Regulatory Marking of Boards & Components for a Pb-Free ... - SMTA

Regulatory Marking of Boards& Components for a Pb-FreeWorldSteve Greathouse(Retired Intel Corporation)President - Greathouse Consulting SolutionsHillsboro, OregonOctober, 2007SMTAI Conference – Orlando, FL

Agenda:• Purpose• Industry Specs• Board & Component Marking• Board & Box Labels• Marking Matrix• Actions2

The History of Lead RemovalRoman Cities – Used Water pipes, cooking pots, and storagecontainers made from lead. Some experts say this contributedto the downfall of Roman Empire. (Source of Low Alpha Lead) (Plumbism - Pb )– Elimination of lead through the years in the US:• Cosmetics – Removal began 1890’s - 1960’s• Household Paint – initiated in 1971- deadline 1978.• Cooking utensils & food storage items – 1979-83.• Lead-free Gasoline – 1973 trough the 1980’s.• Fishing weights, hunting ammunition – 1980 & mid 1990’s.• Solder in copper water pipes – 1990 - mid 2000’s.– And now:• Electronic components and systems – 2004 - 2007Beethoven3

Enviromental Issues Worldwide:The fast growing electronics industry is a sign of China’s wealth, but italso is a source of pollution that must be fixed. We can t afford to pileup mountains of toxic junk.- Li Qiaofeng , Executive Director, China National Resources Development Holdings Qiaofeng,China is the worlds biggest growth country:• #1 consumer of grain, meat, coal and steel• #2 consumer of oilHowever, China is an “Environmental Nightmare”.• China has 5 of the worlds 10 most polluted cities.• Acid rain is falling on 1/3 of country.• 25% of citizens lack access to clean drinking water.• The World Health Organization has found that about 750,000 people dieprematurely each year from respiratory problems in China.– Air pollution from China is falling on Oregon and Washington coastlines.- Much of the particulate pollution over Los Angeles originates in China,according to the Journal of Geophysical Research.4

Electronic Waste in ChinaSo Why China RoHS?5

Electronic Waste in China6

Electronic Wastes in China & India:Women salvagingcomponents fromcircuit boards.7

Exponential Increase in Targeted Substances+4 Elements+45 Elements(Potential)11 Elements= 1980s new elements= 1990s new elements= 2000s new elementsCourtesy Julian LageardAs soon as scientific evidence is available…the prohibition of otherhazardous substances…should be examined – RoHS Directive8

Industry Specs Referenced JEDEC – JESD97, May 2004: Marking, Symbols, and Labelsfor Identification of Lead (Pb) free Assemblies,Components, and Devices. IPC-1066, June 2004: Marking, Symbols, and Labels foridentification of Lead-Free and other reportable materials,in Lead-Free assemblies, Components, and Devices. Joint Standard J-STD-609 combines both the JESD-97and the IPC-1066 into one spec.Released – published (May 2007) www.jedec.org (Free download) www.ipc.org(Free download).JAPAN SPEC: JEITA ETR-7021, June 2004: Guidance for the Lead-freeMarking of Materials, Components and Mounted Boardsused in Electronic and Electric Equipment9

ROHS and WEEE DirectivesThe European Union's Restriction on Hazardous Substances (RoHS),includes a ban on lead in electronics that begun on July 1, 2006.WEEE – (Waste Electrical and Electronic Equipment) is the writtenDirective No 2002/96/EC of the European Parliament.• The WEEE restrictions are necessary to reduce the wastemanagement problems linked to the heavy metals and flameretardants found in ground water.========================================WEEE Take Back Policy:The WEEE directive encourages and sets criteria for the collection,treatment, recycling and recovery of WEEE.• It basically says: If you make it, you have to set up asystem to take it back and recycle, reuse, ordispose of it.10

ROHS Isn’t Just To Remove Lead:ROHS lists the following substancesSubstance Level by Weight:• Lead 0.1%• Mercury 0.1%• Cadmium 0.01%• Hexavalent Chromium 0.1%• Polybrominated biphenyls (PBBs) 0.1%• Polybrominated diphenyl ethers (PBDEs) 0.1%• Most components are controlled within the same range as Pb.11

Logo’s That Were Being Used By Other CompaniesNationalSemiconductor's logoE = Environmentally FriendlySamsungSony12

Eliminating the Lead in ComponentsFlip-ChipBumpFlip-Chip Array(FC-PGA/LGA)High LeadBumpsocketCapacitorsLeadX^RoHS ExemptLGALandsFlip-Chip Ball Grid Array(FC-BGA)Flip-ChipBumpHigh LeadBumps^RoHS ExemptCapacitorsLeadXPrinted CircuitBoardROHS exemption for 1 st levelinterconnect bumps with>85% lead contentSolderBallsLead13XWire bonded deviceThis slidecontains builds

JEDEC Lead Free MarkingIdentification of Interconnect Material Differences2 nd Level Interconnect Materials – for packages and boards.Proposed Marke0e1e2e3Categorization and Material TypeBoard contains leadSnAgCu (any mixture) This is not included incategory e2.Sn alloys with no Bismuth or Zinc (excludesSnAgCu): (i.e. SnCu, SnAg, SnAgCuXTin Plate (all forms)e4Precious Metals: Ag, Au, NiPd, NiPdAu (no Sn)e5Zinc containing: SnZn, SnZnx (no Bi)e6e7Contains any BismuthLow Temperature solder (

Pb-free Board Markings- Bare Board Surface FinishBare Board Surface Finish Categories: The following codesshall be used to describe the surface finish on the bare board(prior to assembly):b0b1b2contains lead, traditional SnPb, hot air level orsolder reflowtin copper, or tin silver copper HASLimmersion silverb3b4b5b6b7, b8, b9tin (electrolytic or immersion)contains gold (immersion or electrolytic), ENIG,NiAuscreened carbonOSP (organic solderability preservatives)unassignedNOTE: The absence of a “b” code indicates bare copper with no surface finish.15

Pb-free Board Markings- Halogen Free Marking Halogen Free marking: If the base materials used in making the bare printed boards are halogenfree,the label/marking “HF” shall be noted on the bare printed circuit board. If no “HF is present, a halogen containing base resin and reinforcementmatrix are assumed.• Halogen Free• IEC 61249-2-21: defines halogen free• 900 ppm maximum chlorine• 900 ppm maximum bromine• 1500 ppm maximum total halogensHFHalogen Free markFurther details at:www.halogenfree.ipc.orgwww.ipc.org/3.0_Industry/3.4_EHS/2007/IPCCommentsToEPEAT043007.pdf16

Intel Pb-Free Component MarkingQFP 28x28aaQFP 10x10bdfcegQFP 7x7Marking location on package:– lower right of package or on bottom line.17

Board Marking Sequence UpdateHalogenFreeHFb4BoardFinishe1SMTSoldere2e7WaveSolderLow TempSolder-If used.Rationale:The sequence of marks onthe board is in the orderthat the board was built -starting from the bareboard material (b4), SMT,Wave Solder, then lowtemp materials.Pb-free category marking sequence should be as follows:First position on the board specifies if the board is Halogen Free.Second position: shows incoming PCB surface finish.Third position: specifies Surface Mount Technology (SMT) solder pastecategory.Fourth position: specifies wave solder category, for example (e2) =Tin/silver.Fifth position: specifies if any low temperature solder was used on theboard.18

Board Marking Locations19Courtesy of Intel Corporation:

Pb-free Board Markings– Mark PlacementThe guideline is that the marks be placed:1. On the lower right-hand corner of the board - if you are lookinginto the chassis from the top.2. On any easily read surface visible when the cover is open.3. If board is covered (ie. a film enclosure, etc), then the easiest toremove area should expose the board marking.4. Where possible, the board should NOT require removal from thechassis to determine if it is Pb-Free.1 stposition2 ndposition3 rdposition20

Pb-free Board Board Markings- Marking Completely Lead Free ProductsFor products that are completely free of lead as defined by RoHS(.1% or

Pb-free Board Board Markings- For Boards That Contain Some Lead.Lead-free requirement is to label boards with the Pb-free 2LI logowhich indicates the board meets RoHS lead requirements. RoHS leadexemptions (i.e., Flip chips, Ceramic capacitors, etc) allow lead in the firstlevel interconnect.CAD Library:• Pb-Free on board silk (Identifies board assembly has < 0.1% lead) –• 2 nd LVL INTCT on board silk (Identifies brd Pb-free at the 2 nd levelinterconnect) –Preferred Mark: –- CAD Symbol* “2LI” allowed forlimited spaceproductsSorry, the initials “SLI” as an acronym cannot be used.“Trademark of Nvidia”22

Showing Compliance Through DocumentationAT LEAST TWO DIFFERENT DOCUMENTS ARE REQUIRED TO SHOWCOMPLIANCE TO RoHS DIRECTIVE:1. Supplier DocumentationAlso called – S-DoC affirmationsRequired for every vendor on every part2. Grind Test Lab Results- Required for every product23

Showing Compliance Through DocumentationEvery component used in a product must have an S-DoC• This includes Managed and Unmanaged components• Each S-DoC must include valid exemptions: (example)• S-DoC’s are available from each component supplier:BOM scrub required for every sku verifying SDoC’s• Every product family must have a Material Declaration Data Sheet(MDDS) – preferably available on your companies web site –available for download.– Includes a grind test– Includes a listing of all the claimed exemptions within the product24

Pb-Free Certification Packaging MarkingPb-free certification markings on packaging must include the 2 nd levelinterconnect marking.Example of 10-pk box LabelExample of Retail Box Label25

Pb-Free Certification Packaging Marking•Component bag/box labelsShows finish category & max reflow temperature.26

Labeling Sustaining Boards (older product)For older boards that have beenin production, the new markingdirection will be followed byplacing “2Li” labels next to a Pbfreemark.• Pre-printed labels placed on theboard• Pre-printed labels placed on retailbox27

Chin ROHS Mark Requirements- Became Effective on March 1, 2007China Recycling MarkChina RoHS table of declarationFirst: No restricted substances2 nd : Any substances above MCV valueNote:• Orange color is recommended, black and white logo is acceptable.• Logo size should not be smaller than 5mm X 5mm.• Font of the number in Logo is Impact, and the ratio of its height to inner and outer diametersof the circle is 5:8:12.• 10: indicates EFUP (Environmental Friendly Use Period) in years for the electronic informationproducts. (Years when product will begin to leachout – not end of functional life).MCV = Maximum Concentration Value28

To Sell products in China:Beware: EU RoHS substance exemptions don’t apply in China.• Language: Chinese required• English optionalPhase 2: Substance Restrictions• Catalogue administration:• If your product is in it, you must comply.• Additional products to be added periodically with some notice.Pre Pre-Market Testing Requirement• To verify that no homogenous material exceeds MCV for restricted materials• Tested by one of 19 China Certified labs.Actions: Stay aware of updates in the phases of implementation:• Determine Environmental Friendly Use Period• Determine packaging content• Produce Tables & Documentation in Chinese29

Marking Matrix – Component ProductsItemComponentMarking(Clause 6)Mark LocationComponent body,topsideMarking or Labeling RequirementsRequired• Material category forcomponent terminalfinish or material.OptionalMaximumComponent BodytemperatureComponentContainer LabelLowest Levelshipping containerAND any “ESD”, DryPack, or other bag orbox within theshipping container•Material category forcomponent terminalfinish or material.•Maximum componentbody temperature•Pb-free symbol orphase “Pb-Free” (4.2)•2 nd level interconnectcomponent label (4.3)ESD BagsPre-printed on the bag•Appropriate Pb-freemarking is optional forboards which have markingon the board visible throughthe bagMarkingOptional30

Marking Matrix – Board ProductsItemPCB MarkingPCBAssembliesRetail salesbox (Prettybox)PCBAContainer label–Bulk BoxMark LocationTopside, lower righthandcorner or next topart./serial number orcompany logoTopside, lower righthandcorner or next topart./serial number orcompany logoOn the Barcode label orPre-printed on the box.Lowest Level containerholding the PCBA’s.Marking or Labeling RequirementsRequired•PCB surface finishcontaining lead (Pb) ifapplicable.•Halogen-free mark (HF)•Solders & Conformalcoating to be used byassembler•Mark with materialcategory for assemblysolder type(s) used inthe order of application(7.3)•Conformal coating ifany.•Appropriate Pb-freemarking Pb-free/2nd lvlintct, & Halogen-free markif applicable.•Mark or label with theinformation applicable tothe PCBA31Marking examplePb-Free symbolmarking or labelcannot be used ifany component isnot lead-free.

Product Certification Markings- Country Specific MarkingsRegionUSA/CanadaRegulatoryComplianceSafetyMarkingEuropeUSASafetyEMCEMCE210882CanadaTaiwanEMCEMCCANADA ICES-003 CLASS BD33025AustraliaNew ZealandKoreaEMCEMCN232CPU - (product code) (B)JapanEMCCountry of OriginExportingRequirementsMADE IN xxxxx (Provided by label, not silkscreen)32

Summary of Requirements for all Pb-freeproducts: All Pb-Free products need to be marked accordingly on thecomponent, board, bag, shipping box, and retail box.1. Follow spec J-STD-609 Spec requirements.Download a copy from:www.jedec.orgwww.ipc.org2. Marks for each country are required for sales into those countries– China has their own specifications.3. Grind tests are required to determine true Pb levels in product.4. Worldwide sales require conforming to world wide regulatory practices.5. Defense Supply Center Columbus (DSCC) position paper now proposes J-STD-609 as the commercial, aerospace, and military community marking standard.33

ReferencesReferences:Page: The Ira F. Brilliant Center for Beethoven Studieshttp://www.sjsu.edu/depts/beethoven/hair/hair.htmlBeethoven’s hair:http://www.sjsu.edu/depts/beethoven/hair/hairtestpc.htmlSpec Web site:www.jedec.org – for free download of J-STD-609 spec.www.ipc.org - for free download of J-STD-609 spec (temporarily)SMTA Web site archive:Presentation by Harvey Stone, “China ROHS, What we know & Don’t know.”34

Thanks for Your AttentionPlease feel free to contact us with any further questions:Steve Greathouse:Hillsboro, Oregon, 97123Contact Number (Phone) -503 372-5131Email: Greathouseconsulting@comcast.net35

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Legal direction on ROHS descriptionsHomogeneous Material:Means amaterial of uniform composition that cannotbe mechanically disjointed into differentmaterials (where “mechanically disjointed”means that materials can, in principle, beseparated by mechanical actions such asunscrewing, cutting, crushing, grinding, orabrasive processes).37