Deliverables and Services - IHP Microelectronics
Deliverables and Services - IHP Microelectronics
Deliverables and Services - IHP Microelectronics
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(83) Optimum Activation <strong>and</strong> diffusion with a<br />
Combination of Spike <strong>and</strong> Flash Annealing<br />
S. paul, W. lerch, S. McCoy, J. Gelpey, <strong>and</strong><br />
D. Bolze<br />
International Workshop on InSIGHt in Semiconductor<br />
Device Fabrication, Metrology, <strong>and</strong><br />
Modeling (InSIGHt-2007), embassy Suites,<br />
napa, May 06-09, 2007, uSA<br />
(84) An Efficient Polynomial Multiplier in<br />
GF(2m) <strong>and</strong> its Application to ECC designs<br />
S. peter, p. langendörfer<br />
Design Automation & test in europe 2007<br />
(Date 07), nice, April 16-20, 2007, France<br />
(85) Flexible Hardware Reduction for Elliptic<br />
Curve Cryptography in GF (2m)<br />
S. peter, p. langendörfer, K. piotrowski<br />
Design Automation & test in europe 2007<br />
(Date 07), nice, April 16-20, 2007, France<br />
(86) On Concealed data Aggregation for<br />
wireless Sensor Networks<br />
S. peter, p. langendörfer, K. piotrowski<br />
Ieee Consumer Communications <strong>and</strong> networking<br />
Conference (CCnC 2007), las Vegas,<br />
January 11-13, 2007, uSA<br />
(87) A Synchronization Scheme for OFdM-based<br />
60 GHz wPANs<br />
M. piz, e. Grass<br />
pIMRC 2007, Athens, September 03-07, 2007,<br />
Greece<br />
(88) Characterization of Silicon Nanostructures<br />
by Electrostatic Force Microscopy<br />
M. Ratzke, M. Birkholz, J. Bauer, D. Bolze,<br />
J. Reif<br />
e-MRS Spring Meeting, Strasbourg,<br />
May 28 - June 01, 2007, France<br />
V O R T R ä G E – P R E S E N T A T I O N S<br />
(89) Elektrische Charakterisierung von<br />
Halbleiterstrukturen mittels Electrostatic<br />
Force Microscopy<br />
M. Ratzke, M. Birkholz, J. Bauer, D. Bolze,<br />
J. Reif<br />
DpG Spring Meeting, Regensburg, March 26-<br />
30, 2007, Germany<br />
(90) Self-Organized Pattern Formation on<br />
Silicon Surfaces<br />
M. Reiche, M. Kittler, t. Wilhelm, W. Seifert,<br />
t. Arguirov, Y. Yu, o.F. Vyvenko, t. Mchedlidze<br />
2 nd Ieee International Conference on nano<br />
/ Micro engineered <strong>and</strong> Molecular Systems<br />
(neMS 2007), 16-19 January 2007, Bangkok,<br />
thail<strong>and</strong><br />
(91) Etch Stop Phenomena in deep Trench Silicon<br />
Plasma Etching for Sub 100 nm Technologies<br />
H.H. Richter, S. Günter, G. Weidner,<br />
S. Marschmeyer, H. Silz, I. Costina, K. Schulz,<br />
S. Berger<br />
DpG Frühjahrstagung, Düsseldorf,<br />
March 19-23, 2007, Germany<br />
(92) SiGe BiCMOS Technology with 3.0 ps Gate<br />
delay<br />
H. Rücker, B. Heinemann, R. Barth, J. Bauer,<br />
K. Blum, D. Bolze, J. Drews, A. Fox,<br />
o. Fursenko, t. Grabolla, u. Haak,<br />
W. Höppner, D. Knoll, K. Köpke, B. Kuck,<br />
A. Mai, S. Marschmeyer, t. Morgenstern,<br />
H.H. Richter, p. Schley, D. Schmidt, K. Schulz,<br />
B. tillack, G. Weidner, W. Winkler, D. Wolansky,<br />
H.-e. Wulf, Y. Yamamoto<br />
IeDM 2007, Washington, December 10-12,<br />
2007, uSA<br />
(93) 0.13µm SiGe:C BiCMOS development<br />
H.Rücker<br />
6 th Workshop High-performance SiGe BiCMoS<br />
for Wireless <strong>and</strong> Broadb<strong>and</strong> Communication,<br />
Frankfurt (oder), September 10, 2007,<br />
Germany<br />
A n n u A l R e p o R t 2 0 0 7
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