Effect of Wetting Time on CD Uniformity in Immersion Lithography
Effect of Wetting Time on CD Uniformity in Immersion Lithography
Effect of Wetting Time on CD Uniformity in Immersion Lithography
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IBM Systems and Technology Group<br />
Scatterometry – Precisi<strong>on</strong> Metrology<br />
Resist Height<br />
ULT<br />
Top <strong>CD</strong><br />
Mid <strong>CD</strong><br />
Side wall<br />
angle<br />
Bottom <strong>CD</strong><br />
Trapezoidal Model<br />
(6 parameters)<br />
10 <str<strong>on</strong>g>Effect</str<strong>on</strong>g> <str<strong>on</strong>g>of</str<strong>on</strong>g> <str<strong>on</strong>g>Wett<strong>in</strong>g</str<strong>on</strong>g> <str<strong>on</strong>g>Time</str<strong>on</strong>g> <strong>on</strong> <strong>CD</strong>U - Kaushal Patel September 13, 2005<br />
� KLA-Tencor Spectra FX100 <strong>CD</strong><br />
� New library for each stack<br />
� Target feature<br />
– 120nm l<strong>in</strong>e / 400nm pitch<br />
� 26 x 26 mm 2 field<br />
� 16 sites per field, 86 fields<br />
-13 -6.5 0 6.5 13<br />
Site locati<strong>on</strong><br />
13<br />
6.5<br />
0<br />
-6.5<br />
-13<br />
-150 -75 0 75 150<br />
Field locati<strong>on</strong><br />
150<br />
75<br />
0<br />
-75<br />
-150<br />
© 2003 IBM Corporati<strong>on</strong>
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