Effect of Wetting Time on CD Uniformity in Immersion Lithography
Effect of Wetting Time on CD Uniformity in Immersion Lithography
Effect of Wetting Time on CD Uniformity in Immersion Lithography
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IBM Systems and Technology Group<br />
<str<strong>on</strong>g>Wett<strong>in</strong>g</str<strong>on</strong>g> <str<strong>on</strong>g>Time</str<strong>on</strong>g> Maps<br />
� <str<strong>on</strong>g>Wett<strong>in</strong>g</str<strong>on</strong>g> time maps were<br />
generated by analyz<strong>in</strong>g the<br />
wafer stage trace<br />
� <str<strong>on</strong>g>Wett<strong>in</strong>g</str<strong>on</strong>g> times are affected by:<br />
– Die size<br />
– Die layout and expose order<br />
– Stage velocity<br />
– Pre-exposure alignment<br />
sequence<br />
– Exposure dose<br />
8 <str<strong>on</strong>g>Effect</str<strong>on</strong>g> <str<strong>on</strong>g>of</str<strong>on</strong>g> <str<strong>on</strong>g>Wett<strong>in</strong>g</str<strong>on</strong>g> <str<strong>on</strong>g>Time</str<strong>on</strong>g> <strong>on</strong> <strong>CD</strong>U - Kaushal Patel September 13, 2005<br />
© 2003 IBM Corporati<strong>on</strong>
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