with SPI Print Optimizer Innovation - Circuitnet

For Release April 11, 2011Press and Reader Information Contact:André MynyErica CandelaKoh Young TechnologySpeedline Technologies, Inc.Tel: +31 650853144 Tel: +1‐508‐541‐4749Mail to: andre.myny@kohyoung.comMail to: ecandela@speedlinetech.comKoh Young, MPM/Speedline ‘Close the Loop’ with SPI Print OptimizerInnovationKoh Young Technology and MPM, a division of Speedline Technologies, Inc., announce the codevelopmentof a closed‐loop communications link between the MPM printer and a Koh Young SolderPaste Inspection (SPI) system that allows the two to automatically work together to optimize the solderpaste printing process.The product of this developmental partnership, theSPI Print Optimizer, brings the inspection systemand the printer together to not only identify defects(SPI system) but correct them (MPM printer). Thisprevents soldering defects downstream that resultin excess rework, productivity delays, and loweryields. The innovative product is the result of aclose collaboration between SPI and AOI inspectionleader Koh Young and global automated printingtechnology leader MPM/Speedline, workingtogether to build a better PCB assembly processwith fewer defects and higher quality and is the firstof its kind.Based on the measurements of the SPI system (after the print) communicated to the printer, the printersoftware automatically adjusts printing parameters to optimize the print process and mitigate the solderproblem that could result in defects. The SPI Print Optimizer works with all current MPM printers and KYSPI machines.Studies have shown that the majority of circuit assembly defects begin at the paste printing step. Byoptimizing and managing solder paste printing effectively, a customer can prevent costly defects,rework, and delays downstream. The SPI Print Optimizer establishes a closed‐loop communicationbetween the inspection system and the screen printer. It allows the process engineer to monitor andimprove the entire print process, rather than just a single parameter of the process.

In operation, SPI print offset measurements are sent directly to the printer for on‐the‐fly alignmentcorrection. Rejected boards from the SPI machine can trigger a pre‐programmed under‐stencil cleaningwipe action.The SPI Print Optimizer compensates for uncontrollable or difficult to control process variables, andachieves the desired print registration without manual process “tweaking”. It either eliminates orreduces operator intervention and errors, and stabilizes the print process.The SPI Print Optimizer is a powerful process optimization tool that is especially critical for lead‐free andminiature component attachment, where solder paste volume control is extremely important, and canbe used for process setup and fine tuning. Its overall contribution to PCB assembly is fewer solderingdefects, higher yields, less operator intervention, improved product reliability and improved overallprofitability.About Koh Young TechnologyKoh Young Technology, a leading provider of Solder Paste Inspection (SPI) and Automated OpticalInspection (AOI) systems, specializes in the design and manufacturing of 3D measurement andinspection equipment for the global circuit board assembly and semiconductor markets. Direct sales andsupport centers are located in the United States, Europe, Japan, Singapore, China (Shenzhen) and Korea.For more information about the company, visit www.kohyoung.com.About MPM/Speedline Technologies, Inc.MPM, a division of Speedline Technologies, Inc. provides a complete line of fully automated, highprecisionstencil printers that incorporate state‐of‐the‐art technology. MPM offers 12.5 micron @ 6sigma accuracy on every printer in the product line, an attribute that is unmatched in the industry.With a heritage of process knowledge and expertise, MPM has industry‐first technologies, includingAutomatic Pin Placement, look‐up/look‐down vision alignment, and closed‐loop print pressure control.Recent MPM innovations, including enclosed‐pump print head technology, texture‐based bridgeinspection and Gel‐Flex conformal tooling, minimize material consumption, improve product yield andmaximize printer uptime. For more information, visit http://www.speedlinetech.com/mpm.#####