Microtensile bond strength of a filled vs unfilled adhesive to dentin ...

Microtensile bond strength of a filled vs unfilled adhesive to dentin ... Microtensile bond strength of a filled vs unfilled adhesive to dentin ...

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286 Table 3 Mean microtensile bond strength to dentin using One-Step Plus and One-Step adhesives with total and self-etch technique. Type of adhesive Technique MeanGsd Filled (One-Step Plus) Total-etch 38.8G12.2 a (nZ20) Filled (One-Step Plus) Self-etch 22.4G4 b (nZ20) Unfilled (One-Step) Total-etch 33.9G8.5 a (nZ20) Unfilled (One-Step) Self-etch 26.4G7.5 b (nZ20) Different superscript letters indicate significant differences by two-way ANOVA and post hoc Tukey’s test (p!0.05). Japan) and polished using wet silicon carbide abrasive papers and diamond pastes of decreasing abrasiveness to 0,25 mm (DP-Paste, P, Streuers A/S, Copenhagen, Denmark). They were then subjected to argon ion etching (EIS-1E, Elionix Ltd, Tokyo, Japan) for 5 min with a constant voltage of 1 kV and ion current density of 0.2 mA/cm 2 , with the ion beam directed 908 to the specimen surface, 22 gold-sputter coated and observed using a scanning electron microscope (JSM 5400; JEOL Ltd, Tokyo, Japan). Four additional non-carious third molars (one per group) were used for SEM examination of the resin-dentin interfaces to serial acid-base treatment resistance. The specimens were prepared as in the above mentioned manner and polished. They were then subjected to 10% phosphoric acid treatment for 3–5 s 23 followed by 5% sodium hypochloride immersion for 5 min. 24 After being extensively rinsed, the specimens were dried gold-sputter coated and observed using a scanning electron microscope (JSM 6335F; JEOL Ltd, Tokyo, Japan). Results Two-way ANOVA showed that the mTBS results (Table 3) were significantly influenced by the technique (pZ0.000) but not by the type of adhesive (pZ0.836). The interaction of these two factors was significant (pZ0.025), indicating that the differences that existed between two techniques (total-etch and self-etch) were not dependent on the type of adhesive. Multiple comparisons (post hoc Tukey’s test) revealed that total-etch technique exhibited significantly higher bond strength values than the selfetch technique with both filled (pZ0.000) and unfilled adhesives (pZ0.031). The mTBS of the filled adhesive One-Step Plus (38.8G12.2 MPa) and the unfilled adhesive One-Step (33.9G8.5 MPa) were not significantly different when they were used with the total etch (pZ0.298), and with the self-etch E. Can Say et al. technique (22.4G4.0 and 26.4G7.5 MPa, respectively) (pZ0.459). SEM observations of the resin-dentin interfaces revealed that the thickness of the hybrid layers Figure 1 (A) Scanning electron micrograph of the resin– dentin interface bonded with One-Step Plus with totaletch technique after argon ion etching. Hybrid layer was 3 mm thick. Fillers were uniformly dispersed in the adhesive layer and were evident around the tubuler orifices and in the tubules (arrow). c, composite; fa, filled adhesive; h, hybrid layer; d, dentin. (B) Scanning electron micrograph of the resin–dentin interface bonded with One-Step Plus with total-etch technique subjected to sequential acid–base treatment. Hybrid layer was approximately 3 mm thick and resin-tags (arrow) penetrating into dentinal tubules were clearly observed. Adhesive layer was 17 mm thick. c, composite; fa, filled adhesive; h, hybrid layer; d, dentin.

Microtensile bond strength of adhesive to dentin using self-etch and total-etch technique 287 Figure 2 (A) Scanning electron micrograph of the resin– dentin interface bonded with One-Step Plus with selfetch technique after argon ion etching. Thickness of the hybrid layer (3.5 mm) was similar to the One-Step Plus total-etch group (Fig. 1(A) and (B)) and the adhesive layer was 10 mm thick. c, composite; fa, filled adhesive; h, hybrid layer; d, dentin. (B) Scanning electron micrograph of the resin–dentin interface bonded with One-Step Plus with self-etch technique subjected to sequential acid–base treatment. Thickness of the hybrid layer (3.5 mm) and the adhesive layer (17 mm) were similar to the One-Step Plus total-etch group (Fig. 1(B)). Resin penetration into dentinal tubules were observed (arrow) c, composite; fa, filled adhesive; h, hybrid layer; d, dentin; g, gap induced between hybrid layer and adhesive. created with the filled One-Step Plus and the unfilled One-Step adhesives using the total-etch technique were approximately 3 mm (Figs. 1(A) and (B), 3(A) and (B)), and when using self-etch technique, the hybrid layers of both adhesives were also a similar thickness of 3.5 mm (Figs. 2(A) and (B), 4(A) and (B)). The adhesive layers achieved with the filled adhesive One-Step Plus both with total-etch and self-etch techniques were thicker (12–17 and 10–17 mm, respectively; Figs. 1(A) and (B), 2(A) and (B)) than the unfilled adhesive One- Step (2 mm) (Figs. 3(A) and (B), 4(A)). Fillers were Figure 3 (A) Scanning electron micrograph of the resin– dentin interface bonded with One-Step with total-etch technique after argon ion etching. The hybrid layer was 3 mm thick and the adhesive layer was 2 mm thick. Adhesive layer (a) created with the unfilled adhesive was very thin (compare Fig. 1(A) and (B)). c, composite; h, hybrid layer; d, dentin. (B) Scanning electron micrograph of the resin–dentin interface bonded with One-Step with total-etch technique subjected to sequential acid–base treatment. The hybrid layer was 3 mm thick and the adhesive layer was only 2 mm thick. Resin-tags (arrow) were penetrated deeply into dentinal tubules. Adhesive layer (a) created with the unfilled adhesive was very thin (compare Fig. 1(A) and (B)). c, composite, h, hybrid layer, d, dentin. uniformly dispersed in the adhesive layers (Figs. 1(A) and (B), 2(A)) and were evident around the tubular orifices and into some dentin tubules (Fig. 1(A)) with the total-etch technique. Failure modes of the specimens in various groups are shown in Table 4. SEM of the representative debonded specimens are shown in Figs. 5–8. Chi-squared analysis revealed that One-Step Plus self-etch group, which provided the lowest mTBS among the all groups, was significantly different from the other groups (p!0.05) and 85% of the specimens showed

<strong>Microtensile</strong> <strong>bond</strong> <strong>strength</strong> <strong>of</strong> <strong>adhesive</strong> <strong>to</strong> <strong>dentin</strong> using self-etch and <strong>to</strong>tal-etch technique 287<br />

Figure 2 (A) Scanning electron micrograph <strong>of</strong> the resin–<br />

<strong>dentin</strong> interface <strong>bond</strong>ed with One-Step Plus with selfetch<br />

technique after argon ion etching. Thickness <strong>of</strong> the<br />

hybrid layer (3.5 mm) was similar <strong>to</strong> the One-Step Plus<br />

<strong>to</strong>tal-etch group (Fig. 1(A) and (B)) and the <strong>adhesive</strong><br />

layer was 10 mm thick. c, composite; fa, <strong>filled</strong> <strong>adhesive</strong>;<br />

h, hybrid layer; d, <strong>dentin</strong>. (B) Scanning electron<br />

micrograph <strong>of</strong> the resin–<strong>dentin</strong> interface <strong>bond</strong>ed with<br />

One-Step Plus with self-etch technique subjected <strong>to</strong><br />

sequential acid–base treatment. Thickness <strong>of</strong> the hybrid<br />

layer (3.5 mm) and the <strong>adhesive</strong> layer (17 mm) were<br />

similar <strong>to</strong> the One-Step Plus <strong>to</strong>tal-etch group (Fig. 1(B)).<br />

Resin penetration in<strong>to</strong> <strong>dentin</strong>al tubules were observed<br />

(arrow) c, composite; fa, <strong>filled</strong> <strong>adhesive</strong>; h, hybrid layer;<br />

d, <strong>dentin</strong>; g, gap induced between hybrid layer and<br />

<strong>adhesive</strong>.<br />

created with the <strong>filled</strong> One-Step Plus and the<br />

un<strong>filled</strong> One-Step <strong>adhesive</strong>s using the <strong>to</strong>tal-etch<br />

technique were approximately 3 mm (Figs. 1(A) and<br />

(B), 3(A) and (B)), and when using self-etch<br />

technique, the hybrid layers <strong>of</strong> both <strong>adhesive</strong>s<br />

were also a similar thickness <strong>of</strong> 3.5 mm (Figs. 2(A)<br />

and (B), 4(A) and (B)). The <strong>adhesive</strong> layers achieved<br />

with the <strong>filled</strong> <strong>adhesive</strong> One-Step Plus both with<br />

<strong>to</strong>tal-etch and self-etch techniques were thicker<br />

(12–17 and 10–17 mm, respectively; Figs. 1(A) and<br />

(B), 2(A) and (B)) than the un<strong>filled</strong> <strong>adhesive</strong> One-<br />

Step (2 mm) (Figs. 3(A) and (B), 4(A)). Fillers were<br />

Figure 3 (A) Scanning electron micrograph <strong>of</strong> the resin–<br />

<strong>dentin</strong> interface <strong>bond</strong>ed with One-Step with <strong>to</strong>tal-etch<br />

technique after argon ion etching. The hybrid layer was<br />

3 mm thick and the <strong>adhesive</strong> layer was 2 mm thick.<br />

Adhesive layer (a) created with the un<strong>filled</strong> <strong>adhesive</strong><br />

was very thin (compare Fig. 1(A) and (B)). c, composite;<br />

h, hybrid layer; d, <strong>dentin</strong>. (B) Scanning electron<br />

micrograph <strong>of</strong> the resin–<strong>dentin</strong> interface <strong>bond</strong>ed with<br />

One-Step with <strong>to</strong>tal-etch technique subjected <strong>to</strong> sequential<br />

acid–base treatment. The hybrid layer was 3 mm thick<br />

and the <strong>adhesive</strong> layer was only 2 mm thick. Resin-tags<br />

(arrow) were penetrated deeply in<strong>to</strong> <strong>dentin</strong>al tubules.<br />

Adhesive layer (a) created with the un<strong>filled</strong> <strong>adhesive</strong><br />

was very thin (compare Fig. 1(A) and (B)). c, composite,<br />

h, hybrid layer, d, <strong>dentin</strong>.<br />

uniformly dispersed in the <strong>adhesive</strong> layers (Figs.<br />

1(A) and (B), 2(A)) and were evident around the<br />

tubular orifices and in<strong>to</strong> some <strong>dentin</strong> tubules<br />

(Fig. 1(A)) with the <strong>to</strong>tal-etch technique.<br />

Failure modes <strong>of</strong> the specimens in various<br />

groups are shown in Table 4. SEM <strong>of</strong> the<br />

representative de<strong>bond</strong>ed specimens are shown<br />

in Figs. 5–8. Chi-squared analysis revealed that<br />

One-Step Plus self-etch group, which provided<br />

the lowest mTBS among the all groups, was<br />

significantly different from the other groups<br />

(p!0.05) and 85% <strong>of</strong> the specimens showed

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