Effect of Wetting Time on CD Uniformity in Immersion Lithography
Effect of Wetting Time on CD Uniformity in Immersion Lithography
Effect of Wetting Time on CD Uniformity in Immersion Lithography
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IBM Systems and Technology Group<br />
C<strong>on</strong>tributi<strong>on</strong>s to <strong>CD</strong> Variati<strong>on</strong><br />
� Intrafield (ACLV)<br />
– Photomask <strong>CD</strong> error<br />
– Feature orientati<strong>on</strong> relative to scan directi<strong>on</strong><br />
– Intensity variati<strong>on</strong> across slit<br />
� Interfield (AWLV)<br />
– Scann<strong>in</strong>g directi<strong>on</strong><br />
– Process (hotplate, develop process, wett<strong>in</strong>g)<br />
� Residuals<br />
Reference: A. W<strong>on</strong>g, A. Molless, T. Brunner et al.,”L<strong>in</strong>ewidth variati<strong>on</strong> characterizati<strong>on</strong> by spatial<br />
decompositi<strong>on</strong>”, JMMM, 1 pp. 106-115(2002).<br />
11 <str<strong>on</strong>g>Effect</str<strong>on</strong>g> <str<strong>on</strong>g>of</str<strong>on</strong>g> <str<strong>on</strong>g>Wett<strong>in</strong>g</str<strong>on</strong>g> <str<strong>on</strong>g>Time</str<strong>on</strong>g> <strong>on</strong> <strong>CD</strong>U - Kaushal Patel September 13, 2005<br />
© 2003 IBM Corporati<strong>on</strong>
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