DISSERTATION
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______________________________________________________________________ Introduction<br />
Figure 1.1. Self-assembly on an electrode surface.<br />
In the beginning of the self-assembly process, while the density of molecules at the surface is<br />
small, molecules either form a disordered mass or an ordered lying phase at the surface 1 (Figure<br />
1.2, a). When the density increases, molecules start forming ordered three-dimensional<br />
structures. Even though the Au-S bond is reasonably strong, the adsorbed thiols can still move<br />
around on the electrode to heal gaps of exposed gold 12 . This so-called healing process occurs<br />
in a second phase, where thiols slowly reorganize and order on the surface 13-15 (Figure 1.2, b).<br />
Various parameters affect alkylthiol SAM formation such as the architecture and cleanliness of<br />
the gold surface, temperature, thiol concentration, functional groups and solvent composition.<br />
Commonly, organic solvents such as ethanol or DMSO are used for adsorption of alkylthiols<br />
on gold.<br />
Preparation of SAMs is standardly performed by immersing a gold substrate into an alkylthiol<br />
solution. Thus, the adsorption occurs at open circuit potential (OCP) and the kinetics of the<br />
adsorption roughly follows the Langmuir adsorption curve 1,9 . According to the Langmuir<br />
kinetic model, the rate of adsorption is proportional to the free space on the surface:<br />
dθ<br />
dt = k(1 − θ) (1.3)<br />
where θ is the partial coverage and k is the rate constant. Nevertheless, this model makes strong<br />
assumptions such as the homogeneity of the surface (perfectly flat surface) and the absence of<br />
interactions between adjacent molecules. In reality, surface roughness of polycrystalline gold<br />
and thiol island formation affect the SAM formation kinetics.<br />
1.1 Thiol self-assembling 4