feature POC tool Beta tool<br />
Technology node 45 nm 45 nm<br />
Resist 36 µC/cm² 18 µC/cm²<br />
APS size 20x20 mm² 40x40 mm²<br />
aperture size/ number 5µm/ 0.3Mio 5µm/ 1.2Mio<br />
Blanking rate<br />
Current in column<br />
1 MHz 8 MHz<br />
50% beams on 0.45 µA 3.5 µA<br />
Total blur < 10 nm 13 nm<br />
v-stage<br />
Throughput<br />
0.025 m/s 0.2 m/s<br />
(12” wafer)<br />
0.1 WPH 1.3 WPH<br />
Results are based on:<br />
- 0.1s stage turn-around time, 120s overhead/ wafer<br />
- calculation of 3rd / 5th order electron optical aberrations<br />
- Monte Carlo simulation of all space charge effects (ray tracing)<br />
IMS<br />
Nanofabrication<br />
Potential: 5 WPH<br />
Potential: 5 WPH<br />
sophisticated stage<br />
required (0.5…1m/s)<br />
25
Summary<br />
• VSB E-<strong>Beam</strong> <strong>Lithography</strong> established in Dresden<br />
• Patterning Ready <strong>for</strong> Internal and External Customers<br />
• Use <strong>for</strong> 300mm applications <strong>for</strong> future device and technology<br />
learning<br />
• Use of FhG network and National / European funding <strong>for</strong><br />
process development<br />
• Process-learning <strong>for</strong> future mask-less litho tools<br />
• Strong potential <strong>for</strong> mask-less lithography in R&D<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 26 Confidential
Acknowledgement<br />
The Qimonda part of the work <strong>for</strong> this paper was partly supported by<br />
the EFRE fund of the European Community and by funding of the<br />
State Saxony of the Federal Republic of Germany (project number<br />
10746) and partly by the Federal Ministry of Education and Research<br />
of the Federal Republic of Germany (Project No 01M3167A). The<br />
authors are responsible <strong>for</strong> the content of the paper.<br />
Thanks to:<br />
• Center of Competence E-<strong>Beam</strong>, Frank-Michael Kamm<br />
• VISTEC Jena<br />
• Karl-Heinz Kliem, Elke Kilgus, Monika Böttcher, Uli Denker, Lutz Bettin, Bernd<br />
Brendel, Dirk Beyer, Hans-Joachim Döring<br />
• IMS Chips<br />
• Mathias Irmscher, Anatol Schwersenz, Holger Sailer<br />
• Fraunhofer CNT<br />
• Peter Kücher<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 27 Confidential
Team of E-<strong>Beam</strong> Competence Center<br />
• Christian Arndt (optical litho)<br />
• Maik Bootsmann (integration)<br />
• Kang-Hoon Choi (resist, track, metrology)<br />
• Christoph Hohle (resist screening and process)<br />
• Katja Keil, PhD<br />
• Johannes Kretz (project manager)<br />
• Tarek Lutz (device, alignment, proximity, tool)<br />
• M. Tesauro (etch)<br />
• Frank Thrum (Data Prep, KERF, fracturing)<br />
Qimonda · Johannes Kretz · QD P RDC EBEAM · May 24, 2006 · Page 28 Confidential
Thank you<br />
The World’s Leading<br />
Creative Memory Company<br />
Johannes Kretz