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Histopathology of Seed-Borne Infections - Applied Research Center ...

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8.4 Survival in <strong>Seed</strong> ...........................................................................................2428.5 Concluding Remarks....................................................................................244References..............................................................................................................244Chapter 9 Physiogenic or Nonpathogenic <strong>Seed</strong> Disorders ..............................2479.1 Mineral Nutrient Deficiency ........................................................................2499.1.1 Marsh Spot in Peas ..........................................................................2499.1.1.1 Histology...........................................................................2499.2 Humidity Effects ..........................................................................................2519.2.1 Low Humidity Effects......................................................................2519.2.1.1 Hollow Heart.....................................................................2519.2.1.2 Necrosis in Lettuce Cotyledons .......................................2559.2.1.3 Cracking <strong>of</strong> Cotyledons....................................................2559.2.2 High Humidity Effects.....................................................................2579.3 Concluding Remarks....................................................................................257References..............................................................................................................258Chapter 10 Microtechniques in <strong>Seed</strong> <strong>Histopathology</strong>......................................26110.1 Choice <strong>of</strong> Material .......................................................................................26110.2 Determination <strong>of</strong> the Identity <strong>of</strong> Internal Mycelium ..................................26210.2.1 Procedure for Component Plating ...................................................26210.3 <strong>Seed</strong> S<strong>of</strong>tening .............................................................................................26210.4 Histological Methods ...................................................................................26310.4.1 Whole-Mount Method......................................................................26310.4.2 Freehand Sections ............................................................................26410.4.3 Microtomy........................................................................................26410.4.3.1 Fixing and Storage............................................................26410.4.3.2 Dehydration.......................................................................26410.4.3.3 Infiltration .........................................................................26510.4.3.4 Embedding ........................................................................26510.4.3.5 S<strong>of</strong>tening <strong>of</strong> Embedded Material .....................................26510.4.3.6 Sectioning and Mounting <strong>of</strong> Ribbons ..............................26510.4.3.7 Staining and Mounting .....................................................26610.5 Procedures for Preparing Some Reagents and Stains .................................26610.5.1 Fixative.............................................................................................26610.5.2 Adhesives .........................................................................................26610.5.3 Mounting Media...............................................................................26710.5.3.1 Aqueous Mounting Media................................................26710.5.3.2 Nonaqueous Mounting Media ..........................................26810.5.4 Stains ................................................................................................268References..............................................................................................................269Index......................................................................................................................271

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