SCHOTT Technical Glasses

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38 The material properties – especially the gas barrier properties – are by far superior to polymer films: Oxygen transmittance rate (cc/[m 2 · 24 hr]) ––> 100 10 1 0.1 0.01 30 µm ultra-thin glass (AF 32 ® eco) 100 µm PET 100 µm PEN 20 µm PVA 20 µm PVDC coated PET 0.001 10 –6 10 –5 10 –4 10 –3 10 –2 10 –1 1 10 100 1000 Water vapor transmittance rate (g/[m 2 · 24 hr]) ––> Sample inspection of a thin glass wafer after processing Fig. 31. Gas barrier properties of ultra-thin glass 8.4 Thin glass processing Further material properties of the ultra-thin glass types which are available either on roll or as cut-to-size sheets property D 263 T eco AF 32 ® eco CTE 7.2 ppm/K 3.2 ppm/K alkaline content low no transformation point 557 °C 715 °C refractive index 1.5231 1.5255 transmission λ = 550 nm, d = 1 MHz dielectric constant (at 1 MHz and 20 °C) loss tangent (tan δ) (at 1 MHz and 20 °C) thermal conductivity (90 °C) 91.7 % 91.9 % 6.7 5.1 0.0061 0.0009 1.06 W/(m · K) 1.06 W/(m · K) glass type borosilicate alumin-borosilicate Table 7. Technical data of relevant materials SCHOTT offers an entire portfolio of technologies for processing of thin glass, e.g. • Cut-to-size for a wide range of wafer and substrate sizes • Surface refinement by polishing and/or coating • Structuring of holes or cavities • Edge treatment options • Ultrasonic washing • Clean room packaging SCHOTT thin glass from a down-draw process does not require any polishing for typical wafer applications due to its inherently pristine surface quality, low roughness and excellent geometry like low total thickness variation. Wafers are directly CNC cut from the mothersheet. Depending on customer requirements, only edge grinding and ultrasonic washing are subsequent processing steps. These wafers are used in high volumes as semiconductor cover glass in wafer level packaging processes of CMOS image sensors for camera modules.
39 Powder Blasting shape ØB A ØC Hole A: hole angle (based on B and C) B: inlet diameter C: outlet diameter Glass Thickness US-Lapping shape Hole Glass Thickness Cavity by Powder Blasting Glass Thickness Structured glass wafer Radius at the edges Applications of structured glass wafers and substrates with holes and cavities are in the electronics industry, e.g. for MEMS capping wafers and in the biotech industry, e.g. for flow cells for blood analysis. The two major technologies currently applied by SCHOTT for structuring and their technical capabilities are: For processing of ultra-thin glass, new laser-based processes are under design to cut the glass but also to generate a high number of holes with diameters around 50 microns as TGVs (through glass vias) in printed circuit board and interposer applications. Ultrasonic lapping Powder blasting Size 100 mm to 200 mm Max. 400 mm x 400 mm Thickness range 0.4 mm up to 3 mm 0.05 mm up to 3 mm Different hole configurations Positioning tolerances Min. hole diameter Round holes * Tighter tolerances upon request ± 65 µm* ± 65 µm* 0.4 mm 0.1 mm Round, rectangular holes and caverns 8 Table 8. Structured technologies and technical capabilities Flow cell for DNA analysis, structured into SCHOTT thin glass TGV technology with SCHOTT AF 32 ® eco 100 µm ultra-thin glass processed by excimer laser at 193 nm wavelength
Page 1 and 2: Technical Glasses Physical and Tech
Page 3 and 4: 3 Foreword Apart from its applicati
Page 5 and 6: 5 7.4 PYRAN ® , PYRANOVA ® , NOVO
Page 7 and 8: 7 1 behavior, are characteristic fe
Page 9 and 10: 9 Weight loss after 3 h in mg/100 c
Page 11 and 12: 11 Surface test method B (at 121 °
Page 13 and 14: 13 Because even highly resistant ma
Page 15 and 16: 15 in the glass after 15 min of ann
Page 17 and 18: 17 a superimposed tensile stress ke
Page 19 and 20: 19 700 600 4210 Glass ΔI/I ∙ 10
Page 21 and 22: 21 lg ρ in Ω ⋅ cm --> Temperatu
Page 23 and 24: 23 Several glasses, especially glas
Page 25 and 26: 25 The transmittance τ d at perpen
Page 27 and 28: 27 Internal transmittance --> 0.99
Page 29 and 30: 29 Its thermal properties coupled w
Page 31 and 32: 31 FIOLAX ® clear, 8412 This glass
Page 33 and 34: 33 7.1 AMIRAN ® SCHOTT AMIRAN ® -
Page 35 and 36: 35 Fragmentation test for a tempere
Page 37: 37 Down-draw Molten glass Roller In
Page 41 and 42: 41 Applications of CONTURAN ® : Pu
Page 43 and 44: 43 8 Applications of CONTURAN ® Da
Page 45 and 46: I 45 Metal (α 20/300 in 10 -6 /K)
Page 47 and 48: 47 9 Glass-to-metal sealed housings
Page 49 and 50: 49 α (20/300) [10 -6 K -1 ] Design
Page 51 and 52: 51 9.2 Glass and glass-ceramic seal
Page 53 and 54: 53 9.4 Solder glasses Solder glasse
Page 55 and 56: 55 aggressive environments (e.g. ac
Page 57 and 58: 57 Leadcontaining Type Main applica
Page 59 and 60: 59 crystallization in the glass, th
Page 61 and 62: 61 and unique solution, particularl
Page 63 and 64: 63 11 Optical filter glass
Page 65 and 66: 65 i-line glass ZnS FLIR Zinc Sulfi
Page 67 and 68: 67 8650 Alkali-free sealing glass f
Page 69 and 70: 69 Sealing Glasses 9 10 11 12 13 14
Page 71 and 72: 71 9 10 11 12 13 14 15 16 Heat cond
Page 73 and 74: 73 Your Contacts Advanced Optics SC
Page 75 and 76: 75

SCHOTT Technical Glasses

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