Sputter and multi-source - caburn-mdc europe

Thin film deposition
Sputter and
multi-source
Featuring
One One
vacuum vacuum
seal
■ One vacuum seal
■ Small profile
■ Adjustable anode height
■ No mechanical target clamp
■ No water to vacuum seal
■ Magnets isolated from water
■ HV and UHV versions
■ DC/RF operation
■ Balanced/unbalanced
configuration
■ Options: Flex mount/shuttered
/in-situ motion
■ Custom multi-source flanges
Sizes: 33mm 1.3” 50mm 2” 75mm 3” 100mm 4” 150mm 6”
www.mdcvacuum.co.uk

3
The history of MAK ® Sputter sources
Since the 1980’s MeiVac’s US
Components Division has
acquired multiple exclusive
manufacturing and distribution
licenses for patented planar
magnetron sputter sources from two
prominent Silicon Valley research
laboratories.
With over 6,000 of these sources
delivered worldwide, the US
Components Division has become
known as a leading manufacturer of
sputter deposition sources, substrate
heaters and and associated
hardware. Introduced in the 1990’s,
one of the sources, the MAK®, rapidly
became a standard in the industry.
Noted for its simplicity, ease of use
and resulting high reliability, the
MAK® source has been designed to
present the smallest profile possible
and deliver higher deposition rates
than comparable sputter sources.
Because of its popularity, the
MAK® source has been used in
the development of many of
today’s thin film processes.
The MAK® source is produced at
MeiVac’s San Jose, California,
USA facility.

Sputter sources and multi-source
Sputter sources and multi-source
Uniformity distribution 2-3
Sputter source technical features 4
33mm 1.3” MAK ® 5
50mm 2” MAK ® 6
75mm 3” MAK ® 7
100mm 4” MAK ® 8
150mm 6” MAK ® 9
Flex mount 10
Multi-source 11
Substrate heaters 12-13
United MDC Vacuum Limited France MDC Vacuum Products Sarl Germany Tel: +49 (0)2305 947 508
Kingdom Tel: +44 (0)1825 280 450 Tel: +33 (0)437 65 17 50 Tel: +49 (0)2305 947 508
Fax: +44 (0)1825 280 440 Fax: +33 (0)437 65 17 55 Fax: +49 (0)2305 947 510
sales@mdcvacuum.co.uk info@mdcvacuum.fr sales@mdcvacuum.de
Italy Kenosistec Srl Holland Evatec Process Systems BV Russian MSH Technology Limited
Tel: +39 02 9055200 Tel: +31 343 595 470 Federation Tel: +7 (495) 543 60 25
Fax: +31 343 592 294 Fax: +31 343 592 294 Fax: +7 (495) 722 12 90
infocaburn@kenosistec.it sales@mdcvacuum.nl shive@msht.ru

2
MAK ® Sputter sources
The sputtering process
Sputtering, which is a physical
vapour deposition (PVD)
coating technique, is a
common method of
depositing both metal layers
and insulating layers on a
substrate. The layers being
deposited can be elements
such as Cu, Au, etc., alloys such
as AlCu, NiFe, etc. or insulators
such as SiO2, TiN, etc.
Principles of
sputtering
Ions
Electrons
Target atoms
Argon atoms
Growing
film
Typically, a substrate (the item
to be coated) is placed in a
vacuum chamber opposite a target (made of the
material being sputtered). The chamber is
evacuated and then backfilled with a process
gas (argon). The gas is ionized with a
positive charge which creates plasma.
Resulting ions are strongly attracted
to the target, which carries a
negative charge. The effect is
a physical process similar to
the interaction of billiard balls
in a confined space. As the relatively large
argon ions impact on the target,
atoms/molecules of target material
are physically removed from the
target. Due to its close
proximity, a majority of the
sputtered atoms/molecules
land on the target. The intent
is for this material to arrive at
the substrate with enough
energy to form a thin,
strongly attracted
film, one
monolayer at
a time.
Uniformity
Uniformity is
heavily dependant on
source to substrate
distance and the
relationship between
source and substrate
diameters
All dimensions are nominal in millimetres unless specified.
B Field
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E Field
Legend
Material removed by
ion bombardment
Sputter sources and multi-source
Target (cathode)
negative high voltage
Planar magnetron
sputtering
In conventional diode
sputtering, electrons are
created that escape the
effective plasma area near the
target. Some fly around the
chamber creating undesirable
side effects, such as heating
the tooling. A magnetron
sputtering source addresses
the electron problem by
placing magnets behind, and
sometimes at the sides of the
target. These magnets capture
the escaping electrons and
confine them to the
immediate vicinity of the
target. This increases the ion current (density of
ionized argon atoms hitting the target) by a factor of 10 over
conventional diode targets, resulting in faster deposition rates
at lower pressures, which help to produce cleaner films.
Film properties
Magnetic
field lines
Captured
electrons
Deposition rate, film structure and layer uniformity
of deposition materials are highly dependent on:
■ Sputter efficiency of the material
■ Deposition power level
■ Source of substrate distance
■ Process gas
■ Substrate temperature
■ Target erosion
■ Position of anode
■ Process pressure
■ Power type (RF or DC)
■ Angle of incidence
■ Target magnetic permeability
■ Configuration of source
■ Balance of magnetic fields
Source to Rate Wafer Wafer Cu Watts
MAK ® substrate Å/min diameter Typical diameter Typical target @
model distance copper mm uniformity mm uniformity thickness 5 mTorr
33
50
75
100
150
Cross section of a planar magnetron
Details of typical rates and uniformity performances
50.8 1,750
±7%
±20%
50.8
76.2
76.2 975 ±5% ±12%
50.8 6,200
±6%
±16%
50.8
76.2
76.2 2,800 ±3% ±10%
76.2 10,000
±5%
±15%
50.8
101.6
101.6 5,600 ±3% ±10%
101.6 6,470
±5%
±7%
76.2
101.6
152.4 2,900 ±2% ±3%
101.6 12,900
±4%
±12%
101.6
152.4
152.4 5,800 ±2% ±7%
4.7 200
6.35 500
12.7 1000
12.7 2000
12.7 3000

Sputter sources and multi-source
Uniformity of sputtered materials across the
diameter of a substrate as a function of target
Uniformity distribution
Relative rates Cu = 1.0
size and source to substrate distance. Under identical power and geometric conditions
A
N
G
S
T
R
Angstroms
O
M
S
A
N
G
S
T
R
Angstroms
O
M
S
A
N
G
S
T
R
Angstroms
O
M
S
A
N
G
S
T
R
Angstroms
O
M
S
A
N
G
S
T
R
Angstroms
O
M
S
Working distance
50.8
76.2
1,510
1,180
760
Working distance
50.8
76.2
5,550
4,445
2,295
Working distance
76.2
101.6
9,100
7,300
4,650
Working distance
101.6
152.4
6,070
5,840
2,750
Working distance
101.6
152.4
12,200
10,225
5000
885
2,620
5,230
2,780
5500
1,750
76.2 25.4
0
25.4 38.1
MAK
mm
® 1.3” Source
38.1 25.4
0
25.4 38.1
MAK
mm
® 2” Source
50.8 25.4
0
25.4 50.8
MAK
mm
® 3” Source
6,470
50.8 38.1
0
38.1 50.8
MAK
mm
® 4” Source
12,900
5800
6,090
12,180
5520
5,830
10,150
5050
76.2 50.8
0
50.8 76.2
MAK
mm
® 6” Source
975
6,200
2,800
10,000
5,600
2,900
1.520
890
5,580
2,630
9,135
5,210
2,780
1,195
720
4,475
2,270
7,320
4,620
2,715
target materials will sputter at different rates.
The table provides relative rates for common
elements and compounds where copper is 1.00.
Ag 2.06
Al 0.73
Al203 0.15
Au 1.76
Be 0.22
Bi 10.00
C 0.05
CdS1010 2.39
CdTe 0.64
Co 0.58
Cr 0.60
Cu 1.00
Dy 1.18
Er 1.00
Fe 0.56
GaAs(110) 1.70
Gd 1.17
Ge 1.05
Glass 0.23
Hf 0.67
Ir 0.61
Mg 0.26
Mgf 0.03
Mn 0.99
Mo 0.53
Nb 0.44
Ni 0.65
Os 0.5
Pb 3.52
Pd 1.31
Pt 0.9
Rb 4.55
Re 0.53
Rh 0.74
Ru 0.66
Sb 3.68
Si 0.39
SiC 0.36
SiO 0.27
SiO2 0.45
Sm 1.14
Sn 1.38
Ta 0.43
Th 0.84
Ti 0.38
U 0.73
V 0.38
W 0.39
Y 0.95
Zr 0.65
All dimensions are nominal in millimetres unless specified.
Telephone +44 (0)1825 280 450 www.mdcvacuum.co.uk
3

4
Sputter source
Introduction
MAK ® Sputter sources
Target is retained by the magnet structure with a simple
keeper. Target exchange is accomplished in moments
without disassembly.
MAK ® sources are designed to overcome limitations
commonly found in other sources:
Features
■ Water channel is not part of the high voltage path
■ Magnets are not in the water channel
■ Target change does not require source disassembly
■ Only one vacuum seal and no water to vacuum seals
■ Target requires no clamping or bonding to cathode
■ Magnetic materials may be sputtered with the standard
magnetic assembly in most applications
■ Operates in DC or RF modes
■ Process pressures 0.5 – 600 m Torr
■ Adjustable anode, improves uniformity, prevents build up
and shadowing
■ HV or UHV designs
Magnetron configuration
MDC Vacuum Limited offers a number of options to assist in
achieving desired results. The standard model MAK ® source is
mounted on a 300mm (12˝) long support with a position
clamp included. Water and power are contained at
atmospheric pressure within this support. A 19mm/0.75˝
quick coupler vacuum feedthrough is required to integrate
the source in the vacuum system and position it at the
correct source to substrate distance.
Standard mount
101.6 with
manual linear
adjustment
Right angle
50.8 –
manually
adjustable
Flex mount angular
50.8 – manually
adjustable
All dimensions are nominal in millimetres unless specified.
Telephone +44 (0)1825 280 450 www.mdcvacuum.co.uk
50mm
Flange
mounted
Target
Cathode
(cooling
surface)
Magnet
return
Sputter sources and multi-source
Cathode
Water line
Optional sources and features
AIN
insulator
Cooling
block
Keeper
Magnets
Anode
Power feedthrough
■ Gas injection, to deliver process gas directly to the area of
the target, reducing residual gas interaction with the
sputtering process
■ Right angle flex mount, 0-45 degree angular adjustment
■ Low profile, through wall
■ Externally adjustable ‘in-situ’ angular and linear sources
■ RF and DC power supplies and RF matching networks
■ Custom tailored flange mounted packages
■ Flange type and mount geometry specified by customer
■ Shutters and shielding
■ Rotary motion feedthrough

Sputter sources and multi-source
Specifications
Source dimensions 33mm (1.3”) MAK ®
Vertical size 113mm
Outside diameter 38mm
Mounting
Flange DN63CF / 4.5 OD” (min)
Feedthrough 19mm quick coupler
Target specifications
Target diameter 33mm
Target thickness (maximum) 5.7mm
Target mounting Magnetic
Magnetic materials Yes
Magnet design
Type Nd/Fe B
Configuration Balanced
Operation specifications
DC Max power 350W
RF Max power 200W
Cathode voltage (volts) 200-1000V
Discharge current (max amps) 1.00A
Operating pressure (mtorr) 0.5-600
Cooling water
Flow rate 0.6 gpm
Conductivity No requirement
33mm 1.3” typical rates and uniformity performance
Working Uniformity
distance Rate A/min 50.8 dia. 76.2 dia.
50.8 1,750 ±7% ±20%
76.2 975 ±5% ±12%
33.0mm diameter 4.7 thick Cu target 3000W @ 5 mTorr
A
N
G
S
T
R
Angstroms
O
M
S
Working distance
50.8
76.2
1,510
1,180
760
885
1,750
975
1.520
1,195
76.2 25.4
0
mm
25.4 38.1
890
720
33mm 1.3” MAK ®
Description
Source
Vertical
Horizontal
Options
33mm 1.3” MAK ®
113.0
Flange mounting options
DN100CF
DN160CF
Accessories
Ø19.1
UHV
Flex mount
Non-standard mounting tube length*
38.1
Thermal paste (15gm)
Quick disconnect for 25.4 (1”) baseplate
Quick disconnect for DN40KF
Quick disconnect for DN40CF
Quick coupler feedthrough on DN63CF
Quick coupler feedthrough on DN100CF
* Please advise tube length
Reference
Fixed
anode
Ø56.8
305mm
standard
custom
lengths
available
MAK-130-V
MAK-130-H
UHV
FM2
NSL
CF100KIT
CF160KIT
TP-832
DBF-75
K40XDS-75
FDS-75
QC-833-450
QC-833-600
HN
connector
Part
number €
2701000
2701001
-331
-332
-333
2701105
2701104
2700600
650005
734027
412008
2703100
27003101
2627
2801
3234
2945
POA
POA
POA
72
294
90
116
488
565
All dimensions are nominal in millimetres unless specified.
Telephone +44 (0)1825 280 450 www.mdcvacuum.co.uk
5

6
A
N
G
S
T
R
Angstroms
O
M
S
Working distance
50.8
76.2
5,550
4,445
2,295
50mm 2” MAK ®
Specifications
Source dimensions 50mm (2”) MAK ®
Vertical size 99mm
Outside diameter 59mm
Mounting
Flange DN63CF / 4.5” OD (min)
Feedthrough 19 quick coupler
Target specifications
Target diameter 51mm
Target thickness (maximum) 7.9mm
Target mounting Magnetic
Magnetic materials Yes
Magnet design
Type Nd/Fe B
Configuration Balanced/Unbalanced
Operation specifications
DC Max power 1000W
RF Max power 400W
Cathode voltage (volts) 200-1000V
Discharge current (max amps) 3A
Operating pressure (mtorr) 0.5-600
Cooling water
Flow rate 0.8 gpm
Conductivity No requirement
50mm 2” typical rates and uniformity performance
Working Uniformity
distance Rate A/min 50.8 dia. 76.2 dia.
50.8 6200 ±6% ±16%
76 2800 ±3% ±10%
50.8mm diameter 6.35 thick Cu target 3000W @ 5 mTorr
2,620
6,200
2,800
5,580
2,630
38.1 25.4
0
mm
25.4 38.1
All dimensions are nominal in millimetres unless specified.
4,475
2,270
Telephone +44 (0)1825 280 450 www.mdcvacuum.co.uk
50mm 2” MAK ®
Description
Source
Vertical
Horizontal
Options
Accessories
Sputter sources and multi-source
99.3
Ø19.1
UHV
Flex mount
Non-standard mounting tube length*
Ø59.2
Thermal paste (15gm)
Quick disconnect for 25.4 (1”) baseplate
Quick disconnect for DN40KF
Quick disconnect for DN40CF
Quick coupler feedthrough on DN63CF
Quick coupler feedthrough on DN100CF
* Please advise tube length
Reference
Anode height
adjustable to
target thickness
Ø38.1
305mm
standard
custom
lengths
available
MAK-200-V
MAK-200-H
UHV
FM2
NSL
TP-832
DBF-75
K40XDS-75
FDS-75
QC-833-450
QC-833-600
HN
connector
Part
number €
2701002
2701003
-331
-332
-333
2700600
650005
734027
412008
2703100
27003101
2627
2801
3234
2945
POA
72
294
90
116
488
565

Sputter sources and multi-source
Specifications
Source dimensions 75mm (3”) MAK ®
Vertical size 110mm
Outside diameter 86mm
Mounting
Flange DN100CF / 6” OD (min)
Feedthrough 19mm quick coupler
Target specifications
Target diameter 76.2mm
Target thickness (maximum) 15.9mm
Target mounting Magnetic
Magnetic materials Yes
Magnet design
Type Nd/Fe B
Configuration Balanced/Unbalanced
Operation specifications
DC Max power 2000W
RF Max power 750W
Cathode voltage (volts) 200-1000V
Discharge current (max amps) 5A
Operating pressure (mtorr) 0.5-600
Cooling water
Flow rate 0.8 gpm
Conductivity No requirement
75mm 3” typical rates and uniformity performance
Working Uniformity
distance Rate A/min 50.8 dia. 101.6 dia.
76.2 10,000 ±5% ±15%
101.6 5,600 ±3% ±10%
76.2mm diameter 12.7 thick Cu target 3000W @ 5 mTorr
A
N
G
S
T
R
Angstroms
O
M
S
Working distance
76.2
101.6
9,100
7,300
4,650
5,230
10,000
5,600
9,135
5,210
7,320
4,620
50.8 25.4
0
mm
25.4 50.8
75mm 3” MAK ®
110.5
75mm 3” MAK ®
Description
Source
Vertical
Horizontal
Options
Accessories
Ø19.1
UHV
Flex mount
Non-standard mounting tube length*
Ø85.9
Thermal paste (15gm)
Quick disconnect for 25.4 (1”) baseplate
Quick disconnect for DN40KF
Quick disconnect for DN40CF
Quick coupler feedthrough on DN63CF
Quick coupler feedthrough on DN100CF
* Please advise tube length
Reference
MAK-300-V
MAK-300-H
UHV
FM2
NSL
TP-832
DBF-75
K40XDS-75
FDS-75
QC-833-450
QC-833-600
Anode height
adjustable to
target thickness
Ø57.2
305mm
standard
custom
lengths
available
HN
connector
Part
number €
2703000
2703001
-331
-332
-333
2700600
650005
734027
412008
2703100
27003101
3133
3422
3802
3560
POA
72
294
90
116
488
565
All dimensions are nominal in millimetres unless specified.
Telephone +44 (0)1825 280 450 www.mdcvacuum.co.uk
7

8
A
N
G
S
T
R
Angstroms
O
M
S
Working distance
101.6
152.4
6,070
5,840
2,750
101mm 4” MAK ®
Specifications
Source dimensions 100mm (4”) MAK ®
Vertical size 117mm
Outside diameter 113mm
Mounting
Flange DN160CF / 8” OD (min)
Feedthrough 19mm quick coupler
Target specifications
Target diameter 102mm
Target thickness (maximum) 19.1mm
Target mounting Magnetic
Magnetic materials Yes
Magnet design
Type Nd/Fe B
Configuration Balanced/Unbalanced
Operation specifications
DC Max power 3000W
RF Max power 1200W
Cathode voltage (volts) 200-1000V
Discharge current (max amps) 7A
Operating pressure (mtorr) 0.5-600
Cooling water
Flow rate 1.0 gpm
Conductivity No requirement
100mm 4” typical rates and uniformity performance
Working Uniformity
distance Rate A/min 76.2 dia. 101.6 dia.
101.6 6,480 ±5% ±7%
152.4 2,900 ±2% ±3%
101.6mm diameter 12.7 thick Cu target 3000W @ 5 mTorr
2,780
6,470
2,900
6,090
2,780
50.8 38.1
0
mm
38.1 50.8
All dimensions are nominal in millimetres unless specified.
5,830
2,715
Telephone +44 (0)1825 280 450 www.mdcvacuum.co.uk
116.8
75mm 4” MAK ®
Description
Source
Vertical
Horizontal
Options
Accessories
Sputter sources and multi-source
Ø19.1
UHV
Flex mount
Non-standard mounting tube length*
113.0
Thermal paste (15gm)
Quick disconnect for 25.4 (1”) baseplate
Quick disconnect for DN40KF
Quick disconnect for DN40CF
Quick coupler feedthrough on DN63CF
Quick coupler feedthrough on DN100CF
* Please advise tube length
Reference
MAK-400-V
MAK-400-H
UHV
FM2
NSL
TP-832
DBF-75
K40XDS-75
FDS-75
QC-833-450
QC-833-600
305mm
standard
custom
lengths
available
Anode
height
adjustable
to target
thickness
Ø57.2
HN
connector
Part
number €
2703005
2703006
-331
-332
-333
2700600
650005
734027
412008
2703100
27003101
4043
4523
4764
4523
POA
72
294
90
116
488
565

Sputter sources and multi-source
Specifications
Source dimensions 152mm (6”) MAK ®
Vertical size 171mm
Outside diameter 166mm
Mounting
Flange DN200CF / 10” OD (min)
Feedthrough 32mm quick coupler
Target specifications
Target diameter 152.4mm
Target thickness (maximum) 25.4mm
Target mounting Magnetic
Magnetic materials Yes
Magnet design
Type Nd/Fe B
Configuration Balanced/Unbalanced
Operation specifications
DC Max power 6000W
RF Max power 2000W
Cathode voltage (volts) 200-1000V
Discharge current (max amps) 10A
Operating pressure (mtorr) 0.5-600
Cooling water
Flow rate 2.0 gpm
Conductivity No requirement
150mm 6” typical rates and uniformity performance
Working Uniformity
distance Rate A/min 101.6 dia. 152.4 dia.
101.6 13,000 ±4% ±12%
152.4 5,800 ±2% ±7%
152.4mm diameter 12.7 thick Cu target 3000W @ 5 mTorr
A
N
G
S
T
R
Angstroms
O
M
S
Working distance
101.6
152.4
12,200
10,225
5000
5500
12,900
5800
12,180
5520
10,150
5050
76.2 50.8
0
mm
50.8 76.2
171.5
152mm 6” MAK ®
Ø114.3
150mm 6” MAK ®
Description
Source
Vertical
Options
Accessories
Ø19.1
UHV
Flex mount
Non-standard mounting tube length*
166.4
Thermal paste (15gm)
Quick disconnect for 25.4 (1”) baseplate
Quick disconnect for DN40KF
Quick disconnect for DN40CF
Quick coupler feedthrough on DN63CF
Quick coupler feedthrough on DN100CF
* Please advise tube length
Reference
MAK-600-V
UHV
FM2
NSL
TP-832
DBF-75
K40XDS-75
FDS-75
QC-833-450
QC-833-600
305mm
standard
custom
lengths
available
HN
connector
Anode
height
adjustable
to target
thickness
Part
number €
2703004 6728
-331
-332
-333
2700600
650005
734027
412008
2703100
27003101
7690
POA
POA
72
294
90
116
488
565
All dimensions are nominal in millimetres unless specified.
Telephone +44 (0)1825 280 450 www.mdcvacuum.co.uk
9

10
MAK ® Flex mount
Options
The flex mount feedthrough allows for angular adjustment to
the MAK’s sputtering attitude. Use of a welded formed
bellows and special support bracket, any angle from 0 to 30°
is firmly held in place. Power is applied thru a coaxial cable;
thus assuring RF continuity.
In-situ linear movement features
■ Provides target to substrate distance change without
breaking vacuum
■ Adaptable to 33mm (1.3”) thru 102mm (4”) MAK ®
■ 25 – 152mm linear travel
■ Welded bellows
■ Bakeable to 120°C
■ UHV Compatible
203.2 CF
85.7 CF
Bellows
50.8 source
Ø19.1
Ø19.1 quick couple
for support only
152.4 extension
All dimensions are nominal in millimetres unless specified.
Telephone +44 (0)1825 280 450 www.mdcvacuum.co.uk
Magnet array
Sputter sources and multi-source
View
rotated 90°
157
218
305mm standard
custom lengths
available
Performance adaptability
The single piece cathode assembly permits change of the
magnetic structure without disassembly of the MAK ® .
Performance requirements from excellent uniformity, with
good target utilization to – high rates, with maximum target
thickness is achieved. The magnetic array is field changeable.
Magnetic material sputtering
Direct attachment to the active cathode, without use of a
magnetic housing, provides a small free space between
target and magnets. This places a stronger magnetic flux at
the target surface allowing sputtering of magnetic material
as standard.
In-situ, externally
adjustable (under vacuum)
linear 76mm or angular
76mm

Sputter sources and multi-source
Multi-source design examples
Project/process specific
custom packages including
■ Sources:
■ Standard with linear adjustment
■ Flexmount internally adjustable
angular
■ In-situ externally adjustable linear
■ In-situ externally adjustable angular
■ Shutters
■ Shields
■ Gas injection
■ 33.0, 50.8, 76.2, 101.6, 152.4 sources
(1.3” 2” 3” 4” 6”)
■ Two or more guns on a flange
■ 203.2 – 609.6 (8”–24”) CF, ISO, ANSI
Custom multi-source
assembly with shutters
■ 3 x 50.8 sputtering sources
■ Shown with fixed flange to target
distance
■ Customer specified source angle
■ Shown mounted on metal seal
ConFlat ® DN160CF flange
■ 2 x sources shown with targets and
one without target
■ With optional non-cross deposition
shields
■ Includes shutters
RF Power supplies,
matching networks
■ 300W, 600W, 1000W RF
■ CE marked
■ Programmable
■ Air cooled
■ RS-232 / 485
■ RF DC voltage control
Multi-source
DC Power supplies
■ 500W, 1KW, 1.5KW, 2.5KW, 5KW
■ Pulsed DC available with 5KW
■ Arc suppression circuitry
■ Some CE marked configurations
available
■ Regulation in power, voltage, and
current modes
Custom multi-source assembly with shutters
All dimensions are nominal in millimetres unless specified.
Telephone +44 (0)1825 280 450 www.mdcvacuum.co.uk
11

12
Features
■ UHV Compatible
■ 0 2 Compatible
■ Electrical bias capability
Substrate heaters
SU-400-NC wafer heater block
Heaters are configured for two general types of
application, samples and wafers
■ Sample blocks may be drilled and tapped for sample holding clips
Note this per customer specification at an additional charge
■ Sample blocks are made of Haynes metal and must be prebaked at
atmosphere by the customer at or exceeding the desired operating
temperature prior to use
■ Haynes metal heater blocks are compatible with silver thermal paste, which
is sold as an accessory
■ Wafer blocks are Inconel metal and are wafer size specific
■ Wafer pockets are machined into the surface of the heater
■ Inconel is not compatible with silver thermal paste.
■ Unprecedented temperature uniformity
Applications
■ Sputtering
■ Laser ablation
■ Ion beam deposition
■ ERC, MOCVD and others
All dimensions are nominal in millimetres unless specified.
Telephone +44 (0)1825 280 450 www.mdcvacuum.co.uk
Sputter sources and multi-source
SU-300-HH sample heater block
Optional accessories
Deluxe feedthrough and mounting stand
■ Adjustable mounting bracket with X, Y, Z
movement
■ 2 x type S thermocouple leads
■ 2 x power pins
■ Mounted on a DN40CF, DN63CF or
DN100CF rotatable
Hook-up kit
■ Type S thermocouple 457mm leadwire
■ 2 x 1.27mm OFHC copper power leads
457mm long
■ Ceramic tubes and beads for insulation
and protection from plasma

Sputter sources and multi-source
Part number
Reference
Stage type
Size in mm
Dimensions in mm
A
B
C
D
E
Maximum temperature
Temperature uniformity
Area of uniformity
Temperature reliability
Ramp time to 950°C
Cool down time
Maximum current
Maximum voltage
Input power
Heater resistance
Heater material
A
D
B
E
C
Substrate heaters
Description
Details
Substrate heaters
See details of typical rates /uniformity performances below
See details of typical rates/uniformity performances below
See details of typical rates/uniformity performances below
See details of typical rates/uniformity performances below
See details of typical rates/uniformity performances below
Tapped hole
Reference
SU-200HH
SU-200IH
SU-300HH
SU-400IH
SU-600IH
Part
number
2706002
2706003
2706004
2706005
2706006
See details of typical rates/uniformity performances below TH
-335
Accessories
Mounting feedthrough DN40CF
Mounting feedthrough DN63CF
Mounting feedthrough DN100CF
Hook up kit ‘K’ TC wire
Hook up kit ‘S’ TC wire
Deluxe mounting feedthrough DN40CF
Deluxe mounting feedthrough DN63CF
Deluxe mounting feedthrough DN100CF
Details of typical rates and uniformity performances
SU-905-C40
SU-905-C63
SU-905-C100
SU-918-K
SU-918-S
SU-925-C40
SU-925-C63
SU-925-C100
2706103
2706104
2706105
2706108
2706109
2706111
2706112
2706113
2706002 2706003 2706004 2706005 2706006
SU-200HH SU-200IH SU-300HH SU-400IH SU-600IH
Sample Wafer Sample Wafer Wafer
50.8 50.8 76.2 101.6 152.4
Refer to sketches Refer to sketches Refer to sketches Refer to sketches Refer to sketches
63.5 76.2 88.9 127 171.5
84.6 88.4 97.3 142.2 187.5
60.2 60.2 60.2 83.8 83.8
53.8 66.5 66.5 76.2 76.2
35.1 35.1 35.1 58.4 58.4
950°C 950°C 950°C 950°C 950°C
+/–1% +/–1% +/–1% +/–2% +/–2%
Centre 31.8 dia. 50.8 dia. Centre 57.2 dia. 101.6 dia. 152.4 dia.
12°C 12°C 12°C 13°C 13°C
12 minutes 12 minutes 13 minutes 22 minutes 30 minutes
35 minutes 35 minutes 40 minutes 3 hours 4 hours
10A 10A 9A 14A 14A
45V 45V 85V 85V 135V
AC/DC AC/DC AC/DC AC/DC AC/DC
5 ohms 5 ohms 10 ohms 6 ohms 10 ohms
Haynes Inconel Haynes Inconel Inconel
All dimensions are nominal in millimetres unless specified.
Telephone +44 (0)1825 280 450 www.mdcvacuum.co.uk
€
3003
3003
3794
7182
9235
308
508
950
1022
164
452
1817
1817
1858
13

Sputter and multi-source
www.mdcvacuum.co.uk
United Kingdom
MDC Vacuum Limited
Tel: +44 (0)1825 280 450
Fax: +44 (0)1825 280 440
sales@mdcvacuum.co.uk
France
MDC Vacuum Products Sarl
Tel: +33 (0)437 65 17 50
Fax: +33 (0)437 65 17 55
info@mdcvacuum.fr
Germany
Tel: +49 (0)2305 947 508
Tel: +49 (0)4931 930 5245
Fax: +49 (0)2305 947 510
sales@mdcvacuum.de
Holland
Evatec Process Systems BV
Tel: +31 343 595 470
Fax: +31 343 592 294
sales@mdcvacuum.nl
Italy
Kenosistec Srl
Tel: +39 02 9055200
Fax: +39 02 9052984
infocaburn@kenosistec.it
Thin film deposition
■ Flanges and fittings
■ Gate, inline and
angle valves
■ Roughing
components
■ Vacuum
measurement
■ Viewports and
glass components
■ Feedthroughs:
electrical and
optical
■ Motion and
manipulation
■ Thin film
deposition
■ Chambers
■ Custom
engineering
Reserve your copy of our
extensive vacuum components
catalogue on our website.
Russian Federation
MSH Technology Limited
Tel: +7 (495) 543 60 25
Fax: +7 (495) 722 12 90
shive@msht.ru