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HCI / NBTI - Celestry Design Technologies, Inc.

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Step 2: Reliability Model Options<br />

Option 1: Aged Model<br />

The Aged model is simply an extension<br />

of the traditional SPICE model for <strong>HCI</strong>.<br />

Here is how it works: After calculating<br />

the "age" of each individual device in<br />

your circuit, Aged model parameters<br />

are automatically generated for the<br />

degraded devices.<br />

RelXpert also has options to limit the number of SPICE models generated to optimize<br />

simulation time with accuracy.<br />

Option 2: AgeMOS Model<br />

The AgeMOS model from <strong>Celestry</strong> is a new<br />

reliability analysis method for <strong>HCI</strong> and <strong>NBTI</strong><br />

circuit reliability simulation. AgeMOS is<br />

transparent to any MOS SPICE model and<br />

compatible with any simulator platform. The<br />

AgeMOS model is a significant improvement<br />

over other reliability models in the areas of<br />

model generation and accurate, efficient, and<br />

consistent circuit simulation. (Addtional<br />

AgeMOS model information, see section on<br />

"More on Built-in Reliability with the AgeMOS<br />

Model"<br />

Here is how it works: RelPro+ will allow you to take stress data, BSIMPro+ extracts the fresh<br />

and AgeMOS models for <strong>HCI</strong> and <strong>NBTI</strong>. RelXpert, the circuit level simulator, will allow you to<br />

analyze the circuit and view the results.<br />

More on Built-in Reliability with the AgeMOS Model<br />

<strong>Celestry</strong>'s AgeMOS model is a methodology for deep submicron CMOS reliability modeling<br />

and circuit simulation analysis. Using this methodology, IC manufacturers can provide a<br />

universal model to all of their IC design customers without SPICE model or simulator platform<br />

compatibility issues. The AgeMOS model for <strong>HCI</strong> and <strong>NBTI</strong> enables designers to do accurate<br />

and efficient reliability simulation analysis. This ensures optimal trade-off between yield and<br />

performance before product tape out. <strong>HCI</strong> and <strong>NBTI</strong> reliability analysis with the AgeMOS<br />

model prevents unnecessary reliability issues. <strong>Design</strong>ers can create designs and design<br />

shrinks that are more aggressive without overly pessimistic design guard bands and<br />

unnecessary silicon loss.<br />

RelXpert<br />

4

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