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(12) PATENT APPLICATION PUBLICATION (21) Application No.6651/DELNP/2008 A<br />

(19) INDIA<br />

(22) Date <strong>of</strong> filing <strong>of</strong> Application :31/07/2008 (43) Publication Date : 24/10/2008<br />

(54) Title <strong>of</strong> the invention : SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME<br />

(51) International classification :H01L 29/78 (71)Name <strong>of</strong> Applicant :<br />

(31) Priority Document No :11/390,796<br />

1)FREESCALE SEMICONDUCTOR, INC.<br />

(32) Priority Date :27/03/2006<br />

Address <strong>of</strong> Applicant :6501 WILLIAM CANNON DRIVE<br />

(33) Name <strong>of</strong> priority country :U.S.A.<br />

WEST, AUSTIN, TEXAS 78735, U.S.A. U.S.A.<br />

(86) International Application No :PCT/US2007/062923 (72)Name <strong>of</strong> Inventor :<br />

Filing Date<br />

:28/02/2007<br />

1)KHEMKA,VISHNU K<br />

(87) International Publication No :WO 2007/112171 2)BOSE, AMITAVA<br />

(61) Patent <strong>of</strong> Addition to Application<br />

Number<br />

Filing Date<br />

:NA<br />

:NA<br />

3)ROGGENDAUER, TODD, C<br />

4)ZHU, RONGHUA<br />

(62) Divisional to Application Number :NA<br />

Filing Date<br />

:NA<br />

(57) Abstract :<br />

A semiconductor device may include a semiconductor substrate having a first dopant type. A first semiconductor region within the<br />

semiconductor substrate may have a plurality <strong>of</strong> first <strong>and</strong> second portions (44, 54). The first portions (44) may have a first thickness,<br />

<strong>and</strong> the second portions (54) may have a second thickness. The first semiconductor region may have a second dopant type. A plurality<br />

<strong>of</strong> second semiconductor regions (42) within the semiconductor substrate may each be positioned at least one <strong>of</strong> directly below <strong>and</strong><br />

directly above a respective one <strong>of</strong> the first portions (44) <strong>of</strong> the first semiconductor region <strong>and</strong> laterally between a respective pair <strong>of</strong> the<br />

second portions (54) <strong>of</strong> the first semiconductor region. A third semiconductor region (56) within the semiconductor substrate may<br />

have the first dopant type. A gate electrode (64) may be over at least a portion <strong>of</strong> the first semiconductor region <strong>and</strong> at least a portion<br />

<strong>of</strong> the third semiconductor region (56).<br />

No. <strong>of</strong> Pages : 27 No. <strong>of</strong> Claims : 20<br />

The Patent Office Journal 24/10/2008 26114

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