AMSV Newsletter 2016

More documents

Recommendations

Info

ISSCC / 2002 - 2017 — 21 papers/chips ISSCC 2015 11 ISSCC 2015 CMOS 65 nm CMOS 65 nm A 123-Phase DC-DC Converter-Ring with Fast-DVS for Microprocessors 10 A 2-/3-Phase Fully Integrated Switched-Capacitor DC-DC Converter in Bulk CMOS for Energy-Efficient Digital Circuits with 14% Efficiency Improvement 9 ISSCC 2015 ISSCC 2014 CMOS 65 nm CMOS 65 nm A 5.5mW 6b 5GS/s 4×-Interleaved 3b/cycle SAR ADC in 65nm CMOS 8 A 0.5V 1.15mW 0.2mm 2 Sub-GHz ZigBee Receiver Supporting 433/860/915/960MHz ISM Bands with Zero External Components ISSCC 2014 7 ISSCC 2014 CMOS 65 nm CMOS 0.18 μm An RF-to-BB-Current-Reuse Wideband Receiver with Parallel N-Path Active/Passive Mixers and a Single-MOS Pole-Zero LPF 6 A 0.0013mm 2 3.6μW Nested-Current-Mirror Single-Stage Amplifier Driving 0.15-to-15nF Capacitive Loads with >62° Phase Margin ISSCC 2013 5 ISSCC 2012 CMOS 65 nm CMOS 0.35 μm A 1.7mW 0.22mm 2 2.4GHz ZigBee RX Exploiting a Current-Reuse Blixer+Hybrid Filter Topology in 65nm CMOS 4 A 0.016mm 2 144µW Three-Stage Amplifier Capable of Driving 1-to-15nF Capacitive Load with >0.95MHz GBW ISSCC 2011 2,3 ISSCC 2002 CMOS 65 nm CMOS 0.35 μm A 0.46mm 2 4-dB NF Unified Receiver Front-End for Full-Band Mobile TV A 0.024mm 2 8-bit 400 MS/s SAR ADC with 2-bit per Cycle and Resistive DAC 1 A 2.5V 57MHz 15-tap SC Bandpass Interpolating Filter with 320MHz Output Sampling Rate in 0.35μm CMOS
ISSCC Results for Academia in China (2011-2017) By First Affiliation of First Author 2011 2012 2013 2014 2015 <strong>2016</strong> 2017 Total University of Macau 2 1 1 3 2 3 6 18 Hong Kong University of Science and Technology 1 1 2 3 4 3 4 18 Fudan University 1 1 2 1 5 Tsinghua University 1 2 1 4 Institute of Microelectronics Chinese Academy of Science 1 1 1 3 Awards and Student Research Preview in 2011 - 2017: 2 ISSCC Silk-Road Award 4 SSCS Pre-Doctoral Achievement Award 9 ISSCC Student Research Preview Industry/University/Institute Worldwide (2017) (First Author Affiliation) ▓ Industry: 7 ◆MediaTek (9), IBM (5), Samsung Electronics (5), Intel (5), ◆TSMC (3), Analog Devices (3), Xilinx (3). ▓ University: 16 ◆Univ. of Michigan (11), Columbia Univ. (6), Delft Univ. (6), ◆KAIST (6), U. Macau (6), Univ. of Texas @ Dallas (6), ◆Georgia Inst. of Tech. (5), Pohang U. of Sci. & Tech. (5), ◆UC San Diego (5), HK U. of S&T (4), MIT (4), UCLA (4), ◆National Chiao Tung Univ.(3), Princeton Univ.(3), ◆Stanford Univ. (3), Univ. of Illinois (3). ▓ Institute: 1 ◆IMEC (4).
Page 1 and 2: State Key Lab of Analog and Mixed-S
Page 3 and 4: Selected works from each research l
Page 5 and 6: Vcal,P Vcal,N Off_N Off_P R R Off_P
Page 7: ISSCC / 2002 - 2017 — 21 papers/c
Page 11 and 12: Design of a Collapse-Mode CMUT With
Page 13 and 14: In RSC Lab on a Chip 2016 Sub-7-Sec
Page 15 and 16: Events and Visits Visits Visit by D

AMSV Newsletter 2016

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?