11.12.2012 Views

continued from part 1 - Controller General of Patents, Designs, and ...

continued from part 1 - Controller General of Patents, Designs, and ...

continued from part 1 - Controller General of Patents, Designs, and ...

SHOW MORE
SHOW LESS

Create successful ePaper yourself

Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.

(12) PATENT APPLICATION PUBLICATION (21) Application No.6634/DELNP/2008 A<br />

(19) INDIA<br />

(22) Date <strong>of</strong> filing <strong>of</strong> Application :30/07/2008 (43) Publication Date : 24/10/2008<br />

(54) Title <strong>of</strong> the invention : ELECTRO-CHEMICAL METHOD AN ENRICHMENT PROCESS<br />

(51) International classification :C23F 14/00 (71)Name <strong>of</strong> Applicant :<br />

(31) Priority Document No :20060299<br />

1)SAVCOR ART GLOBAL OY<br />

(32) Priority Date :29/03/2006<br />

Address <strong>of</strong> Applicant :INSINOORINKATU 8, FIN-50100<br />

(33) Name <strong>of</strong> priority country :Finl<strong>and</strong><br />

MIKKLI, FINLAND. Finl<strong>and</strong><br />

(86) International Application No :PCT/FI2007/000076 (72)Name <strong>of</strong> Inventor :<br />

Filing Date<br />

:28/03/2007 1)LAURILA, TIMO<br />

(87) International Publication No :WO 2007/110469<br />

(61) Patent <strong>of</strong> Addition to Application<br />

Number<br />

Filing Date<br />

:NA<br />

:NA<br />

(62) Divisional to Application Number :NA<br />

Filing Date<br />

:NA<br />

(57) Abstract :<br />

The invention relates to a method that inhibits the formation <strong>of</strong> a deposition layer on metal surfaces in liquid submersion in a process<br />

susceptible to deposition, e.g. in an enrichment process. In the method, anodic current is supplied to the metal surface (11) to be<br />

protected against deposition via an external power source (100) <strong>and</strong> a cathode (12) immersed in the liquid, producing in the<br />

composition <strong>of</strong> the deposition adhering to the metal surface a change causing the adherence <strong>of</strong> the deposition to the surface (11) to be<br />

substantially weakened or the formation <strong>of</strong> deposition on a clean surface (11) to be substantially retarded<br />

No. <strong>of</strong> Pages : 16 No. <strong>of</strong> Claims : 13<br />

The Patent Office Journal 24/10/2008 26095

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!