Deliverables and Services - IHP Microelectronics
Deliverables and Services - IHP Microelectronics
Deliverables and Services - IHP Microelectronics
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8 A n n u A l R e p o R t 2 0 0 9<br />
e r S C H I e N e N e p u B L I K A t I o N e N – p u B L I S H e d p A p e r S<br />
(18) An X-B<strong>and</strong> Low-power <strong>and</strong> Low-phase-<br />
Noise VCo using Bondwire Inductor<br />
K. Hu, F. Herzel, J.C. Scheytt<br />
Advances in Radio Science 7, 243 (2009)<br />
In this paper a low-power low-phase-noise voltagecontrolled-oscillator<br />
(VCo) has been designed <strong>and</strong> fabricated<br />
in 0.25 µm SiGe BiCMoS process. the resonator<br />
of the VCo is implemented with on-chip MIM capacitors<br />
<strong>and</strong> a single aluminum bondwire. A tail current filter is<br />
realized to suppress flicker noise up-conversion. the<br />
measured phase noise is -126.6 dBc / Hz at 1 MHz offset<br />
from a 7.8 GHz carrier. the figure of merit (FoM) of<br />
the VCo is -192.5 dBc / Hz <strong>and</strong> the VCo core consumes<br />
4 mA from a 3.3V power supply. to the best of our<br />
knowledge, this is the best FoM <strong>and</strong> the lowest phase<br />
noise for bondwire VCos in the X-b<strong>and</strong>. this VCo will be<br />
used for satellite communications.<br />
(19) eBIC / pL Investigations of dislocation<br />
Networks produced by Silicon wafer direct<br />
Bonding<br />
G. Jia, W. Seifert, t. Mchedlidze, t. Arguirov,<br />
M. Kittler, t. Wilhelm, M. Reiche<br />
Superlattices <strong>and</strong> Microstructures 45, 314<br />
(2009)<br />
Dislocation networks (Dns) formed by silicon wafer<br />
bonding were studied by means of electron Beam Induced<br />
Current (eBIC) <strong>and</strong> photoluminescence (pl).<br />
the measurements were performed on p–n junction<br />
diode structures prepared by ion implantation. eBIC<br />
signal was observed not only inside the diode structure,<br />
but also far outside the diode area. this finding<br />
demonstrates the ability of the bonding interface to<br />
efficiently collect minority carriers <strong>and</strong> indicates a<br />
high electrical conductivity of the dislocation network.<br />
In addition, circular inhomogeneities of charge<br />
collection were observed. the contrast of those regions<br />
was bright at high beam energies <strong>and</strong> turned dark<br />
or vanished at lower energies. the contrast behavior<br />
of the circular areas can be explained by local variations<br />
of collection efficiency <strong>and</strong> recombination at<br />
the Dn, which might be a result of different density of<br />
oxide precipitates. pl mappings at 0.794 <strong>and</strong> 1.081 eV<br />
revealed similar circular areas.<br />
(20) Advances in the underst<strong>and</strong>ing of oxide<br />
precipitate Nucleation in Silicon<br />
G. Kissinger, D. Kot, V.D. Akhmetov, A. Sattler,<br />
t. Müller, W. von Ammon<br />
eCS transactions 18, 995 (2009)<br />
the influence of vacancy supersaturation installed<br />
by RtA pre-treatments in CZ silicon wafers on oxide<br />
precipitate nucleation was investigated in the temperature<br />
range 700-1000 °C. precipitation is enhanced<br />
at 800 °C <strong>and</strong> increases with increasing vacancy<br />
concentration. Getter efficiency tests for Cu <strong>and</strong> ni<br />
have shown that the threshold value of the normalized<br />
inner surface is shifting to higher values for increasing<br />
RtA temperature. this can be explained by a<br />
morphological change of the oxide precipitates with<br />
increasing vacancy concentration from plate-like to<br />
spherical shape.<br />
(21) preface<br />
G. Kissinger<br />
Materials Science <strong>and</strong> engineering B<br />
159-160, 1 (2009)<br />
(22) dislocations to be used as Active<br />
Components in Novel Silicon devices<br />
M. Kittler, M. Reiche<br />
Advanced engineering Materials 11(4), 249<br />
(2009)<br />
the electrical <strong>and</strong> optical properties of dislocations<br />
in Si are reviewed, namely dislocation-related recombination<br />
<strong>and</strong> luminescence, transport of minority <strong>and</strong><br />
majority carriers along dislocations or the electric<br />
field around dislocations. It is shown that Si wafer<br />
direct bonding allows well-controlled formation of<br />
dislocation networks, giving rise to adjustable dislocation<br />
properties. Ideas for novel Si devices utilizing<br />
dislocations as active components are presented. In<br />
particular, dislocation-based light emitters at about<br />
1.5 µm wavelength are demonstrated. Concepts for<br />
dislocation-based conductive channels <strong>and</strong> fast Fets,<br />
manipulators of biomolecules or thermo-electric generators<br />
are sketched.