Deliverables and Services - IHP Microelectronics
Deliverables and Services - IHP Microelectronics
Deliverables and Services - IHP Microelectronics
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
(107) A 0.13 µm SiGe BiCMoS technology for<br />
mm-wave Mixed-Signal Applications<br />
H. Rücker, B. Heinemann, A. Mai, B. tillack<br />
proc. Ieee 16 th International Conference<br />
on Mixed Design of Integrated Circuits <strong>and</strong><br />
Systems (Mixdes), 19 (2009)<br />
(108) A 0.13 µm SiGe BiCMoS technology<br />
Featuring f t / f max of 240 / 330 GHz <strong>and</strong><br />
Gate delays below 3ps<br />
H. Rücker, B. Heinemann, W. Winkler,<br />
R. Barth, J. Borngräber, J. Drews, G.G. Fischer,<br />
A. Fox, t. Grabolla, u. Haak, D. Knoll,<br />
F. Korndörfer, A. Mai, S. Marschmeyer,<br />
p. Schley, D. Schmidt, J. Schmidt, K. Schulz,<br />
B. tillack, D. Wolansky, Y. Yamamoto<br />
proc. Ieee Bipolar / BiCMoS Circuits <strong>and</strong><br />
technology Meeting (BCtM), 166 (2009)<br />
(109) Micro-raman Mapping of residual Stresses<br />
in Multicrystalline Block Cast Silicon Solar<br />
Cell Material: their relation to the Grain<br />
Boundary Microstructure <strong>and</strong><br />
recombination Activity<br />
G. Sarau, M. Becker, S. Christiansen, M. Holla,<br />
W. Seifert<br />
proc. 24 th european Solar energy Conference,<br />
969 (2009)<br />
(110) Integrierter Frequenzagiler Synthesizer<br />
J.C. Scheytt, S. A. osmany, F. Herzel,<br />
G. Fischer, G. Kaminski, W. eckl, H. Schlesinger<br />
proc. 13. Statusseminar Mobile Kommunikation,<br />
(2009)<br />
(111) A 122 GHz receiver in SiGe technology<br />
K. Schmalz, W. Winkler, J. Borngäber,<br />
W. Debski, B. Heinemann, J.C. Scheytt<br />
proc. Ieee Bipolar / BiCMoS Circuits <strong>and</strong><br />
technology Meeting (BCtM), 182 (2009)<br />
00 A n n u A l R e p o R t 2 0 0 9<br />
e r S C H I e N e N e p u B L I K A t I o N e N – p u B L I S H e d p A p e r S<br />
(112) Fault-tolerant ASIC design for High System<br />
dependability<br />
G. Schoof<br />
Advanced Microsystems for Automotive<br />
Applications 2009 : Smart Systems for Safety,<br />
Sustainability, <strong>and</strong> Comfort / eds.: G. Meyer,<br />
J. Valldorf, W. Gessner, Berlin, Springer, 369<br />
(2009)<br />
(113) Single Crystalline oxide Heterostructures:<br />
A Flexible Buffer Approach for SiGe<br />
Integration on Si<br />
t. Schroeder, A. Giussani, p. Zaumseil,<br />
I. Costina, J. Dabrowski, o. Seifarth,<br />
H.-J. Müssig, p. Storck<br />
proc. 6 th International Conference on Silicon<br />
epitaxy <strong>and</strong> Heterostructures (ICSI-6), abstr.,<br />
147 (2009)<br />
(114) Fe / Cu precipitation at Si Nitride <strong>and</strong> Si<br />
Carbide particles in Intentionally<br />
Contaminated Block Cast Si<br />
W. Seifert, J. Bauer, A. erko, M. Holla,<br />
B. Gründig-Wendrock, M. Kittler, C. Knopf,<br />
G. Martinez-Criado, M. trushin, o. Vyvenko,<br />
I. Zizak<br />
proc. 3 rd International Workshop on<br />
Crystalline Si Solar Cells, 3, 40 / 1 (2009)<br />
(115) Architecture of an Analog Combining MIMo<br />
System Compliant to Ieee 802.11a<br />
Z. Stamenkovic, K. tittelbach-Helmrich,<br />
M. Krstic, J. perez, J. Via, J. Ibanez<br />
proc. ICt-Mobile Summit, (2009)<br />
(116) Combining Internal Scan Chains <strong>and</strong><br />
Boundary Scan register: A Case Study<br />
Z. Stamenkovic, M. Giles, F. Russi<br />
proc. Ieee Region 8 euRoCon International<br />
Conference, (2009)