Thermal Management (2.2MB .pdf - Darcoid

CUSTOMER RESPONSIBILITY!WARNING – USER RESPONSIBILITYFAILURE OR IMPROPER SELECTION OR IMPROPER USE OF THE PRODUCTS DESCRIBED HEREINOR RELATED ITEMS CAN CAUSE DEATH, PERSONAL INJURY AND PROPERTY DAMAGE.• This document and otherinformation from Parker-Hannifin Corporation, itssubsidiaries and authorizeddistributors provide productor system options for furtherinvestigation by users havingtechnical expertise.• The user, through its ownanalysis and testing, is solelyresponsible for making the finalselection of the system andcomponents and assuring thatall performance, endurance,maintenance, safety andwarning requirements of theapplication are met. The usermust analyze all aspects of theapplication, follow applicableindustry standards, and followthe information concerningthe product in the currentproduct catalog and in any othermaterials provided from Parkeror its subsidiaries or authorizeddistributors.• To the extent that Parker orits subsidiaries or authorizeddistributors provide componentor system options basedupon data or specificationsprovided by the user, the useris responsible for determiningthat such data and specificationsare suitable and sufficient forall applications and reasonablyforeseeable uses of thecomponents or systems.OFFER OF SALEThe items described in thisdocument are hereby offered forsale by Parker Hannifin Corporation,its subsidiaries or its authorizeddistributors. This offer andits acceptance are governed by theprovisions stated in the detailed“Offer of Sale” elsewhere in thisdocument or available atwww.chomerics.com orwww.parker.com.Chomerics

Thermal ManagementProducts & Custom Solutions CatalogCustomer Responsibility ...................................................................2Offer Of Sale ......................................................................................2Introduction .......................................................................................4Heat Transfer Fundamentals.............................................................6Gap Filler PadsTHERM-A-GAP HCS10, 569, 570, 579, 580, Thermal Pads..............11THERM-A-GAP 974, G974, 976, High Performance Thermal Pads..13THERM-A-GAP 575NS, Silicone-Free Thermal Pads .....................15Thermal GelsTHERM-A-GAP T63X Series, Dispensed Gels .................................16GEL 8010 Thermally Conductive Dispensable Gel............................18Phase Change MaterialTHERMFLOW ® Phase Change Pads.................................................. 20Attachment TapesTHERMATTACH ® Thermal Tapes.......................................................23Liquids (Compounds)THERM-A-FORM Cure-in-Place Potting and Underfill Materials....27Thermal GreaseThermal Greases.............................................................................29Insulator PadsCHO-THERM ® Commercial Grade ....................................................31CHO-THERM ® High Power ...............................................................33Heat SpreadersT-WING® and C-WING Thin Heat Spreaders.................................38Glossary ...................................................................................................40Safety Guide .............................................................................................43Terms of Sale ...........................................................................................51Chomerics3

ENGINEERING YOUR SUCCESS.INTRODUCTIONChomerics, a division of ParkerHannifin Corporation (NYSE:PH),is a global provider of EMI shieldingand thermal managementmaterials and services to OEM andCEM electronics companies in thetelecommunications, informationtechnology, consumer, power conversion,defense and transportationmarkets.Since 1961, Chomerics has beena leader in the development ofelectrically conductive elastomersfor use as extruded, molded andform-in-place EMI gaskets fortelecommunications and electronicsapplications. Chomerics offers anextensive family of thermal interfacematerials, which transfer heatfrom electronic components to heatsinks. Careful managementof thermal interfaces is crucial tomaintaining the reliability and extendingthe life of electronic devicesand equipment. As each new electronicproduct generation requireshigher power in smaller packages,the challenges associated withthermal management become moreintense. Thermal material driversinclude:• Lower thermal impedance• Higher thermal conductivity• Greater compliance andconformability• High reliability• Greater adhesion• Ease of handling, applicationand use• Long service lifeChomerics has a successfulhistory of providing thermal materialsexpertise and commitment todeveloping new, high performanceproducts to meet the thermalchallenges of systems designers.Chomerics products have beendesigned into thousands ofapplications and help assure theperformance, integrity, survivabilityand maintainability of communicationsequipment, radar, aircraft,computers, control systems,telecommunications, consumerdevices, automotive and industrialelectronics. Our customers aresupported with comprehensiveapplications engineering,supply chain and fabricationservices worldwide.Chomerics4

Chomerics Capabilities Include:THERMAL MANAGEMENT & CONTROL• Thermally conductive gap filler pads• Dispensed thermal gap fillers• Silicone-free thermal pads• Phase-change materials (PCM)• Polymer solder hybrids (PSH)• Dispensable thermal compounds• Thermal grease and gels• Insulator pads• Thin flexible heat spreaders• Custom integrated thermal/EMI assembliesEMI SHIELDING & COMPLIANCE• Conductive elastomers – molded, extruded, and form-in-place (FIP)• Conductive foam based gaskets – fabric-over-foam and z-axis foam• Conductive compounds – adhesives, sealants and caulks• RF and thermal/RF absorbing materials• EMI shielding plastics and injection molding services• Coatings – direct metallization and conductive paints• Metal gaskets – Springfingers, metal mesh and combination gaskets• Foil laminates and conductive tapes• EMI shielding vents – commercial and military honeycomb vents• Shielded optical windows• Cable shielding – ferrites and heat-shrink tubing/wire mesh tape/zippered cable shielding• Compliance and safety test servicesOPTICAL DISPLAY PRODUCTS• EMI shielding filters(conductive coating & wire mesh)• Ant-reflective/contrast enhancement filters• Plastic or glass laminations• Hard coated lens protectors• Touch screen lensesAbout Parker Hannifin CorporationWith annual sales exceeding $12 billion, Parker Hannifin is the world’s leading diversified manufacturerof motion and control technologies and systems, providing precision-engineered solutions fora wide variety of commercial, mobile, industrial and aerospace markets. The company employs morethan 61,000 people in 48 countries around the world. Parker has increased its annual dividends paid toshareholders for 52 consecutive years, among the top five longest-running dividend-increase recordsin the S&P 500 index. For more information, visit the company’s web site at http://www.parker.com, orits investor information site at http://www.phstock.com.Chomerics5

Heat Transfer FundamentalsIntroductionThe objective of thermalmanagement programs inelectronic packaging is theefficient removal of heat from thesemiconductor junction to theambient environment. This processcan be separated into three majorphases:1. heat transfer within thesemiconductor componentpackage;2. heat transfer from the packageto a heat dissipater (the initialheat sink);3. heat transfer from the heatdissipater to the ambientenvironment (the ultimate heatsink)The first phase is generallybeyond the control of the systemlevel thermal engineer becausethe package type defines theinternal heat transfer processes.In the second and third phases,the packaging engineer’s goalis to design an efficient thermalconnection from the packagesurface to the initial heat spreaderand on to the ambient environment.Achieving this goal requires athorough understanding of heattransfer fundamentals as well asknowledge of available interfacematerials and how their keyphysical properties affect the heattransfer process.Basic TheoryThe rate at which heat is conductedthrough a material is proportionalto the area normal to the heat flowand to the temperature gradientalong the heat flow path. For a onedimensional, steady state heat flowthe rate is expressed by Fourier’sequation:(1) Q = kA∆TdWhere:k = thermal conductivity, W/m-KQ = rate of heat flow, WA = contact aread = distance of heat flowT = temperature differenceThermal conductivity, k, is anintrinsic property of a homogeneousmaterial which describes thematerial’s ability to conduct heat.This property is independent ofmaterial size, shape or orientation.For non-homogeneous materials,those having glass mesh orpolymer film reinforcement, theterm “relative thermal conductivity”is appropriate because the thermalconductivity of these materialsdepends on the relative thickness ofthe layers and their orientation withrespect to heat flow.Another inherent thermal propertyof a material is its thermalresistance, R , as defined inEquation 2.(2) R = AThis property is a measure of howa material of a specific thicknessresists the flow of heat. Therelationship between k and R isshown by substituting Equation (2)into (1) and rearranging to form (3)(3) k =dR∆TQEquation 3 shows that forhomogeneous materials, thermalresistance is directly proportional tothickness. For non-homogeneousmaterials, the resistance generallyincreases with thickness but therelationship may not be linear.Thermal conductivity and thermalresistance describe heat transferwithin a material once heat hasentered the material. Because realsurfaces are never truly flat orsmooth, the contact plane betweena surface and a material can alsoproduce a resistance to the flowFigure 1a. Schematic representation of twosurfaces in contact and heat flow across theinterfaceThermal Impedance, deg C-in2/W0.0250.020.0150.010.0050T557 Impedance vs Pressuretested at 70 deg C per ASTM D54700 20 40 60 80 100 120 140 160Pressure, psiFigure 1b. Interface material compressedbetween two contacting surfacesof heat. Figure 1 depicts surfaceirregularities on a micro scale andsurface warp on a macro scale.Actual contact occurs at the highpoints, leaving air-filled voids wherethe valleys align. Air voids resistthe flow of heat and force more ofthe heat to flow through the contactpoints. This constriction resistanceis referred to as surface contactresistance and can be a factor at allcontacting surfaces.The impedance [Θ] of a materialis defined as the sum of itsthermal resistance and any contactresistance between it and thecontacting surfaces as defined inEquation 4.(4) = R material+R contactSurface flatness, surfaceroughness, clamping pressure,material thickness andcompressive modulus have a majorimpact on contact resistance.Chomerics 6

Because these surface conditionscan vary from application toapplication, thermal impedance ofa material will also be applicationdependent.Thermal InterfaceMaterials (TIM)Heat generated by a semiconductormust be removed to the ambientenvironment to maintain thejunction temperature of thecomponent within safe operatinglimits. Often this heat removalprocess involves conductionfrom a package surface to a heatspreader that can more efficientlytransfer the heat to the ambientenvironment. The spreader has tobe carefully joined to the package tominimize the thermal resistance ofthis newly formed thermal joint.Attaching a heat spreader to asemiconductor package surfacerequires that two commercial gradesurfaces be brought into intimatecontact. These surfaces are usuallycharacterized by a microscopicsurface roughness superimposedon a macroscopic non-planarity thatcan give the surfaces a concave,convex or twisted shape. When twosuch surfaces are joined, contactoccurs only at the high points. Thelow points form air-filled voids.Typical contact area can consistof more than 90 percent air voids,which represents a significantresistance to heat flow.Thermally conductive materials areused to eliminate these interstitialair gaps from the interface byconforming to the rough anduneven mating surfaces. Becausethe material has a greater thermalconductivity than the air it replaces,the resistance across the jointdecreases, and the componentjunction temperature will beTHERMATTACH ®Adhesive Tapesreduced. A variety of material typeshave been developed in responseto the changing needs of theelectronic packaging market. Thesematerials can be categorized asfollows:Phase-Change MaterialsTHERMFLOW ® materials areformulated with silicone or otherpolymer resins that are loadedwith thermally conductive fillers.They combine the high thermalperformance of grease with theease of handling and “peel-andstick”application of pads. They areused between high performancemicroprocessors, graphicsprocessors, chipsets and heatsinks.• Can achieve less than 0.3°Ccm2 /W thermal impedance• Conform at operatingtemperature to minimizethermal path thickness• Excellent surface “wetting”eliminates contact resistancePhase change materials behavelike thermal greases after theyreach their melt temperature,typically 45–55°C. Their viscosityrapidly diminishes and they flowthroughout the thermal joint tofill the gaps that were initiallypresent. This process requiressome compressive force, usually afew psi, to bring the two surfacestogether and cause the materialto flow. This process continuesuntil the two surfaces come intocontact at a minimum of threepoints, or the joint becomes so thinthat the viscosity of the materialprevents further flow. Thesematerials inherently do not provideelectrical isolation because theymay allow the two surfaces tomake contact; however, variationswith dielectric films are available.These materials have demonstratedexcellent long-term reliability andperformance.Polymer Solder HybridsThese THERMFLOW ® materialsincorporate low-melt metal alloyfillers which flow at temperaturesTHERMFLOW ® Phase-Change Materialsaround 65°C and provide ultra lowthermal impedance, less than 0.1°C-cm 2 /W at minimum bond linethickness.Thermal TapesTHERMATTACH ® tapes areformulated with acrylic orsilicone based pressure sensitiveadhesive (PSA) loaded withthermally conductive fillers. Theyare designed to securely bondheat sinks to power dissipatingcomponents without an additionalclamping mechanism.• Acrylic based adhesives formetal or ceramic packages• Silicone based adhesive forbonding plastic packages to heatsinks• Ionically pure formulations foruse inside component packagesand on printed circuit boards• Limited gap filling propertiesrequire reasonable surfaceflatness• High shear strength at elevatedtemperaturesThermal tapes are used primarilyfor their mechanical adhesiveproperties, and to a lesser extentfor their thermal properties. Thethermal conductivity of these tapesis moderate and their thermalperformance in an application isdependent on the contact areathat can be achieved between thebonding surfaces.Gap FillersTHERM-A-GAP gap fillers area family of low modulus (soft),thermally conductive siliconeelastomers for applications whereHeat Transfer FundamentalsChomerics 7

CHO-THERM ® Insulator Padsheat must be conducted over alarge and variant gap between asemiconductor component and aheat dissipating surface.• Soft silicone gel binder provideslow modulus for conformabilityat low pressures• Low modulus allows materialsto make up for large tolerancestack ups• Low pressure applicationsGap fillers are used to bridge largegaps between hot componentsand a cold surface. The gaps arenot only large, but their tolerancescan be ±20 % or greater. Thismeans that the gap filler musthave sufficient compliance to fillsuch spaces without stressingcomponents beyond their safelimits. Non-silicone gap fillersare available for silicone sensitiveapplications. Hybrid gap fillers thatcombine thermal and RF absorptionproperties are also available.Gap fillers are supplied in pad-formover a wide range of thickness,0.5 to 5mm, and can be moldedinto complex shapes. They arealso supplied as pre-cured, singlecomponent compounds that can bedispensed over the heat generatingcomponent.These unique materials result inmuch lower mechanical stress ondelicate components than eventhe softest gap-filling sheets. Theyare ideal for filling variable gapsbetween multiple components anda common heat sink.Form In Place CompoundsTHERM-A-FORM compoundsare reactive, two-componentsilicone RTVs (room temperaturevulcanizing materials) that can beused to form thermal pathways inapplications where the distancebetween a component and a coldsurface is highly variable. They aredispensed onto the componentand readily conform over complexgeometries and then cured in place.• Low-modulus, ceramic filledcompoundsForm-in-Place Compound• Fill gaps ranging from 0.005to 0.25 inch without stressingcomponents• Can cure at room temperature• Localized encapsulating ofcomponentsInsulating PadsCHO-THERM ® insulating padswere developed as a user-friendlyalternative to greased micainsulators to be used betweendiscrete power devices and heatsinks.• Silicone binder provides hightemperature stability and goodelectrical insulation properties• Glass mesh reinforcementprovides cut-through resistance• High mounting pressurerequired to minimize contactresistance• U.L. recognized flammabilityratingsThis class of product ischaracterized by high thermalconductivity, very high dielectricstrength and volume resistivity.Pads must conduct very largeheat loads from discrete powersemiconductors to heat sinks,while providing long-term electricalinsulation between the livecomponent case and the groundedheat sink.Thermal GreasesThermal greases are formulatedwith silicone or hydrocarbon oilsthat are loaded with conductivefillers. They are viscous liquids thatare typically stenciled or screenprinted onto the heat spreaderor heat sink. Greases have goodsurface wetting characteristics andflow easily to fill up voids at theinterfaces resulting in low thermalimpedance even at low applicationpressure.Thermal GelsThermal gels are silicone-basedformulations that are loaded withconductive fillers and are crosslinkedto form a low-modulus paste.They are highly conformable andChomerics 8

provide low thermal impedancelike greases but are designed toovercome the pump-out and dryoutissues of grease.Key Properties ofThermal InterfaceMaterialsThermal PropertiesThe key properties of interfacematerials are thermal impedanceand thermal conductivity.Thermal ImpedanceThis is the measure of the totalresistance to the flow of heat froma hot surface through an interfacematerial into a cold surface.Thermal impedance is measuredaccording to the ASTM D5470 testmethod. Although the currentversion of this method is specificto high durometer insulating padmaterials tested at high clampingforces, the method has beensuccessfully adapted for use withlow durometer materials as well asfluid compounds.Thermal impedance can bemeasured using D5470 at severalclamping forces to generate apressure versus thermal impedanceplot as shown in Figure 2. This typeof data can be used to generateinformation about the ability of amaterial to conform to surfaces tominimize contact resistance. Caremust be taken with this type ofdata because contact resistance isalso highly influenced by surfacecharacteristics. To minimize theimpact of test equipment variations,this type of work is best performedwith the same test surfaces for allmaterials being tested.Thermal ConductivityThermal impedance data measuredaccording to ASTM D5470 canbe used to calculate the thermalconductivity of an interfacematerial. Rearranging Equation (3)to give Equation (5)(5) R material=dkand substituting into Equation (4)yields Equation (6).d(6) Θ = + Rk contactEquation (6) shows that for ahomogeneous material, a plot ofthermal impedance [Θ] versusthickness (d) is a straight linewhose slope is equal to the inverseof the thermal conductivity andthe intercept at zero thickness isthe contact resistance shown inFigure 2. Thickness can be varied byeither stacking up different layersof the material or by preparing thematerial at different thicknesses.RcontactSlope = 1/kFigure 2. Thermal Impedance vs. ThicknessElectrical PropertiesdVoltage BreakdownThis is a measure of how muchvoltage differential a material canwithstand under a specific set oftest conditions. This property isusually measured using ASTM D149where a test specimen is subjectedto ramped alternating currentvoltage such that dielectric failure isreached within twenty seconds afterthe start of the test. Five specimensare tested and the average voltagebreakdown is calculated andreported. The value is an average,not a minimum. Voltage Breakdowncan be converted to DielectricStrength by dividing the voltagebreakdown value by the specimenthickness where the dielectricfailure occurred. This test is anindication of the ability of a materialto withstand high voltages, butdoes not guarantee how a materialwill behave over time in a realapplication. The value is influencedby several factors. Humidity andelevated temperature will reducethe voltage breakdown becauseabsorbed water will degrade theelectrical properties of the material.The size of the test electrode willaffect the observed breakdownvoltage. A larger test electrode willtypically yield a lower breakdownvoltage. The presence of partialdischarge, as well as mechanicalstresses imposed on the interfacematerial, also reduce voltagebreakdown.Volume ResistivityVolume resistivity is a measure ofthe bulk electrical resistance ofa unit cube of a material. Whendetermined per ASTM D257, volumeresistivity can give an indication ofhow well an interface material canlimit leakage current between anactive component and its groundedmetal heat sink. As with voltagebreakdown, volume resistivity canbe significantly lowered by humidityand elevated temperature.Elastomeric PropertiesInterface materials exhibitproperties typical of highly filledelastomers, namely compressiondeflection, compression set andstress relaxation.Compression DeflectionCompression deflection refersto resultant forces a materialexerts while being deflected. As acompressive load is applied, theelastomer material is deformedbut the volume of the materialremains constant. The compressiondeflection characteristics can vary,depending on part geometry (i.e.,thickness and surface area), rate ofdeflection, size of probe, etc.Stress RelaxationWhen a compressive load is appliedto an interface material, there is aninitial deflection followed by a slowrelaxation process whereby someof the load is relieved. This processcontinues until the compressiveload is balanced by the cohesivestrength of the material.Chomerics 9

Compression SetCompression set is the resultof stress relaxation. After amaterial has been subjected to acompressive load for an extendedtime, part of the deflectionbecomes permanent and will notbe recoverable after the load isreduced.Chomerics 10

THERM-A-GAP TMHCS10,569,570,579,580Thermally Conductive Gap Filler PadsDESCRIPTIONTHERM-A-GAP gap-fillersheets and pads offer excellentthermal properties and highestconformability at low clampingforces.FEATURES / BENEFITS• Ultra low deflection force• High thermal conductivity• High tack surface reducescontact resistance• “A” version offers high strengthacrylic PSA for permanentattachment• UL recognized V-0 flammability• RoHS compliantAll products are available onaluminum foil (A) or on “cleanbreak” glass (G) fiber carrier. Aswith all previous Chomerics gapfillers,the “A” versions have a highstrength acrylic pressure sensitiveadhesive (PSA) for permanentattachment to the cold surfaces.THERM-A-GAP HCS10, 569, 570, 579, 580 Thermally Conductive PadsTypical Properties HCS10 569 570 579 580 Test MethodColor Orange / Grey Gray Blue Pink Yellow VisualPhysicalThermalElectricalRegulatoryCarrierG = Woven glass - no PSAA = Aluminum foil - with PSAStandard Thicknesses*, mm (inch)A or G A or G A or G A or G A or G --0.25 – 5.0(0.010 - 0.200)0.25 – 5.0(0.010 - 0.200)0.5 – 5.0(0.020 - 0.200)0.25 – 5.0(0.010 - 0.200)0.5 – 5.0(0.020 - 0.200)ASTM D374Specific Gravity 2.0 2.2 2.2 2.9 2.9 ASTM D792Hardness, Shore 00 4 10 25 30 45 ASTM D2240Extractable Silicone, % N/A 10 10 6 6 ChomericsPercent Deflection @ Various Pressures(0.125 in thick sample)@ 34 kPa (5 psi)@ 69 kPa (10 psi)@ 172 kPa (25 psi)@ 345 kPa (50 psi)Operating Temperature Range, °C [°F]Thermal Impedance,°C-cm 2 /W (°C-in 2 /W)@ 10 psi, @ 1mm thick, G version% Deflected % Deflected % Deflected % Deflected % Deflected26365973-55 to 200[-67 to 392]9.7(1.5)20305065-55 to 200[-67 to 392]9.1(1.4)10152535-55 to 200[-67 to 392]9.1(1.4)22335568-55 to 200[-67 to 392]4.5(0.7)7102030-55 to 200[-67 to 392]4.5(0.7)ASTM C165 MOD(0.125 in “G” Type,0.50 in dia. probe,0.025 in/min rate)--ASTM D5470Thermal Conductivity, W/m-K @ 25 psi 1 1.5 1.5 3 3 ASTM D5470Heat Capacity, J/g-K 1 1 1 1 1 ASTM E1269Coefficient of Thermal Expansion, ppm/K N/A 250 250 150 150 ASTM E831Dielectric Strength, KVac/mm (Vac/mil) 8 (200) 8 (200) 8 (200) 8 (200) 8 (200) ASTM D149Volume Resistivity, ohm-cm 10 14 10 14 10 14 10 14 10 14 ASTM D257Dielectric Constant @1,000 kHz 5.3 6.5 6.5 8.0 8.0 ASTM D150Dissipation Factor @ 1,000 kHz 0.013 0.013 0.013 0.010 0.010 Chomerics TestFlammability Rating(See UL File E140244 for Details)Not Tested V-0 V-0 V-0 V-0 UL 94RoHS Compliant Yes Yes Yes Yes YesChomericsCertificationOutgassing, % TML (% CVCM) 0.44 (0.13) 0.42 (0.08) 0.35 (0.09) 0.19 (0.06) 0.18 (0.05) ASTM E595Shelf Life,24 (18) 24 (18) 24 (18) 24 (18) 24 (18) Chomericsmonths from date of shipment G (A)*Thickness tolerance, mm(in.) ±10% nominal thickness @ 2.5mm (100 mil) or less;± 0.25mm (10mil) @ nominal thickness greater than 2.5mm (100 mil). Custom thicknesses may be available upon request.Gap FillersYellow highlights new product since previous catalog edition.Chomerics 11

THERM-A-GAP TM HCS10,569, 570, 579, 580 Thermally Conductive PadsTYPICAL APPLICATIONS• Telecommunications equipment• Consumer electronics• Automotive electronics (ECUs)• LEDs, Lighting• Power conversion• Desktop computers, laptops,servers• Handheld devices• Memory modules• Vibration dampeningHANDLING INFORMATIONThese products are defined byChomerics as “articles” accordingto the following generallyrecognized regulatory definition forarticles:An article is a manufactured item“formed to a specific shape ordesign during manufacturing,”which has “end use functions”dependent upon its size and shapeduring end use and which hasgenerally “no change of chemicalcomposition during its end use.”In addition:• There is no known oranticipated exposure tohazardous materials/substances during routine andanticipated use of the product.• The product’s shape, surface,and design is more relevantthan its chemical composition.These materials are not deemed byChomerics to require an MSDS. Forfurther questions, please contactChomerics at 781-935-4850.Ordering InformationThermally conductive pads are available in the following formats.Contact Chomerics for custom widths, part sizes, etc.Distributor Part Numbers - 18” X 18” Sheets0.010 in = 69-XX-27082-ZZZZ0.015 in = 69-XX-27083-ZZZZ0.020 in = 69-XX-20698-ZZZZ0.030 in = 69-XX-27070-ZZZZ0.040 in = 69-XX-20684-ZZZZ0.050 in = 69-XX-27072-ZZZZ0.060 in = 69-XX-20991-ZZZZXX = 11 for “G” VersionXX = 12 for “A” Version0.070 in = 69-XX-20685-ZZZZ0.080 in = 69-XX-21259-ZZZZ0.100 in = 69-XX-20672-ZZZZ0.130 in = 69-XX-20675-ZZZZ0.160 in = 69-XX-20686-ZZZZ0.200 in = 69-XX-20687-ZZZZPRODUCT ATTRIBUTESHCS10• Economical solution• Highest conformabilitygap filler sheet569• Economical combination ofthermal performance andconformability570• Best for molding complex partsand vibration dampening579• Best combination of thermalperformance and conformability• Lowest outgassing580• Best for molding complex partsand vibration dampening• Lowest outgassingCustom die-cut parts on sheets, or as individual parts“A” version offered die-cut (up to 70 mil) on continuousrolls (higher volumes)Custom thicknesses available upon request(up to 1” thick)Custom molded designs and ribbed sheetsZZZZ = THERM-A-GAP Material CodeOEM Part Number Examples - 9” X 9” SheetsStandard OEM Sheet, 0.070 Thick, “G” carrier, no PSA, 570 material:Standard OEM Sheet, 0.200 Thick, “A” carrier, with PSA, 579 material:61 - 07 - 0909 - G57062 - 20 - 0909 - A579Custom Part Number ExamplesCustom configuration, (69 Prefix) “A” carrier, with PSA, 569 material:69 - 12 - XXXXX - A569(Where “XXXXX” is assigned by Chomerics at time of quotation)XX = 11 for “G” VersionXX = 12 for “A” VersionZZZZ = THERM-A-GAP Material CodeChomerics 12

THERM-A-GAP TM 974, G974 and 976 Thermally Conductive Gap Filler PadsTYPICAL APPLICATIONS• Telecommunications equipment• Consumer electronics• Automotive electronics (ECUs)• LEDs, Lighting• Power conversion• Power semiconductorsPRODUCT ATTRIBUTES974• Excellent thermal performance• PSA for improved applicationG974• Excellent thermal performance• PSA for improved application• Fiberglass reinforced forimproved tear strength andimproved rework capabilities976• Superior thermal performance• Low compression force underpressure• Minimal stress on componentsMATERIAL HANDLINGThese products are defined byChomerics as “articles” according tothe following generally recognizedregulatory definition for articles:An article is a manufactured item“formed to a specific shape ordesign during manufacturing,”which has “end use functions”dependent uponits size and shape during end useand which has generally “no changeof chemical composition during itsend use.”In addition:• There is no known oranticipated exposure tohazardous materials/substances during routine andanticipated use of the product.• The product’s shape, surface,and design is more relevantthan its chemical composition.These materials are not deemed byChomerics to require an MSDS. Forfurther questions, please contactChomerics at 781-935-4850.Ordering InformationTHERM-A-GAP products are available in the following formats.Contact Chomerics for custom widths, part sizes, etc.• Full Sheets, 9x12” to 20x25”• Die-cut parts on sheets• Custom die-cut parts on sheets, or as individual partsPart Number:61 = Sheet - No PSA (976 only)2 = Sheet with PSA 1 side(974/G974 only)Material thickness* in mils(e.g. 10 = 0.010” or 0.254 mm)YYYY = 0808(8” X 8” Sheet / 20.3 cm X 20.3 cm).Custom YYYY sizes available.ZZZZ = 974, G974, or 9769 = Custom configuration11 = Custom, no PSA (976 only)12 = Custom, with PSA 1side(974/G974 only)YYYYY = Custom configuration(Please contact Chomerics for apre-assigned part number if necessary)* See typical properties table for thicknesses.Chomerics 14

THERM-A-GAP TM575-NSSilicone-Free Soft Acrylic Thermally Conductive Gap Filler PadsDESCRIPTIONTHERM-A-GAP acrylic gap fillerpads are used in silicone sensitiveapplications.FEATURES / BENEFITS• Economical with good thermalconductivity• No silicone outgassing orextractables• RoHs compliant• Inherently tacky on both sidesfor ease of application (Nopressure sensitive adhesiveoption available/necessary)TYPICAL APPLICATIONS• Hard disk drives/storage• Optical electronics• Aerospace/Defense• Desktop computers, laptops,servers• Telecommunications equipment• Consumer electronicsGap FillersTHERM-A-GAP Silicone-Free Soft Acrylic Thermally Conductive PadsTypical Properties 575-NS Test MethodColor Yellow VisualComposition Ceramic Filled Acrylic ---Thickness, mm (in) 0.5 – 2.5 (0.020 -0.100) ASTM D374Specific Gravity 1.8 ASTM D792Thermal Conductivity, W/m-K 1.2 ASTM D5470Hardness (Shore 00) 70 ASTM D2240Operating Temperature Range, °C (°F) -20 to 100 (-4 to 212) --Ordering InformationPart Number Thickness / mm (in) Sheet Size69-11-27154-575NS 0.5 (0.020)69-11-27155-575NS 1 (0.040)69-11-27156-575NS 1.2 (0.047)69-11-27157-575NS 1.5 (0.060)300 X 400 mm(11.8 X 15.7)69-11-27158-575NS 2 (0.080) 200 X 300 mm69-11-27159-575NS 2.5 (0.100)(7.9 X 11.8)Chomerics 15

THERM-A-GAP TMGelsDispensable, Very Low Compression Force, Thermal Gap FillersDESCRIPTIONTHERM-A-GAP Gels are highlyconformable, pre-cured, singlecomponentcompounds. Thecross-linked gel structure providessuperior long term thermal stabilityand reliable performance. Theseunique materials result in muchlower mechanical stress on delicatecomponents than even the softestgap-filling sheets. They are idealfor filling variable gaps betweenmultiple components and a commonheat sink.FEATURES / BENEFITS• Dispensable• Fully cured• Highly conformable at lowpressures• No refrigeration, mixing or fillersettling issues in storage• Single dispensable TIM caneliminate multiple pad partsizes/numbers• ReworkableTYPICAL APPLICATIONS• Automotive electronic controlunits (ECUs)- Engine control- Transmission control- Braking/traction control• Power conversion equipment• Power supplies anduninterruptible power supplies• Power semiconductors• MOSFET arrays with commonheat sinks• Televisions and consumerelectronicsPhysicalThermalElectricalRegulatoryTHERM-A-GAP Dispensed Thermal GelsTypical Properties T630/T630G T635 T636 Test MethodColor White White Yellow VisualFlow Rate, cc/min - 30cc taper tip,0.130” orifice, 90psi (621 kPa)10 8 8 ChomericsSpecific Gravity 2.25 1.50 1.20 ASTM D792Percent Deflection @ Various Force Levels % Deflection % Deflection % Deflection@ .20 kg@ .45 kg@ 1.0 kg@ 1.4 kg@ 1.8 kg@ 2.3 kg(0.5 lb)(1 lb)(2 lbs)(3 lbs)(4 lbs)(5 lbs)Typical minimum bondline thickness,mm (in)--36475459630.10 (0.004)/0.25 (0.010)--1333435056--623354348Modified ASTM C165Dispensed 1.0 cc of materialBrought 1” x 1” probedown to 0.100”Test rate 0.025 in/min0.38 (0.015) 0.38 (0.015) --Thermal Conductivity, W/m-K 0.7 1.7 2.4 ASTM D5470Heat Capacity, J/g-K 1.1 0.9 0.9 ASTM E1269Coefficient of ThermalExpansion, ppm/KOperating Temperature Range, °C(°F)Dielectric Strength,KVac/mm (Vac / mil)350 400 400 ASTM E831-55 to 200(-67 to 392)-55 to 200(-67 to 392)-55 to 200(-67 to 392)5.0 (200) 5.0 (200) 5.0 (200) ASTM D149Volume Resistivity, ohm-cm 10 14 10 14 10 14 ASTM D257Dielectric Constant @1,000 kHz 5.5 4.0 4.0 ASTM D150Dissipation Factor @ 1,000 kHz 0.010 0.003 0.003 ChomericsFlammability Rating(See UL File E140244 for Details)V-0 Not Tested V-0 UL 94RoHS Compliant Yes Yes Yes--ChomericsCertificationOutgassing, % TML 0.55 0.5 0.4 ASTM E595Shelf Life,months from date of manufacture18 18 18 ChomericsChomerics 16

GEL 8010Thermally Conductive Dispensable GelDESCRIPTIONGEL 8010 is specifically formulatedfor use in high performance devicesrequiring minimum thermal resistancefor maximum thermal performanceand component reliability.GEL 8010 is a compliant materialGEL 8010Test Methodthat requires low compression forceto White conform over irregular Visual interfacesand can be applied to single deviceswith minimum bond-line thicknessas well as to multiple devices withvariable z-axis tolerances.The cross-linked gel structureprovides superior long term thermalstability and reliable performanceover conventional greases.Gel 8010 can easily be applied bystencil printing or dispensing, eithermanually or with automated equipment.It requires no cure cycle andcan be readily re-worked. GEL 8010is supplied as a one-componentgel and requires no refrigeration,no mixing and has no filler settlingissues.GEL 8010 has demonstrated reliablethermal performance duringtemperature cycling, humidity, longterm thermal aging and powercycling tests. It was developed fornext generation microprocessors.TYPICAL APPLICATIONS• Microprocessors• Graphics Processors• Chipsets• Memory Modules• Power Modules• Power Semiconductors70 Chomerics2.70 ASTM D792% Deflection2744576468740.10 (0.004)/0.25 (0.010)Modified ASTM C165Dispensed 1.0 cc of materialBrought 1” x 1” probedown to 0.100”Test rate 0.025 in/min--4.0 ASTM D5470.047 ASTM E1269943 ASTM E831-55 to 200(-67 to 392)--5.0 (200) ASTM D14910 14 ASTM D2576.3 ASTM D1500.002 ChomericsV-0 Pending UL 94YesChomerics Certification-- ASTM E59518 ChomericsPhysicalThermalElectricalRegulatoryTypical Properties XTS-8030 Test MethodColor Light Pink VisualSpecific Gravity 2.9 ASTM D792Flow Rate 6-8Grams/minluer lock syringe (TML, % 0.01 TGAForce vs. Deflection .5%10%25%50%0.0120.020.431.3ASTM C165 M0.100in thickness 1.00.025 in/min rThermal Conductivity, W/m-K 3 ASTM D5470Heat Capacity, J/g-K 1 ASTM E1269Coefficient of ThermalExpansion, ppm/K150 ASTM E831Continuous Use Temperature, °C -55 to 200 --Dielectric Strength, Vac / mil,(KVac/mm)200( 8 )ASTM D149Volume Resistivity, ohm-cm 10 14 ASTM D257Shelf Life, years from date ofmanufacture2 Inventory contRoHS Compliant YES --Yellow highlights new product since previous catalog edition.Chomerics 18

GEL 8010 Thermally Conductive Dispensable GelFEATURES/BENEFITS• Low thermal impedance• High bulk thermal conductivity• Excellent long term EOLife (Endof Life) performance• Proven performance at elevatedtemperatures• Easy to handle and apply--stencil printable• Highly conformable at lowcompression force• End user license agreement mayapply• Applicable to single devices ormultiple devices• Requires no cure cycle, mixing orrefrigeration• No pump-out associated withthermal grease• Lower joint stress compared tometallic solder• Reworkable gel• RoHS compliant• UL 94 V-0 Flammability RatingsINSTALLATION GUIDELINESThermal GEL 8010 is supplied inplastic syringes and aluminumcartridges. Apply pressure tothe rear of the cartridge, simplydispense the desired amount ontocomponents or cooling plates.Since GEL 8010 gel is conformable,the gel can be stencil printedonto the plates. The thickness ofthe printed gel can be adjusteddepending on the component typeand size, but about 6mil thicknessis recommended. The gel isreworkable and excess materialcan be easily wiped off with a rag.Refer to Application Note for moredetailed information about usingthis material.Thermal Gels0.16BAKE TEST at 95 ºCBake Test at 95°CTEMPERATURE CYCLING TEST0.140.160.120.14TIM, °C-cm2/W0.100.080.060.04TIM, °C-cm²/W0.120.100.080.060.04GEL 80100.020.02Temperature Cycling Testing between 0°C and 125°Cwith 10 min. ramping time and 10 min. soaking time0.000 100 200 300 400 500 600 700 800 900 10000.000 100 200 300 400 500 600 700 800Bake HoursTemperature CyclesOrdering InformationThese materials are available in the following formats.Contact Chomerics for custom widths, part sizes, etc.PART NUMBERS65-00-GEL8010-001065-00-GEL8010-003065-00-GEL8010-018065-00-GEL8010-030069-11-25177-GEL801069-11-28020-GEL801010 CC sample30 CC Cartridge80 CC Cartridge300 CC Cartridge1 GAL PAIL (5 KG)1 GAL PAIL (9 KG)Chomerics 19

THERMFLOW ®Phase-Change Thermal Interface PadsDESCRIPTIONTHERMFLOW ® phase-changeThermal Interface Materials (TIM)are designed to minimize thethermal resistance between powerdissipating electronic componentsand heat sinks.This low thermal resistance pathmaximizes heat sink performanceand improves component reliability.At room temperature, THERMFLOWmaterials are solid and easy tohandle. This allows them to beconsistently and cleanly appliedas dry pads to a heat sink orcomponent surface. THERMFLOWmaterial softens as it reachescomponent operating temperatures.With light clamping pressure itwill readily conform to both matingsurfaces.This ability to completely fillinterfacial air gaps and voids typicalof component packages and heatsinks allows THERMFLOW padsto achieve performance superiorto any other thermal interfacematerials.THERMFLOW products areelectrically non-conductive.However, since metal-to-metalcontact is possible after thematerial undergoes phase-changein a typical heat sink assembly.In general, THERMFLOW padsshould not be used as electricalinsulators - PC07DM-7 is offered asa dielectric version.Chomerics offers two types of phasechange materials—traditionalthermal interface pads and polymersolder hybrids.POLYMER SOLDER HYBRIDMATERIALSThese Thermal Interface Materialsprovide superior long termreliability performance. Theseproducts exhibit the lowest thermalimpedance of the phase-changefamily.For optimum performance, the padsmust be exposed to temperaturesabove 64ºC during operation or bya burn-in cycle to achieve lowestthermal impedance and highestthermal performance.Upon reaching the required burnintemperature, the pad will fullychange phase and attain MBLT(minimum bond-line thickness lessthan 0.001 inch or 0.0254mm) andmaximum surface wetting.FEATURES/BENEFITS• Low thermal impedance• Proven solution – years ofproduction use in personalcomputer OEM applications• Demonstrated reliability throughthermal cycling and acceleratedage testing• Can be pre-applied to heat sinks• Protective release liner preventscontamination of material priorto final component assembly• Tabs available for easy removalof release liner (T710, T725,T557, T777)• Available in custom die-cutshapes, kiss-cut on rolls• Electrically non-conductive, nonsiliconepolymers• RoHS CompliantTYPICAL APPLICATIONS• Microprocessors• Graphics Processors• Chipsets• Memory Modules• Power Modules• Power SemiconductorsHANDLING INFORMATIONThese products are defined byChomerics as “articles” accordingto the following generallyrecognized regulatory definition forarticles:An article is a manufactured item“formed to a specific shape ordesign during manufacturing,”which has “end use functions”dependent upon its size and shapeduring end use and which hasgenerally “no change of chemicalcomposition during its end use.”In addition:• There is no known oranticipated exposure tohazardous materials/substances during routine andanticipated use of the product.• The product’s shape, surface,and design is more relevantthan its chemical composition.These materials are not deemed byChomerics to require an MSDS. Forfurther questions, please contactChomerics at 781-935-4850.APPLICATIONMaterial may flow when orientedvertically, especially at highertemperatures. This does not affectthermal performance, but shouldbe considered if appearance isimportant.Chomerics 20

THERMFLOW ® Phase-Change Thermal Interface PadsTHERMFLOW ® Phase-Change Thermal Interface PadsTypical Properties PC07DM-7 T710 with PSA T725 T766 T557 T558 T777 Test MethodColor PinkLight gray /off-whitePinkPurple /Gray foilGrayGray /Gray foilGray VisualCarrier1 milpolyester2 milFiberglassNone -Free Film1 milMetal FoilNone -Free film1 milMetal FoilNone -Free film--Standard Thicknesses,mm (in)0.178 (0.007) 0.138 (0.0055) 0.125 (0.005) 0.088 (0.0035)0.125(0.005)0.115(0.0045)0.115(0.0045)ASTM D374Specific Gravity 1.1 1.15 1.1 2.6 2.4 3.65 1.95 ASTM D792PhysicalPhase TransitionTemperature, °C55 45 55 55 45 / 62 45 / 62 45 / 62 ASTM D3418Weight Loss,125°C for 48 Hours

THERMFLOW ® Phase-Change Thermal Interface PadsTRADITIONAL PHASE CHANGE MATERIALS (PCM)PC07DM-7• Utilizes proven T725 phasechangematerial• Polyester dielectric layer offersexcellent mechanical andelectrical properties• Inherently tacky – no adhesiverequired• Good thermal propertiesT725• Excellent thermal performance• Inherently tacky – no adhesiverequired• Ideal for vertical applications• Sticky nature limits flowing invertical applicationsT766• Excellent thermal performance• Protective foil eliminates topliner• Inherently tacky – no adhesiverequired• Sticky nature limits flowing invertical applicationsT710• General use material• Good thermal performance• Low deflection force required• Fiberglass provides dielectricstandoff• Available with and withoutadhesiveTHERMFLOW materials aresupplied in several standardformats (see part number guidebelow).Part Number:6POLYMER SOLDER HYBRID MATERIALS (PSH)T557• Superior thermal performance• Dispersed solder filler offersadded thermal performance• Resin system designed forhigher temperature reliability• Inherently tacky – no adhesiverequiredT558• Superior thermal performance• Conformal foil allows cleanbreak/rework and eliminates topliner• Dispersed solder filler offersadded thermal performanceOrdering InformationCustom die-cut shapes can also beprovided on kiss-cut rolls byChomerics’ extensive network ofdistributor/ fabricators. To easerelease liner removal, an optionaltab can be added.• Resin system designed forhigher temperature reliability• Inherently tacky – no adhesiverequiredT777• Superior thermal performance• Ideal solution for mobilemicroprocessors• Dispersed solder filler offersadded thermal performance• Resin system designed forhigher temperature reliability• Inherently tacky – no adhesiverequired• End user license agreementmay applyStandard tolerances for slittingwidths and individually cut piecesare ±0.020 inch (±0.51 mm).6W XX YYYY ZZZZZZZZ = Material class4 = Roll stockYYYY =Roll stock width:(T710, T725, T766, T557, T558, T777)10 = 100 ft.Examples6 = Roll stock with PSA 40 = 400 ft.0100 = 1”ZZZZ = T710 only product availableXX = Custom length 0750 = 7.5”8 = Roll stockwith PSA. (no need for PSA)2400 = 24”with PSA and release tabsAll others are inherently tacky9 = Custom die-cut part11 = without PSA12 = with PSA one side(T710 Only)Custom Part Number.Contact ChomericsZZZZ = Material class(T710, T725, T766, T557, T558, T777)Chomerics 22

THERMATTACH ® TapeThermally Conductive Attachment TapesDESCRIPTIONTHERMATTACH ® double-sidedthermal interface tapes provideexceptional bonding propertiesbetween electronic components andheat sinks, eliminating the need formechanical fasteners.THERMATTACH ® tapes are provento offer excellent reliability whenexposed to thermal, mechanical,and environmental conditioning.They are offered in a variety ofconfigurations, as detailed in thetypical properties table.FEATURES / BENEFITS• Offered in various forms toprovide thermal, dielectric, andflame retardant properties• Offered in custom die-cutconfigurations to suit a variety ofapplications• Eliminate the need formechanical attachment (i.e.screws, clips, rivets, fasteners)• Proven reliability under variousmechanical, thermal, andenviromental stresses• Embossed version available• UL recognized V-0 flammability• Meets RoHS specifications• No curing required, unlike epoxyor acrylic preforms or liquidsystems• Easily reworkableTYPICAL APPLICATIONS• Mount heat sinks to componentsdissipating < ~25 W• Attach heat sinks to PC (esp.graphics) processors• Heat sink attachment to motorcontrol processors• Telecommunicationinfrastructure componentsPRODUCT ATTRIBUTEST418• Superior adhesive strength• Best conformability tocomponents• UL94 V-0 rated• Good thermal performanceT412• Good adhesion• Superior thermal performance• General use tape with addedthermal conductivity of Al foillayerT411• Designed for adhesion to plasticpackages• Attaches to low surface energypackagesT404• Excellent dielectric strength dueto polyimide carrier• Good thermal performance• UL94 V-0 ratedT405• General use tape with addedthermal conductivity of Al foillayer• Excellent thermal performance• UL94 V-0 ratedT405-R• T405 without halogenated flameretardantT413• Excellent thermal performance• Fiberglass layer provides addedstrengthT414• T404 without halogenated flameretardantThermal TapesChomerics 23

THERMATTACH ® Thermally Conductive Attachment TapesThermally Conductive Attachment TapesTypical Properties T418 T412 T404 / T414 T405 / T405-R T411 T413 MethodRecommended for PlasticComponent AttachmentNo No No No Yes No --Color Light Yellow Gray Beige White Clear / Metallic White --Embossed Optional Standard Standard Standard No Standard --Reinforcement Carrier Fiberglass Aluminum Mesh Filled Polyimide Aluminum Aluminum Mesh Fiberglass VisualThickness, mm (inch) 0.25 (0.010) 0.23 (0.009) 0.127 (0.005) 0.15 (0.006) 0.25 (0.010) 0.18 (0.007) ASTM D374Thickness Tolerance, mm (inch)± 0.025(0.001)± 0.025(0.001)± 0.025(0.001)± 0.025(0.001)± 0.025(0.001)± 0.025(0.001)--Adhesive CTE, ppm/ºC (ppm/ºF) 300 300 300 300 400 300 ASTM D3386Glass Transition TemperatureRange ºC (ºF)-20 (-4) -30 (-22) -30 (-22) -30 (-22) -50 (-58) -30 (-22) ASTM D1356Operating TemperatureRange, ºC (ºF)-30 to + 125(-22 to +257)-30 to + 125(-22 to +257)-30 to + 125(-22 to +257)-30 to + 125(-22 to +257)-50 to +150(-58 to +302)-30 to + 125(-22 to +257)--Thermal Impedance°C-cm 2 /W (°C-in 2 / W)7.7 (1.2) 2.0 (0.30) 3.7 (0.6) 3.4 (0.5) 6.5 (1.0) 4.0 (0.65) ASTM D5470Thermal Conductivity W/m-K 0.5 1.4 0.4 0.5 0.5 0.4 ASTM D5470Voltage Breakdown (Vac) 5,000 N/A 5,000 N/A NA 3,700 ASTM D149Volume Resistivity, (ohm-cm) 1.0 X 10 13 1.0 X 10 2 3.0 X 10 14 N/A NA 1.3 X 10 16 ASTM D257Lap Shear Al-Al @25°C, kPa (psi) 1,034 (150) 480 (70) 689 (100) 689 (100) 270 (40) 689 (100) ASTM D100290° Peel Adhesion to 0.002”aluminum foil, N/cm (lbf /in)6.9 (4.0) 1.76 (1.0) 2.6 (1.5) 2.6 (1.5) 3.5 (2.0) 2.6 (1.5) ASTM D1000Die Shear Adhesion after400 psi attachment, kPa (psi)– 2 hour sample dwell time 25ºC (77ºF)1,034 (150) 931 (135) 897 (130) 862 (125) 759 (110) 931 (135)Chomerics# 54Creep Adhesion, days15ºC (77ºF)125ºC (302ºF)>50>10>50>10>50>10>50>10>50>10>50>10PSTC-7Flammability Rating (See UL File E140244) V-0 Not Tested V-0 V-0 Not Tested Not Tested UL94RoHS Compliant Yes Yes Yes Yes Yes YesChomericsCertificationShelf-Life, months from shipment 12 12 12 12 12 12 ChomericsRegulatoryMechanical / AdhesionElectricalThermalPhysicalChomerics 24

THERMATTACH ® Thermally Conductive Attachment TapesOrdering InformationThese attachment tapes are available in the following formats.Contact Chomerics for custom widths, part sizes, etc.Sheets form, roll form, or die-cut parts. Offered on continuous rolls.A general ordering information table is included below for reference.Part Number:60 = Standard Part XX = 13 for PSA two sides7 = Roll of material@ various lengthsXX = 10 (100 foot roll)XX = 40 (400 foot roll)9 = Custom part XX = 13 for PSA two sidesYYYY = 4 digit alpha/numeric part number.Contact Chomerics.YYYY = 0600 for 6” wideYYYY = 1000 for 10” wideYYYY = 1150 for 11 ½” wideYYYY = 2400 for 24” wide(other sizes available. Contact Chomerics)YYYYY = Custom Part Number.Contact ChomericsZZZZ = Material class(T418, T411, etc)Handling InformationThese products are defined byChomerics as “articles” accordingto the following generallyrecognized regulatory definition forarticles:An article is a manufactured item“formed to a specific shape ordesign during manufacturing,”which has “end use functions”dependent uponits size and shape during end useand which has generally “no changeof chemical composition during itsend use.”In addition:• There is no known oranticipated exposure tohazardous materials/substances during routine andanticipated use of the product.• The product’s shape, surface,and design is more relevantthan its chemical composition.These materials are not deemed byChomerics to require an MSDS. Forfurther questions, please contactChomerics at 781-935-4850.Chomerics 25

THERMATTACH ® TapeTape Application Instructions: T404, T405, T405-R, T411, T412, T413, T414, T418MATERIALS NEEDED• Clean lint-free cloth rag• Industrial solvent• Rubber glovesFor optimal performance,Chomerics recommends interfaceflatness of 0.001 in/in (0.025 mm/mm) to 0.002 in/in (0.050 mm/mm)maximum.Step 1: Ensure that bondingsurfaces are free from oil, dust, orany contamination that may affectbonding. Using rubber gloves, wipesurfaces with a cloth dampenedwith industrial solvents such asMEK, toluene, acetone or isopropylalcohol.Step 2: Cut tape to size* andremove a liner or remove pre-cuttape from roll.*Note: Due to variations in heatsink surfaces, Chomerics’ dataindicates that it sometimesis beneficial to be cut slightlysmaller than the area of the heatsink. See illustration.Step 3: Apply to center of heat sinkbonding area and smooth overentire surface using moderate handpressure / rubbing motion. A rollermay be useful to help smooth thepart to the surface by rolling fromthe center out to beyond the edgesof the part. This ensures optimalcontact between tape and heat sink.Step 4: Center heat sink ontocomponent and apply using any oneof the recommended temperature/pressure options:Relative Thermal PerformancePerformance*Minimum: 10 psi at roomtemperature for 15 secondsPreferred: 30 psi at roomtemperature for 5 secondsMore pressure equals better wettingout of the adhesive to the contactsurfaces. A twisting motion duringassembly of the substrates willtypically improve wetting.Note that typically 70% of theultimate adhesive bond strengthis achieved with initial application,and 80-90% is reached within 15minutes. Ultimate adhesive strengthis achieved within 36 hours;however the next manufacturingstep can typically occur immediatelyfollowing the initial application.REMOVAL INSTRUCTIONSMaterials needed: Single-edgedrazor blade or a small, thin-bladedpocketknife; soft, thin metalspatula. Use safety precautionswhen handling sharp instrumentsand organic solvents.Thermally Conductive Attachment Tapes* Performance rated on a scale of 1-5, 5 being the best. N/R = Not Recommended.Step 1: Carefully insert the bladeedge into the bond line at a cornerbetween the heat sink and thecomponent. The penetration neednot be very deep.Step 2: Remove the blade and insertthe spatula into the wedge. Slowlytwist the spatula blade so that itexerts a slight upward pressure.Step 3: As the two surfaces startto separate, move the spatulablade deeper into the bond line andcontinue the twisting motion andupward force.Step 4: After the two componentsare separated, the tape can beremoved and discarded. If adhesiveremains on the component surfaces,it must be removed. Adhesive isbest removed by wiping with aclean rag (lint-free) dabbed withisopropyl alcohol, MEK or toluene.Use sufficient solvent to remove alladhesive.Step 5: Solvent cleaned componentsmust be verified 100% free ofcleaning solvent and prior toreattachment of adhesive.Typical Properties T418 T412 T404 / T414 T405 / T405-R T411 T413Ceramic Attachment 5 3 4 4 4 4Metal Attachment 5 3 4 4 4 4Plastic Attachment N/R N/R N/R N/R 5 N/RDielectric Performance 3 N/R 5 N/R N/R 3Thermal Performance 2 5 3 4 2 3Chomerics 26

THERM-A-FORM 164x and T64x SeriesCure-in-Place Potting and Underfill MaterialsRegulatoryElectricalThermalPhysicalTHERM-A-FORM Cure-in-Place Potting and Underfill MaterialsTypical Properties T647 T646 T644 T642 1642 1641 Test MethodColor Gray Yellow Pink Blue Purple White VisualBinder Silicone Silicone Silicone Silicone Silicone Silicone --FillerAluminumOxideAluminumOxideBoronNitrideBoronNitrideAluminumOxideAluminumOxideNumber of Components 2-part 2-part 2-part 2-part 2-part 1-part --Mix Ratio 1 : 1 1 : 1 1 : 1 10 : 1 100 : 3 N/A --Specific Gravity 2.80 2.45 1.45 1.50 2.30 2.10 ASTM D792Hardness, Shore A 25 50 15 70 85 78 ASTM D2240Viscosity, poise > 5000 > 5000 3000 2500 2500 3000 ASTM D2196Pot Life, minutes 300 300 360 60 60 30Cure Cycles3 min.@ 150 ºC60 min.@ 60 ºC48 hrs.@ 23 ºC3 min.@ 150 ºC60 min.@ 60 ºC48 hrs.@ 23 ºC3 min.@ 150 ºC60 min.@ 60 ºC48 hrs.@ 23 ºC3 min.@ 150 ºC30 min.@ 70 ºC48 hrs.@ 23 ºC60 min.@ 100 ºC4 hrs.@ 65 ºC1 week@ 23 ºC48 hrs. @23 ºC@ 50% RH--Time to 2X StartingViscosity at 23 ºCChomericsBrittle Point, ºC (ºF) -55 (-67) -55 (-67) -55 (-67) -55 (-67) -75 (-103) -75 (-103) ASTM D2137Extractable Silicone, % 4 8.5 15 1 - 2 Not Tested Not Tested ChomericsApparent ThermalConductivity, W/m-K3.00 0.90 1.20 1.20 0.95 0.90 ASTM D5470Heat Capacity, J/g-K 0.9 1.0 1.0 1.0 1.0 1.0 ASTM E1269Coefficient of ThermalExpansion, ppm/KOperating TemperatureRange, °C (°F)Dielectric Strength,KVac/mm (Vac / mil)Volume Resistivity,ohm-cmDielectric Constant@1,000 kHzDissipation Factor@ 1,000 kHzFlammability Rating(See UL File E140244)150 250 300 300 200 150 ASTM E831-50 to 150(-58 to 302)-50 to 150(-58 to 302)-50 to 150(-58 to 302)-50 to 150(-58 to 302)-70 to 200(-94 to 392)-70 to 200(-94 to 392)10 (250) 10 (250) 20 (500) 20 (500) 20 (500) 20 (500) ASTM D1491.0 x 10 14 1.0 x 10 14 1.0 x 10 13 1.0 x 10 13 1.0 x 10 13 1.0 x 10 13 ASTM D2578 6.5 4.0 4.0 3.9 3.9 ASTM D1500.010 0.013 0.001 0.001 0.010 0.010 ChomericsNot Tested HB Not Tested Not Tested Not Tested Not Tested UL 94RoHS Compliant Yes Yes Yes Yes Yes YesOutgassing, % TML(%CVCM)Shelf Life, months fromdate of manufactureDESCRIPTIONTHERM-A-FORM thermallyconductive silicone elastomerproducts are dispensable formin-placecompounds designed forheat transfer without excessivecompressive force in electronicscooling applications. These versatileliquid reactive materials can bedispensed and cured into complexgeometries for cooling of multiheightcomponents on a PCBwithout the expense of a moldedsheet. Each compound is availablein ready-to-use cartridge systems,eliminating weighing, mixing, anddegassing procedures.--ChomericsCertificationNot Tested 0.17 (0.10) 0.39 (0.29) 0.32 (0.21) 0.40 (0.18) Not Tested ASTM E5953 3 3 3 12 6 ChomericsPotting/UnderfillChomerics 27

THERM-A-FORM TM 1641, 1642, T642, T644, T646, T647FEATURES / BENEFITS• Dispensable form-in-place gapfilling, potting, sealing, and encapsulating• Excellent blend of high thermalconductivity, flexibility, and easeof use• Conformable to irregular shapeswithout excessive force on components• Ready-to-use cartridge systemeliminates weighing, mixing, andde-gassing steps• Variety of kit sizes and configurationsavailable to suit any application(handheldtwin-barrel cartridges, Semco ®tubes, and pneumatic applicators)• Vibration dampeningPRODUCT ATTRIBUTES1641• One-component moisture-cureRTV• Non-acetic acid generating1642• General duty, economicalthermal solution• Two-component thermallyconductive encapsulant/sealant/caulk/potting compoundT642• High thermal performance withflexibility• Ideal for underfilling• Low outgassingT644• Very low modulus material fortransferring heat from fragileelectronic componentsT646• Provides combination of highthermal performance and lowcostT647• Superior thermal performancewhile maintaining low modulus• Flows into complex geometriesto maintain intimate contactwith componentsOrdering InformationAPPLICATION INSTRUCTIONS35cc and 45cc Kits (See Figure1) Push safety latch (A) upward.Insert the pushrod (B) into theapplicator with the pushrod gearteeth facing downward. Insert thecartridge (C) into the slots on topof the applicator. Push the retainerclamp (D) down firmly to lock thecartridge in place. Remove thecartridge cap (E) with a 1/4 turncounter-clockwise. Attach the staticmixer (F) to the cartridge. (For the10:1 cartridge, make certain thatthe small notch on the mixer tubeface is toward the large barrelcontaining Part A.) Turn the mixertube 1/4 turn clockwise to lock itin place. Cut the tip of the mixingnozzle to obtain the desired beadsize, or attach a needle with theLuer adapter. After use, discard thestatic mixer and replace the cap onany remaining material.ProductPart NumberVolume(mass)Description164165-00-1641-000065-01-1641-00002.5 fuidounces(70 grams)12 fluidounces(340 grams)1-Component squeeze tube1-ComponentSEMCO ® cartridge1642 65-00-1642-0000277 grams(approx 120cc)1-Pint Plastic jar A / vial of BFigure 1: Typical ApplicatorMixpac ® Dispensing Systems are available frommultiple sources. When contacting Mixpac ®equipment suppliers, reference cartridge volume(cc) and dual element cartridge A:B mix ratio.Refer to table for volume and mix ratioinformation.T642T644T64665-00-T642-003565-00-T642-025065-00-T644-004565-00-T644-020065-00-T646-004565-00-T646-020035 cc(53 grams)250 cc(372 grams)45 cc(68 grams)200 cc(300 grams)45 cc(115 grams)200 cc(507 grams)10:1 Dual element Cartridge1:1 Dual element CartridgeMIXPAC is a trademark of ConProTec, Inc.SEMCO is a trademark of Semco, Inc.T64765-00-T647-004565-00-T647-020045 cc(125 grams)200 cc(560 grams)Chomerics 28

THERMAL GREASESHigh-Performance and General Duty Thermal GreasesDESCRIPTIONChomerics thermal greases offer arange of performance covering thesimplest to the most demandingthermal requirements. Thesematerials are screened, stenciled ordispensed and require virtually nocompressive force to conform undertypical assembly pressures. Theexcellent surface wetting results inlow interfacial resistance.• T670 is offered with a very highbulk thermal conductivity of3 W/m-K. Product offers lowimpedance as it will achieve athin bondline of about 0.001 in.• T660 contains solder fillersfor extremely low thermalimpedance at thinner bondlinethicknesses (down to about0.001in.).• T650 is a general duty grease fortypical applications.FEATURES/BENEFITS• Silicone based materials conductheat between a hot componentand a heat sink or enclosure• Fills interface variabletolerances in electronicsassemblies and heat sinkapplications• Dispensable, highly conformablematerials require no cure cycle,mixing or refrigeration• Thermally stable and requirevirtually no compressive force todeform under typical assemblypressures• Supports high powerapplications requiring materialwith minimum bond linethickness and high conductivity• Ideal for rework and field repairsituationsPhysicalThermalElectricalThermal GreasesTypical Properties T650 T660 T670 Test MethodColor Blue Light Gray White VisualSpecific Gravity 2.3 2.4 2.6 ASTM D792Viscosity, cps 190,000 170,000 350,000 NAOperating Temperature Range, ºC (ºF)-50 to +200(-58 to 392F)-50 to +200(-58 to 392F)-50 to +200(-58 to 392F)Melting Point, °C (°F) N/A 62 (144) N/A ASTM D3418Weight Loss % @150°C, 48 Hours 0.21 0.17 < 0.2 TGAThermal Impedance,°C-cm 2 /W (°C-in 2 /W) @ 100 psi 0.13 (0.02) @ 50°C0.13 (0.02) @ 65°C0.13 (0.02) @ 50°C0.06 (0.009) @ 65°C0.07 (0.01) @ 50°C0.07 (0.01) @ 65°CNAASTM D5470Apparent Thermal Conductivity, W/m-K 0.8 0.9 3.0 ASTM D5470Heat Capacity, J/g-K 1 1 1 ASTM E1269Coefficient of Thermal Expansion, ppm/K 300 300 150 ASTM E831Volume Resistivity, ohm-cm 10 14 N/A 10 14 ASTM D257Voltage Breakdown Vac/mil 150* N/A* 150* ASTM D149Thermal GreasesRegulatoryFlammability Rating Not Tested Not Tested Not Tested UL 94RoHS Compliant Yes Yes YesChomericsCertificationOutgassing, % TML 0.21 0.17

Thermal GreasesTYPICAL APPLICATIONS• Mobile, desktop, server CPUs• Engine and transmission controlmodules• Memory modules• Power conversion equipment• Power supplies and UPS• Power semiconductorsPRODUCT ATTRIBUTEST670 Highest ThermalPerformance• High bulk thermal conductivity• Extremely low thermalimpedance at thin and thickbondline thicknesses• Stencil screen printed partapplicationT660 High Performance• Dispersed solder spheresfor high performanceapplications above 62°C• Excellent thin bondlineperformance (less than0.02 - 0.03 in)MATERIAL APPLICATIONT650:Material is supplied in 3, 15 or 30ccsyringes for easy dispensing ontocomponents or heat sinks. Bulkpackaging is also available. Excessmaterial can be wiped with a cleancloth and suitable solvent.T660:Packaging the same as T650.For optimum performance, theprocessor should be allowed toreach temperatures greater than65ºC (149°F). This causes thesolder fillers to melt and conformto the mating surfaces, obtaining aminimum bondline thickness at theinterface. This process only needs tooccur one time to achieve optimumthermal performance of the grease.T670:T670 high performance thermalgrease is supplied in easy accessmetal cans or pails. Mix with aspatula and remove the desiredamount onto the component orstencil screen. Stencil desiredpad part size onto heat sink forimmediate assembly or shipping.T650 General Duty• Used on general purposeapplicationsOrdering InformationPart Number Examples65-00-T650-0003 = T650 Material in a 3 CC Syringe65-00-T670-3790 = T670 Material in a 3790 CC (Gallon Pail)Part Number:6500YYYYYYYY = Material(T670, T660 , or T650)ZZZZZZZZ = Volume in CC0003 = 3 cc syringe0015 = 15 cc syringe0030 = 30 cc syringe0300 = 300 cc cartridge3790 = 1 gallon pailChomerics 30

InsulatorsCHO-THERM ®Commercial Grade Thermally Conductive Electrical Insulator PadsDESCRIPTIONCHO-THERM ® CommercialGrade Thermal Insulator Padsare designed for use where solidthermal and electrical propertiesare required at an economicalprice. These products are offeredas dry pads, or with an optionaladhesive (PSA) layer for attachment.Materials with PSA are availabledie-cut on continuous rolls. Versionsare offered with either polyimide orfiberglass reinforcement to protectpads against tear, cut-through andpunctures.FEATURES / BENEFITS• Good thermal properties• Good to excellent dielectricstrength• Excellent mechanical strengthand puncture resistance• Available with and withoutacrylic PSA• UL recognized V-0 flammabilityrating• Meet RoHS specifications• Available on continuous rolls foreasy peel and stick applicationPhysicalCHO-THERM ® Commercial Grade Thermal Insulator PadsProperties T609 T444 1674 T441 MethodColor Lt. Green Beige Blue Pink VisualReinforcement Carrier Fiberglass Kapton ® MT Fiberglass Fiberglass VisualThickness, mm (inch) 0.25 (0.010) 0.08 (0.003) 0.25 (0.010) 0.20 (0.008) 0.33 (0.013) 0.46 (0.018) ASTM D374Thickness Tolerance,mm (inch)Operating TemperatureRange, ºC (ºF)± 0.025(0.001)-40 to +200(-40 to +392)± 0.013(0.0005)-40 to +200(-40 to +392)± 0.025(0.001)-40 to +200(-40 to +392)± 0.025(0.001)-40 to +200(-40 to +392)± 0.025(0.001)-40 to +200(-40 to +392)± 0.025(0.001)-40 to +200(-40 to +392)----Thermal Impedance,°C-cm 2 /W (°C-in 2 / W)2.1 (0.33) 2.4 (0.37) 2.6 (0.41) 2.6 (0.41) 3.6 (0.56) 4.1 (0.64) ASTM D5470ThermalElectricalMechanicalRegulatoryApparent ThermalConductivity, W/m-K1.5 0.4 1.0 1.1 1.1 1.1 ASTM D5470Heat Capacity, J/g-°C 1.0 1.0 1.0 1.0 1.0 1.0 ASTM E1296Coefficient of ThermalExpansion, ppm/°C150 400 300 300 300 300 ASTM E831Voltage Breakdown Dry, Vac 4,000 5,000 2,500 8,700 11,400 13,800 ASTM D149Voltage Breakdown Wet, Vac Not Tested Not Tested Not Tested 8,100 10,500 12,900 ASTM D149Volume Resistivity Dry,ohm-cmVolume Resistivity Wet,ohm-cm10 14 10 14 10 14 10 14 10 14 10 14 ASTM D257Not Tested Not Tested Not Tested 10 14 10 14 10 14 ASTM D257Tensile Strength, Mpa (psi) 26.9 (3,900) 20.7 (3,000) 10.3 (1,500) 19.3 (2,800) 17.3 (2,500) 13.8 (2,000) ASTM D412Tear Strength, kN/m (lb/in) 52.5 (300) 26.3 (150) 17.5 (100) 23.6 (135) 19.3 (110) 12.25 (70) ASTM D642Elongation, % 30 NA 2 40 40 40 ASTM D412Hardness, Shore A 70 90 85 80 80 80 ASTM D2240Specific Gravity 2.10 1.70 2.45 2.45 2.45 2.45 ASTM D792Flammability Rating(See UL File E140244)V-0 V-0 V-0 V-0 V-0 V-0 UL94RoHS Compliant Yes Yes Yes Yes Yes YesChomericsCertificationOutgassing, % TML (%CVCM) Not Tested Not Tested 0.45 (0.20) Not Tested Not Tested Not Tested E595Shelf-Life,months from shipment,Dry Pad (with PSA)KAPTON is a trademark of E.I. DuPont de Nemours and Company.24 (6) 12 (12) 24 (12) 24 (12) 24 (12) 24 (12) ChomericsChomerics 31

CHO-THERM ® Commercial Grade Thermal Insulator PadsTYPICAL APPLICATIONS• Power conversion equipment• Power supplies and UPS• Power semiconductors• Automotive electronics• Motor and engine controllers• Televisions and consumerelectronicsPRODUCT ATTRIBUTEST609• Good thermal and dielectricproperties• Economically priced• Best value for moderate to highperformance pad• PSA version available ineconomical kiss-cut format oncontinuous rollsT441• Superior dielectric strength(wet and dry)• Economically priced• Excellent for outdoor,high-humidity power supplies• PSA version available ineconomical kiss-cut formaton continuous rollsDie-cut parts on continuous rollsSlit rolls from ½” wide to 24” wideCustom die-cut parts on sheets, or as individual parts1674• Original commercial grade padwith good thermal and electricalperformance• Available in economical kiss-cutformat on continuous rolls (withand without PSA)• Passes NASA outgassingT444• Non-silicone with excellent dielectricand mechanical strength(polyimide interlayer)• Strong acrylic adhesive(one side)• Available in economical kiss-cutformat on continuous rollsHANDLING INFORMATIONThese products are defined byChomerics as “articles” according tothe following generally recognizedregulatory definition for articles:Ordering InformationThermal insulator pads are available in the following formats.Contact Chomerics for custom widths, part sizes, etc.An article is a manufactured item“formed to a specific shape ordesign during manufacturing,”which has “end use functions”dependent upon its size and shapeduring end use and which hasgenerally “no change of chemicalcomposition during its end use.”In addition:• There is no known oranticipated exposure tohazardous materials/substances during routine andanticipated use of the product.• The product’s shape, surface,and design is more relevantthan its chemical composition.These materials are not deemed byChomerics to require an MSDS. Forfurther questions, please contactChomerics at 781-935-4850.Part Number:60 = Standard die-cutPart6W XX YYYY ZZZZ4 = Roll Stock6 = Roll Stock with PSA9 = Custom die-cut part11 = without PSA12 = with PSA one side10= 100 ft Roll Stock40 = 400 ft Roll Stock11 = without PSA12 = with PSA one sideYYYY = Custom 4-digit part number.Contact Chomerics.0075= 0.75 in0100= 1.00 in0150= 1.50 in0200= 2.00 in1150 = 11.5 in.2400 = 24 in.0800 = 8 in.1600 = 16 in.1100 = 11 in.2200 = 22 in.YYYYY = Custom Part Number.Contact ChomericsZZZZ = Material class(1674, T441, T444, T609)Chomerics 32

InsulatorsCHO-THERM ®High Power Thermally Conductive Electrical Insulator PadsDESCRIPTIONCHO-THERM ® HIGH-POWERTHERMAL INSULATOR PADS arethermally conductive materialsdesigned for use where thehighest possible thermal, dielectric,and mechanical properties arerequired.Fiberglass cloth reinforcementstrengthens CHO-THERM ® padsagainst tear, cut-through andpunctures.These materials are availablein sheet form and die-cutconfigurations. An optional adhesivelayer (with PSA) is available on oneor two sides. With a proven trackrecord spanning several decadesin multiple applications, theseproducts are the first choice forhigh-end power supplies, industrial,aerospace, and military/avionicsapplications.Available in several different formsto suit various applications.FEATURES / BENEFITS• Excellent thermal properties• High dielectric strength• Excellent mechanical strengthand puncture resistancePhysicalThermalElectricalMechanicalRegulatoryCHO-THERM ® High Power Insulator PadsTypical Properties T500 1678 1671 MethodColor Green Pink White VisualReinforcement Carrier Fiberglass Fiberglass Fiberglass --Thickness, mm (inch) 0.25 (0.010) 0.25 (0.010) 0.38 (0.015)* ASTM D374Thickness Tolerance mm (inch)Operating Temperature Range,ºC (ºF)0.050(± 0.002)-40 to +200(-40 to +392)0.050(± 0.002)-40 to +200(-40 to +392)0.050(± 0.002)-40 to +200(-40 to +392)Thermal Impedance, °C-cm 2 /W (°C-in 2 / W) 1.2 (0.19) 1.26 (0.20) 1.48 (0.23) ASTM D5470Apparent Thermal Conductivity, W/m-K 2.1 2.0 2.6 ASTM D5470Heat Capacity (J/g-°C) 1.0 1.0 1.0 ASTM E1269Coefficient of Thermal Expansion (ppm/K) 250 250 250 ASTM E831Voltage Breakdown Dry, (Vac) 4,000 2,500 4,000 ASTM D149Volume Resistivity Dry, (ohm-cm) 10 16 10 16 10 16 ASTM D149Dielectric Constant at 1,000 kHz 3.5 3.6 3.6 ASTM D150Dissipation Factor at 1,000 kHz 0.003 0.007 0.007 Chomerics TestTensile Strength, Mpa (psi)20.7(3,000)20.7(3,000)20.7(3,000)----ChomericsTear Strength, kN/m (lb/in) 70 (400) 35 (200) 70 (400) ChomericsElongation, % 20 20 15 ChomericsHardness, Shore A 80 80 80 ASTM D2240Specific Gravity 1.60 1.55 1.55 ASTM D792Flammability Rating(See UL File E140244)V-0 V-0 HB UL 94RoHS Compliant Yes Yes YesChomericsCertificationOutgassing, % TML (%CVCM) 0.40 (0.10) 0.55 (0.12) 0.76 (0.07) ASTM E595Shelf-Life,months from shipment, Dry Pad (with PSA)24 (18) 24 (18) 24 (18) Chomerics* 1671 material is available in custom thicknesses.Chomerics 33

CHO-THERM ® High Power Thermal Insulator PadsFeatures/Benefits...cont.• 100% inspected for dielectricproperties on every sheet• PSA attachment option available• UL recognized flammabilityratings• Meets RoHS specifications• Extremely low NASA outgassing• Proven through decades of usein demanding military andaerospace applicationsTYPICAL APPLICATIONS• Power conversion equipment• Power supplies and UPS• Power semiconductors• Automotive electronics• Motor and engine controllers• Televisions and consumerelectronicsPRODUCT ATTRIBUTEST500• Best thermal performance• Excellent dielectric properties1671• Highest reliability in rigorousapplications• Proven in aerospace/defenseapplications1678• Economically-priced• Low thermal impedanceHANDLING INFORMATIONThese products are defined byChomerics as “articles” accordingto the following generallyrecognized regulatory definition forarticles:An article is a manufactured item“formed to a specific shape ordesign during manufacturing,”which has “end use functions”dependent upon its size and shapeduring end use and which hasgenerally “no change of chemicalcomposition during its end use.”In addition:• There is no known oranticipated exposure tohazardous materials/substances during routine andanticipated use of the product.• The product’s shape, surface,and design is more relevantthan its chemical composition.These materials are not deemed byChomerics to require an MSDS. Forfurther questions, please contactChomerics at 781-935-4850..Sheets 8” X 10” or 17” X 21”Custom die-cut parts on sheets, or as individual partsOrdering InformationThermal insulator pads are available in the following formats.Contact Chomerics for custom widths, part sizes, etc.Part Number:60 = Standarddie-cut part1 = Sheet Stock2 = Sheet stockwith PSA 1 Side3 = PSA 2 SidesW XX YYYY ZZZZ11 = without PSA12 = with PSA one side13 = PSA 2 SidesXX = material thickness inmils (1671 material availableup to 60 mils)YYYY = Custom 4- part alpha/numericpart number. Contact Chomerics.YYYY = 0808 8” X 8” Sheet0810 = 8” X 10” SheetZZZZ = Material class(T500, 1671, or 1678)9 = Customdie-cut part11 = without PSA YYYYY = Custom Part Number.12 = with PSA one side Contact ChomericsChomerics 34

InsulatorsHow to Order Die-Cut CHO-THERM ® InsulatorsStandard die-cut parts are ordered using the following part number system. For custom parts, contact Chomerics.Part Number:60 XX YYYY ZZZZ60 = standard die cut part11 = No PSA12 = PSA one sideStandard ConfigurationDrawing NumberCHO-THERM ® MaterialExample: 1671, T500, etc.RecommendedScrew TorqueConfigurationDimensions (inches)A B C D E F GOrdering Number#4-40 5 in-lb#6-32 6 in-lb1.5631.5631.5931.6501.6501.6501.6501.6501.6501.7001.7301.7801.7801.7802.071.0501.0501.1001.0651.1401.1401.1401.1401.1401.1871.2501.2501.2501.2501.560.1400.1400.1560.1400.1220.1400.1650.1400.1650.1560.1560.1400.1650.1400.1220.0800.1400.0700.0460.0620.0930.0620.046-0.0620.0620.0930.0940.0460.062WW-XX-D065-ZZZZWW-XX-4305-ZZZZWW-XX-4511-ZZZZWW-XX-D370-ZZZZWW-XX-D371-ZZZZWW-XX-6875-ZZZZWW-XX-D372-ZZZZWW-XX-D373-ZZZZWW-XX-D374-ZZZZWW-XX-4996-ZZZZWW-XX-5442-ZZZZWW-XX-D375-ZZZZWW-XX-D376-ZZZZWW-XX-D377-ZZZZWW-XX-D378-ZZZZ#4-40 5 in-lb#6-32 6 in-lb1.65 1.140 0.140 0.093 1.187 0.430 WW-XX-D379-ZZZZ#4-40 5 in-lb#6-32 6 in-lb1.5601.5631.0501.0500.1580.1560.0800.0631.1701.187WW-XX-D380-ZZZZWW-XX-D381-ZZZZ#4-40 5 in-lb#6-32 6 in-lb1.650 1.187 0.156 0.60 WW-XX-D382-ZZZZ#4-40 5 in-lb#6-32 6 in-lb1.650 1.140 0.165 0.040 WW-XX-D383-ZZZZChomerics 35

RecommendedScrew Torque#4-40 3 in-lb#6-32 4 in-lbConfiguration Dimensions (inches) Ordering NumberA B C D E F G1.2501.3121.3751.4400.7000.7620.8251.0000.1400.1400.1400.1400.0620.0620.0620.075WW-XX-4353-ZZZZWW-XX-5527-ZZZZWW-XX-4997-ZZZZWW-XX-D384-ZZZZ#4-40 3 in-lb#6-32 4 in-lb1.275 0.750 0.156 0.100 0.960 WW-XX-D385-ZZZZ#4-40 3 in-lb#6-32 4 in-lb1.312 0.762 0.140 0.062 0.960 0.200 0.100 WW-XX-D386-ZZZZ#4-40 3 in-lb#6-32 4 in-lb1.440 1.000 0.140 0.055 0.960 0.480 0.325 WW-XX-D387-ZZZZ#4-40 3 in-lb#6-32 4 in-lb1.35 0.800 0.140 0.400 WW-XX-D388-ZZZZ#4-40 2 in-lb 0.4370.4370.5000.6100.6870.7100.7500.7500.7500.7500.7500.7500.8550.8550.8601.1251.4100.3120.3120.3850.5600.5620.5000.4100.5000.5000.5000.6000.6000.5620.6300.7400.6250.8100.1400.1400.1700.2450.2180.1600.225---0.1870.1870.2400.2400.2180.2300.2000.2000.3550.0930.1220.1200.1250.1250.1410.156---0.1470.1250.1500.1150.1250.0930.1600.1450.147WW-XX-D389-ZZZZWW-XX-D390-ZZZZWW-XX-D391-ZZZZWW-XX-D392-ZZZZWW-XX-5791-ZZZZWW-XX-8302-ZZZZWW-XX-D393-ZZZZWW-XX-8531-ZZZZWW-XX-6956-ZZZZWW-XX-D394-ZZZZWW-XX-D395-ZZZZWW-XX-D396-ZZZZWW-XX-D397-ZZZZWW-XX-D398-ZZZZWW-XX-D399-ZZZZWW-XX-D400-ZZZZWW-XX-D401-ZZZZ#4-40 2 in-lb 0.9100.9830.5000.7500.2000.4320.1250.1560.5800.6650.0460.1010.2650.217WW-XX-402-ZZZZWW-XX-D403-ZZZZChomerics 36

RecommendedScrew TorqueConfiguration Dimensions (inches) Ordering NumberA B C D E F G#4-40 2 in-lb 1.00 0.500 0.200 0.141 0.626 WW-XX-4969-ZZZZ#10-32 2 in-lb#25-28 7 in-lbDIODE WASHERSDO-40.3600.5100.5100.5120.6250.2600.1400.2000.1610.195WW-XX-D404-ZZZZWW-XX-D405-ZZZZWW-XX-D406-ZZZZWW-XX-D407-ZZZZWW-XX-4659-ZZZZDO-50.7500.8000.8000.8120.8120.8751.0001.0001.1801.2501.5001.5000.1250.1900.2600.1150.1450.3130.1400.2550.5150.3800.2000.500WW-XX-D408-ZZZZWW-XX-D409-ZZZZWW-XX-D410-ZZZZWW-XX-D411-ZZZZWW-XX-D412-ZZZZWW-XX-D413-ZZZZWW-XX-D414-ZZZZWW-XX-4661-ZZZZWW-XX-D415-ZZZZWW-XX-D416-ZZZZWW-XX-D417-ZZZZWW-XX-D418-ZZZZTO-36 1.063 0.690 0.200 WW-XX-4306-ZZZZTO-5 and TO-183 holes0.25003600.3900.1000.2000.2000.0360.0400.040WW-XX-D419-ZZZZWW-XX-4374-ZZZZWW-XX-D420-ZZZZ4 holes0.2500.3600.3900.1000.2000.2000.0360.0400.040WW-XX-D421-ZZZZWW-XX-D422-ZZZZWW-XX-D423-ZZZZ#4-40 2 in-lb RECTIFIER 0.1001.1251.2500.1001.1251.2500.1870.1400.200WW-XX-D424-ZZZZWW-XX-D425-ZZZZWW-XX-D426-ZZZZ#4-40 2 in-lb TIPPACKAGE0.8650.8650.9840.9841.2600.6500.6500.7870.7870.7870.6500.650---0.7800.9840.1400.140---0.1420.142WW-XX-5792-ZZZZWW-XX-D427-ZZZZWW-XX-D428-ZZZZWW-XX-D429-ZZZZWW-XX-D430-ZZZZ(1 in-lb = 1.152 kg-cm)Chomerics 37

T-WING ® and C-WING TMHeat SpreadersThin Heat SpreadersDESCRIPTIONChomerics’ family of thin heatspreaders provides a low-cost,effective means of cooling ICdevices in restricted spaceswhere conventional heat sinks areinappropriate.T-Wing spreaders consist of 5oz.(0.007inch/0.18mm thick) flexiblecopper foil between electricallyinsulating films. High strengthsilicone PSA (pressure-sensitiveadhesive) provides a strong bondto the component. The compliantnature of these “thermal wing” heatspreaders permits nearly 100%adhesive contact with non-flatpackage surfaces, optimizingthermal and mechanicalperformance.C-Wing spreaders are a ceramicversion available for EMI-sensitiveapplications. They consist ofaluminum oxide substrates with thesame silicone PSA used on T-Wingheat spreaders.FEATURES/BENEFITS• Component junctiontemperature reduction of10-20°C is common• Easily added to existingdesigns to lower componenttemperatures and improvereliability• Custom shapes available forcomplex designsTYPICAL APPLICATIONS• Microprocessors• Memory modules• Laptop PCs and other highdensity, handheld portableelectronics• High speed disk drivesC-Wing• Used where localized sensitivityto EMI (electromagneticinterference) exists• Low profile• Peel and stick applicationT- Wings• Low profile (0.33mm/0.013in)allows use in limited spaceenvironments• Easy peel and stick adhesion toall surfaces, including packageswith residual silicone moldrelease• Offers low cost cooling for manypackage typesPhysicalElectricalRegulatoryT-WING ® and C-WING Heat SpreadersTypical Properties T-Wings C-Wings Test MethodColor Black Tan VisualTotal Thicknesses, mm (inches) 0.33 (0.013 ) 1.53 (0.060) ASTM D374PSA Type Silicone based Silicone based --PSA thickness, mm (inches) 0.05 (0.002) 0.076 (0.003) VisualInsulator Type Black polyester N/A --Insulator Layer Thickness, mm (inches) 0.025 (0.001) N/A --Weight, oz/inch 2 0.039 0.076 --Themal Conductor Copper Aluminum Oxide --Thermal Conductor Thickness, mm (inches) 0.178 (0.007) 1.6 (0.063) --Dielectric Strength,KVac/mm (Vac / mil)200 (5,000)(for each dielectric layer)12 (300) ASTM D149Volume Resistivity, (ohm-cm) N/A >10 14 ASTM D149Dielectric Constant @1,000 MHz N/A 9.1 ASTM D150Dissipation Factor @ 1,000 kHz N/A 0.001 Chomerics TestFlammability Rating (See UL File E140244) V-0 Not Tested UL 94RoHS Compliant Yes YesChomericsCertificationShelf Life, months from date of manufacture 12 12 ChomericsChomerics 38

T-Wing ® and C-Wing TM Heat SpreadersT-Wings Continued...• Low application force(

Thermal Management GlossaryAlumina (Al 2O 3): A relativelyinexpensive ceramic in powder orsintered sheet form. Its thermalconductivity of 30 W/m-K andexcellent dielectric properties makeit useful in low to moderate powercommercial applications.Ambient Temperature: Thetemperature of the air surroundinga heat source.Apparent Thermal Conductivity:This value differs from thermalconductivity as apparent thermalconductivity also includes contactresistance when measured, asdescribed in the Heat TransferFundamentals section of this guide.Also see Thermal Conductivity.Arcing: An electrical dischargebetween the edges of metalsemiconductor package and themetal heat sink on which it ismounted.Binder: A polymer (i.e. silicone,urethanes, acrylic, epoxy etc.) usedin thermal interface materialsto provide desired mechanical,thermal and electrical propertiesand hold in a stable form the fillerswhose primary purpose is thetransfer of heat. Binders are alsogood electrical insulators.Bondline Thickness: Averagethickness between heat spreadingdevice and components.Boron Nitride (BN): A non-abrasiveceramic material that has higherthermal conductivity than alumina.Because it is an expensive rawmaterial, it is usually used in highperformance interface materials.Breakdown Voltage: The amountof voltage required to cause adielectric failure through aninsulator when tested under a set ofspecific conditions. This value doesnot imply that the insulator can beoperated at those voltages.Burr: A thin ragged fin left onthe edge of a piece of metal(semiconductor package or heatsink) by a cutting or punching tool.Calorie: A unit of energy equalto the quantity of heat required toraise the temperature of 1 gram ofwater by one degree celcius.Ceramic: A name given to oxides ofmetals. Ceramics are usually hard,heat and corrosion resistant andhigh dielectric strength powdersthat can be formed into shapes byfusion or sintering.Chamfer: A bevel cut into the edgeof heat sink mounting holes.Compression Set: The permanentdeformation of an elastomericmaterial caused by a compressiveforce.Conduction: The transfer of heatenergy through matter.Convection: The transfer of heatthat results from motion of a fluid(gas or liquid).Corona: An electrical dischargewithin or on an insulatoraccompanied by ionization of theair within or contacting the surfaceof the insulator. Also called partialdischarge. It is the main mode ofinsulation failure exposed to longterm AC voltages.Creep Distance: The distance thatan insulator has to extend beyondthe edge of a semiconductorpackage to prevent arcing.Cut-Through: A phenomenonthat occurs when sharp edges orburrs on the metal semiconductorpackage or heat sink cut throughthe thermal pads and reduce oreliminate their insulating strength.Deflection: The change inthickness of an elastomericinterface material in response to acompressive load. Because thesematerials are incompressible,deflection is accompanied by aproportional increase in area.Degreaser or Degreasing Solvent:The solvent used to clean fluxand other organic residues offprinted circuit boards after they aremanufactured. Interface materialsmust be able to tolerate exposureto degreasing solvents withoutdegrading performance.Dielectric: A material that acts asan insulator.Dielectric Constant: SeePermittivity.Dielectric Strength: The voltagegradient, expressed as kV/mm, thatwill cause a dielectric failure inan insulating material under veryspecific test conditions. Dielectricstrength does not imply that theinsulator can withstand thosepotential gradients for an extendedperiod of time.Durometer: An instrument formeasuring the hardness of rubber.Measures the resistance to thepenetration of an indentor point intothe surface of the rubber.Electrical Insulator: A materialhaving high electrical resistivityand high dielectric strength andtherefore suitable for separatingcomponents at different potentialsto prevent electrical contactbetween them.Filler: A fine, dispersibleceramic or metallic powder (i.e.boron nitride, alumina, graphite,silver flake, etc.) whose thermalconductivity is at least twenty timesgreater than that of the binder.Flow Rate: The volume, mass, orweight of a fluid passing throughany conductor per unit of time,expressed in gallons -or liters-perhour.Chomerics 40

Flux: An organic compound used toenhance the wetting and adhesionof metal solder to the coppersurfaces on printed circuit boards.Junction: The junction is the activepart of a semiconductor, usuallysilicon, where the current flowcauses heat to be generated.Radiation: A heat transfer processwhereby heat is given off throughelectromagnetic radiation, usuallyinfrared rays.Footprint: The area of the base ofan electronic device which comesin contact with a thermal interfacematerial.MBLT: Minimum bond linethickness. When two opposingsubstrates obtain closest possibledistance under pressure.Reinforcement: A woven glassmesh or polymer film that is usedas a support in thermal interfacematerials.Hard Tooling: A die cutting toolmanufactured from a machinedmetal block. The cost is high,therefore it is normally used whenlong runs are anticipated.Hardness: A measure of theability of a material to withstandpenetration by a hard pointedobject. Regarding thermal interfacematerials, this property is usuallyinversely proportional to the abilityof a material to conform to unevensurfaces.Hardness Shore A (Shore D, Shore00): An instrument reading on ascale of 0 to 100 measuring thehardness of a material. There arethree scales: Shore 00, A and D.Shore 00 is used for soft rubberslike gels, Shore A is used for hardrubbers and Shore D for inelasticplastics.Heat (Q): A form of energygenerated by the motion of atomsor molecules. Heat energy isexpressed in units of joules.Heat Flow: The rate at which heatis flowing per unit time expressedas Watts.Heat Flux (Q/A): The rate ofheat flow per unit surface areaexpressed as Watts / cm 2 .Heat Transfer: The movementof heat from one body to another(solid, liquid, gas, or a combination)by means of conduction, convection,or radiation.Interface: A boundary that existsbetween any two contactingsurfaces. There are five types ofinterfaces that can exist betweenthe different forms of matter:gas-liquid, liquid-liquid, gas-solid,liquid-solid, and solid-solid.Micro-inch: This unit of measure,a millionth of an inch, is used todescribe the roughness of a surfaceand is the average distance betweenthe peaks and valleys on thesurface.Mil: A unit of length equal to onethousandthof an inch.PCM: Abreviation of phase changematerial.Permeability: A measure ofa material’s ability to align itsmagnetic domains in response to anapplied magnetic field.Permittivity: A measure of adielectric material’s ability topolarize in response to an appliedelectric field, and transmit theelectric field through the material.Polyimide: An organic polymer withexceptional electrical insulation andhigh temperature capabilities. Infilm form, it is used on everythingfrom printed circuit boards to spacesuits.Power Supply: A self containedunit which converts AC current toDC for use in electronic devices.Pressure Sensitive Adhesive (PSA):An adhesive that is tacky at normaltemperatures and requires onlyslight pressure to form a permanentbond. A PSA requires no furthercure to maintain the bond.PSH: Class of polymer solderhybrid. A synergistic blend ofeutectic solder and specialtypolymers. They provide a highlyreliable thermal interface materialwith a resin carrier and fillercontent that both melt to obtainminimum bond line thickness.Permanent Set: Permanent Set isdefined as the amount of residualdisplacement in a rubber partafter the distorting load has beenremoved.Relaxation: Stress Relaxation isa gradual increase in deformationof an elastomer under constantload over time, accompanied by acorresponding reduction in stresslevel.Rheology: The science of thedeformation and flow of materials.Semiconductor: An electronicmaterial that can be an insulatorunder one condition and switchto a conductor under a differentconditionSilicon: A non-metallic elementoccurring extensively in the earth’scrust in silica and silicates. Siliconis the basis for the junction found inmost semiconductor devices.Solder: A mixture of metals that isused to connect electronic devicesto the copper patterns on a printedcircuit board.Solvent Resistance: The ability ofthermal management products toresist swelling when exposed toorganic solvents such as degreasingsolvents, hydraulic fluids, coolantsand jet fuel.Specific Gravity: The ratio of thedensity of a substance to the densityof water. The specific gravity ofwater is 1 at standard conditiontemperature and pressure.Steel Mill Die: A die cutting tool ofmoderate cost, cast from steel. It isused for high speed cutting.GlossaryChomerics 41

Steel Rule Die: A low cost diecutting tool manufactured byshaping sharpened steel foil tothe desired shape and fixing in aplywood and steel rule metal. It isused for short runs.Surface Finish: A measure of theroughness of a surfaces, usuallyexpressed in units of micro-inches.Swelling: A phenomenon thatresults when an elastomer isexposed to a degreasing solvent andthe elastomer absorbs the solvent.The volume of the elastomerincreases and its physical strengthis greatly reduced. In this swollenstate, the elastomer can be easilydamaged and should not besubjected to any mechanical stressuntil the elastomer has been dried.Tear Strength: A measure of theability of a material to withstandtearing/ ripping stresses. It isusually measured in pounds forceper inch of thickness.Temperature: A measure ofthe average kinetic energy ofa material. The standard unitof temperature is a Kelvin, (K).Temperature determines thedirection of heat flow between anytwo systems in thermal contact.Heat will always flow from the areaof higher temperature (T source) toone of lower temperature (T sink).Temperature Gradient (∆T): Thedifference in temperatures in thedirection of the heat flow betweentwo points in a system.Tensile Strength: A measure of theability of a material to withstand atension (pulling apart) force. It isusually measured in MPa or psi ofmaterial cross section.Thermal Conductivity (K): Aquantitative measure of the abilityof a material to conduct heatexpressed in units of W/m-K.Thermal Contact Resistance (R i):The resistance to the flow of heatcaused by interstitial air trappedin the irregularities of betweencontacting solid surfaces. Units areK-cm 2 /W.Thermogravimetric Analysis:Chemical analysis by themeasurement of weight changes ofa system or compound as a functionof increasing temperature.Thermal Impedance (θ): Thermalimpedance is the sum of thethermal resistance of an interfacematerial and the thermalresistances at the interfaces incontact with the material. K-in 2 /Watt.TIM: Thermal interface material.Thermal Interface Materials(TIMs): Materials that are insertedbetween two contacting solidsurfaces and aid heat flow byeliminating gaps between theirregular surfaces. Interstitialair is replaced by material that issignificantly more conductive thanair.Thermal Resistivity: Thequantitative measure of a material’sresistance to the conduction ofheat. (It is the inverse of thermalconductivity.)Thermocouple: A thermoelectricdevice consisting of two dissimilarmetallic wires fused into abead which generates a voltageproportional to the temperature ofthe bead.Thixotropic: A characteristic of aliquid whereby the application ofa shear causes a reduction in theviscosity of that liquid. The liquid issaid to be shear thinning. Polymersolutions filled with dispersedparticles exhibit thixotropicbehavior. Example: toothpaste isthixotropic. It is solid when leftalone, but when squeezed (sidewaysforce) it flows much like a liquid.Tolerance: The permissiblevariations in the dimensions offormed parts.Torque: A turning or twisting thatis equal to the value of the force (f)multiplied by the rotational distanceover which it is applied (usuallymeasured in ft-lbs.).Viscoelastic material: A materialwhose response to a deformingload combines both viscous (doesnot recover its original shape/ sizewhen load removed) and elastic(will recover size/shape when loadremoved) qualities. The commonname for such a material is“plastic.”Volume Resistivity: A measureof a material’s inherent electricalresistance expressed as ohm-cm.Watt: An SI unit of power equal toone joule per second.Chomerics 42

Parker Safety GuideParker Safety Guide for Selecting and Using Parker Seals, Isolation Devices, EMI Shielding Materials, Thermal ManagementMaterials and Related Accessories!WARNING – USER RESPONSIBILITYFailure or improper selection or improper use of Parker seals, isolation devices, EMI shielding, thermal managementmaterials, or related accessories can cause equipment failure or damage, personal injury or death.Possible consequences of such failure, improper selection or improper use include, but are not limited to:• Contamination of systems and environments from leaking fluids or gases.• Ingress of dust, fluids or other substances.• High velocity fluid discharge.• Physical contact with released fluids or gases that may be hot, cold, toxic or otherwise injurious.• Contact with suddenly moving, falling or suddenly halted objects that are to be held in positionor moved in part or fully by the function of the product.• Improper function or failure of host devices or equipment, or connected devices or equipment.• Burn-inducing temperatures, smoke or flame from overheated devices or equipment.• Injuries resulting from inhalation, ingestion or physical exposure to solvent-based systems.Before selecting or using any Parker seals, isolation devices, EMI shielding, thermal management materials,or related accessories, it is important that you read and follow the following instructions:1.0 GENERAL INSTRUCTIONS1.0.1 ScopeThis safety guide provides instructionsfor selecting and using (includingdesigning, assembling, installingand maintaining) seals (including allelastomeric, polymeric, thermoplastic,metallic and/or plastic products commonlycalled ‘seals’); isolation devices(including elastomeric, polymeric,thermoplastic and/or thermoplastic inthe form of boots, bearings, bellows,bushings, grommets, and/or vibrationisolation mounts); EMI (electromagneticinterference) shielding (including allconductive elastomers, metal-basedmaterials, conductive fabrics and conductivefabric-based materials, conductivepaints, conductive adhesivesand caulks, metal/plastic laminates,and/or conductively coated or platedsubstrates commonly referred to as‘EMI shielding ’); and thermal managementmaterials (including thermallyconductive elastomer or acrylic-basedinterface materials, thermally conductiveadhesive tapes, metal or ceramicbasedheat spreaders, thermallyconductive adhesives and caulks, and/or solder/film-based thermally conductiveassemblies) manufactured orsold by the world wide Parker Hannifinorganization (including its Chomericsoperations) . It also includesrelated accessories (including mountinghardware, surface preparationsolvents, protective liners, applicationsystems, containers and packagingmaterials). All such devices are collectivelyreferred to as “Products” inthis safety guide. This safety guide isa supplement to and is to be used withthe specific Parker publications forthe specific seals, isolation devices,EMI shielding, thermal managementmaterials, and related accessories thatare being considered for use.1.0.2 Fail-SafeProducts can and do fail withoutwarning for many reasons. Design allsystems and equipment in a fail-safemode, so that failure of the Productswill not endanger persons or property.1.0.3 DistributionProvide a copy of this safety guide toeach person who is responsible fordesigning, specifying, selecting,purchasing of these Products. Do notselect these Products without thoroughlyreading and understanding thissafety guide as well as the specificParker publications for the productsconsidered or selected.1.0.4 User ResponsibilityDue to the wide variety of operatingconditions and uses for these Products,Parker and its distributors do not representor warrant that any particularProduct is suitable for any specific enduse system. This safety guide doesnot analyze all technical parametersthat must be considered in selectinga product. The users, through theirown analyses and testing, are solelyresponsible for:• Making the final selection ofthe seal, isolation device, EMIshielding product or thermalmanagement material.• Assuring that the users’ requirementsare understood andmet and that the use presentsno health or safety hazards.• Providing all appropriate healthand safety warnings on andwith the equipment on whichthe seals, isolation devices, EMIshielding or thermal manage-Safety GuideChomerics 43

ment materials are used.1.0.5 Additional QuestionsContact the appropriate Parker applicationsengineering department oryour Parker representative if you haveany questions or require any additionalinformation. See the Parker publicationor web pages for the product beingconsidered or used, for telephonenumbers and/or e-mail addresses ofthe appropriate applications engineeringdepartment.2.0 SEALING PERFORMANCE2.0.1 Sealing Performance: SealsIn general, seals are used to maintainan unbroken sealing line separatingadjoining volumes of media or fluid,under all normal operating conditions.Some seals may be designed to provideother functions (e.g., mechanical checkvalves). Maintaining the sealing linemay be necessary when that line isformed on a surface that remains stationaryrelative to the seal (i.e., staticsealing). Or, the sealing line may beformed against a surface that moves(i.e., dynamic sealing). Numerouscriteria are involved in typical sealingdesigns, including choice of sealingmaterial, gland design, and/or otherseal retention and mating features,etc. Specific sealing requirementsand the performance of any relatedsealing system must be clearly definedfor every given application in order toselect the best sealing solution. Theuser should provide these definitions,ideally in partnership with applicationssupport from Parker at the earliestpossible stages of the design process.2.0.2 Sealing Performance:Isolation DevicesMany isolation devices are used toprevent ingress of environmentalcontaminants, including moisture,grease and dirt under normal operatingconditions, while isolating noise,vibration and harshness. Other isolationproducts are used for absorbingshock, reducing equipment noise andinsulating against vibration. Performancesafety concerns should includethe ability of the Parker isolationdevice to prevent contaminant ingress,and/or isolate noise, vibration, andshock depending on the application requirements.The user should provideParker application engineers with theisolation performance criteria early inthe design stages to optimize materialchoices and overall design/use ofthe isolation device. Certain isolationdevice solutions may be designed to incorporateseparate and distinct sealingsystems. For these applications, thespecific sealing performance shouldalso adhere to the goals described inSection 2.0.1.2.0.3 Sealing Performance: EMIShieldingEMI shielding materials are used toreduce the transmission of electromagneticenergy. While many EMIshielding materials may also providesome level of sealing, any specificsealing performance requirementsshould adhere to the goals describedin Section 2.0.1 above. Certain EMIshielding solutions may be designedto incorporate separate and distinctsealing systems. For these applications,the specific sealing performanceshould also adhere to the goalsdescribed in Section 2.0.1. Other typesof EMI shielding materials provide nosealing performance, inconsequentialsealing performance, or widelyvaried sealing properties. Finally, EMIshielding materials, like other materialsused in a given design, may affectthe performance of proximate sealingsystems. The above factors should beconsidered in the design stages andspecification of EMI shielding (andseals), ideally in partnership with applicationssupport from Parker at theearliest possible stages of the designprocess.2.0.4 Sealing Performance:Thermal Management MaterialsThermal management materials areused to assist in the transmission ofheat energy. Some thermal managementproducts may also provide somelevel of sealing, but any specific sealingperformance should adhere to thegoals described in Section 2.0.1 above.Certain thermal management solutionsmay be designed to incorporateseparate and distinct sealing systems.For these applications, specific sealingperformance should also adhere to thegoals described in Section 2.0.1. Othertypes of thermal management materialsprovide no sealing performance,inconsequential sealing performance,or widely varied sealing properties.Finally, thermal management materials,like other materials used in a givendesign, may affect the performanceof proximate sealing systems. Theabove factors should be considered inthe design stages and specification ofthermal management materials (andseals), ideally in partnership with applicationssupport from Parker at theearliest possible stages of the designprocess.2.1 ELECTRICALCONDUCTIVITY2.1.1: Electrical Conductivity:SealsExtreme care must be exercised whenselecting seals for applications inwhich electrical conductivity or nonconductivityis a factor. Parker sealsdesigned for sealing against liquidsand gases may be developed with electricallyconductive properties to meetspecific application requirements.Conversely, non-conductive seals canbe provided for applications prohibitingelectrical conductivity.The electrical conductivity or non-conductivityof Parker seals is dependentupon many factors and may be susceptibleto change. These factors include,but are not limited to, the materialsused to make the seal and/or relatedparts (including seal-bearing assembliesprovided by Parker), how andwhere the seals and/or related partsare installed, moisture content of theseal at any particular time, and otherfactors. Users should be aware of anysafety-related issues with using electricallyconductive, or insulating, sealsin a given application. These concernsshould be documented and discussedwith Parker before or during the sealselection process.2.1.2: Electrical Conductivity:Isolation DevicesMost isolation device materials aremade from elastomeric, polymeric,thermoplastic or plastic materials thatare typically non-conductive. However,some isolation devices are fabricatedwith conductive features, e.g., metalframes, threaded fasteners, metallicsealing materials, etc. Users shouldbe aware of any safety-related issueswith using electrically conductive, orinsulating, isolation devices in a givenapplication. These concerns shouldbe documented and discussed withParker before or during the isolationdevice selection process.Chomerics 44

2.1.3: Electrical Conductivity:EMI ShieldingParker EMI shielding materials areinherently electrically conductive,which is essential to providing shieldingperformance. Levels of conductivityvary by product type and factors ofapplication. Thus, care should be usedwhen selecting these materials. EMIshielding products can be designedwith non-conductive elements, (e.g.,mounting features) depending on theapplication requirements.The electrical performance of ParkerEMI shielding is dependent upon manyfactors and may be susceptible tochange. These factors include but arenot limited to the various materialsused to make the EMI shielding and/orrelated parts (including shielding assembliesprovided by Parker), how andwhere the EMI shielding and/or relatedparts are installed, moisture contentof the shielding at any particular time,corrosion over time, and gap mechanics(stiffness, fastener spacing, etc.).2.1.4: Electrical Conductivity:Thermal Management MaterialsExtreme care must be used when selectingthermal management productsin which electrical conductivity or nonconductivityis a factor. Certain Parkerthermal management materials aredesigned to be electrically non-conductive,i.e., electrical insulators, whileothers are specifically designed tobe electrically conductive. And otherthermal management materials areinherently electrically non-conductiveonly below certain current levels.The electrical conductivity of Parkerthermal management products isdependent upon many factors and maybe susceptible to change. These factorsinclude the various materials usedto make the thermal managementmaterials and/or related parts (includingthermal management assembliesprovided by Parker), how and wherethe thermal management parts and/or related parts are installed, moisturecontent of the thermal products at anyparticular time, and other factors.2.2 TEMPERATURE RANGEAND FLAMMABILITY2.2.1 Temperature Range andFlammability: SealsTemperatures can affect seal performance,including occurrences such asheat hardening and oxidation. The temperaturerange of a given seal application,and the expected performance ofany sealing system within this range,must be clearly defined in order to selectthe best sealing solution. Temperatureat the seal itself may vary widelyfrom the ambient condition, sometimesby hundreds of degrees. The usershould provide the temperature range,ideally in partnership with applicationssupport from Parker at the earliestpossible stages of the design process.Temperature range is generallydefined as the maximum and minimumtemperature limits within which aseal compound is expected to functionproperly in a given application.Virtually all Parker sealing materialsfeature a recommended use temperaturerange, which should be regardedin the seal selection process. Thisinformation can normally be found onrelated Parker web pages, productliterature or from Parker Seal Groupapplications engineering. In addition,temperature range should be consideredfor all integral seal elements(e.g., fasteners, adhesives, plastics,metals, etc.) and for application featuressuch as gland dimensions, fluidtemperatures, dynamic or static operation,etc. For example, temperature, orthe range of temperature, for a givenoperation may require some modificationof the gland dimensions.Changing the fluids a seal is exposed towill change the temperature limits ofthe seal. This is because some chemicalreactions take place at elevatedtemperatures, but not necessarily atlower temperatures. Seals can failat low temperatures as well. Thesefailures are typically caused by somemechanical instability in the system,which would cause the seal to looseits seal interface. The temperaturelimit in a particular sealing applicationcannot be properly determined withoutknowing what specific fluids or othermedia the seal will be exposed to.Flammability information is availablefor most Parker seal materials. Certainmaterials are available with variousUL (Underwriters Laboratories)ratings for flammability/flame resistance.When Parker seal materials areintegrated with other materials (e.g.,plastic frames), the user, or Parker,may need to determine the flammabilitydata for these other materials.For more safety information on temperatureand flammability, consultwith Parker Seal Group applicationsengineering.2.2.2 Temperature Range andFlammability: Isolation DevicesMost Parker isolation devices areproduced from materials that performover a broad temperature range, e.g.,-65 to +600 degrees F. Some materialsare better suited for wider temperatureranges, or for higher or lowertemperature extremes. Temperaturerange data is available for most ofthese materials and should be consideredin the overall selection process.Users should also determine whetherflammability issues are of concernto their application. When Parkerisolation devices are integrated withother materials (e.g., plastic frames),the user, or Parker, may also need todetermine the flammability data forthese other materials. Consult withParker engineers on available flammabilitydata, e.g., UL ratings, requiredfor a choice of an isolation device.2.2.3 Temperature Range andFlammability: EMI ShieldingTemperatures can affect EMI shieldingperformance to the extent theymay affect electrical continuity withina shielding design. This could resultfrom physical changes to electricallyconductive shielding components(conductive panels, coatings, platings,flanges, compounds, gaskets, fasteners,adhesives, etc.) due to temperatureextremes, changes, etc. In addition,while some shielding materialssuch as conductive compounds (paints,adhesives, caulks, inks) should be appliedat specific temperature ranges(e.g., ambient), they will provideshielding performance over a broadertemperature range. Other shieldingmaterials such as compounds may requirecuring at elevated temperatures,which may in turn affect substratesor other exposed components. Temperatureranges for effective shieldingperformance are available formost Parker EMI shielding materials,including integral attachment systems(e.g., pressure sensitive adhesives).Consult Parker’s literature or webpages, and consult with Parker applicationsengineers to review shieldingmaterial selection relevant to temperaturerange.Chomerics 45

Flammability information is availablefor many Parker shielding materials.Certain materials are available withvarious UL (Underwriters Laboratories)ratings for flammability/flameresistance. When Parker shieldingproducts are integrated with other materials(e.g., plastic frames), the user,or Parker, may need to determinethe flammability data for these othermaterials.For more safety information on temperatureand flammability, consultwith Parker technical service department.Curing of products at elevatedtemperatures may generate off gascomponents. Any need to use localexhaust ventilation should be based offcustomer assessment.2.2.4 Temperature Range andFlammability: ThermalManagement MaterialsTemperature range is defined as themaximum and minimum temperaturelimits within which a thermal managementmaterial or product will functionproperly in a given application. Normally,the key feature of these productsis their ability to conduct thermalenergy (heat), particularly within atarget temperature range and in specificdesign configurations. However,temperature extremes can affect theperformance of these thermal managementmaterials or systems.Many Parker thermal managementmaterials feature a recommendedapplication temperature range, whichshould be regarded in the seal selectionprocess. This information cannormally be found on related Parkerweb pages, product literature or fromParker technical services departments.In addition, temperature range shouldbe considered for all integral elementsof a thermal management system (e.g.,fasteners, adhesives, plastics, metals,etc.) and for various other applicationfeatures, such as mounting surfaces,etc. The temperature range of a giventhermal management system, and theexpected performance of any thermalmanagement system within thisrange, must be clearly defined in orderto select the best solution. The usershould provide the temperature range,ideally in partnership with applicationssupport from Parker at the earliestpossible stages of the design process.Flammability information is availablefor most Parker thermal managementmaterials. Certain materials are availablewith various UL (UnderwritersLaboratories) ratings for flammability/flameresistance. When Parkerthermal management materials areintegrated with other materials (e.g.,plastic frames), the user, or Parker,may need to determine the flammabilitydata for these other materials. Formore information, consult with Parkertechnical service department.2.3 COMPRESSION ANDPRESSUREMost Products require some level ofcompression to function properly.Different materials and configurationswill have varying compressioncharacteristics, including resilience,and diverse compressive force requirements.Product materials mayundergo compression set or othercompression-related changes dependingon the specific application. Fluidsand other media may physically affecta Product and cause changes to theProduct’s compression characteristicsin an application. Compression (anddecompression) qualities of materials,compression force requirements, andrelated compression requirementsshould be considered for a given applicationin order to select the bestProduct solution. This also includesthe number of pressure cycles to whichthe Product will be exposed, and thenumber of times a Product will bedisassembled. Compression data isavailable on most Parker Product materials,and users should consult withParker applications engineering earlyin their design and Product selectionprocesses.Pressure has a bearing on Productdesign and selection, as it may affectthe choice of compound composition,geometry, hardness and other properties.Proper selection may requirethe choice of higher or lower durometermaterials to accommodate moresevere pressure situations. Compatibilitywith the medium should be ofconcern e.g., excessive swell in anapplication can generate extremelyhigh pressures. If not considered inthe design and selection stages, highpressures in an application can affectmating assemblies and lead to Productfailure, e.g., by extrusion of the Productmaterial. Pressure data should beprovided as part of the selection process,as well as the choice of interfacedesign and materials. This includesmaximum and minimum pressures andcycling conditions.2.4 FLUID AND OTHERMEDIA COMPATIBILITY2.4.1 Compatibility: SealsThis is a critical aspect of proper sealselection, based on the number offluids or other media with which sealsare expected to interact. All mediathat may come in contact with the sealand retainer should be considered.For example, if the system is to becleaned or purged periodically, be sureto anticipate what cleaning fluids willbe used. Also, consider any lubricants,e.g., friction reducers, which may beaffected by the sealed media. Thesesecondary fluids are as important toselecting the most compatible seal materialas the principal operating mediaselects.Any increase in seal mass (volume)due to exposure to the sealed fluid,must be a design consideration.Excessive swell in an application cangenerate extremely high pressuresand affect the seal function. Conversely,any decrease in seal volume, causedby a reaction to the sealed fluid canalso degrade performance by reducingcompression force or causing other severedimensional changes resulting inpossible loss of the sealing interface.Seals exposed to atmosphere, includingozone and air pollutants, or tovacuum may experience some types ofdegradation. Corrosion issues shouldalso be considered, particularly ofmetallic mating or seal mounting hardware(see 2.6.1). In all cases, fluid andgas compatibility should be a majorconsideration for every sealing application,and fully discussed with ParkerSeal Group applications engineering.2.4.2 Compatibility: IsolationDevicesMany isolation devices are designedto retain or seal a number of fluidsacross a variety of applications, whilealso protecting against contaminants(see 2.6.2). Others are designedexclusively to control noise, vibration,shock or motion. Users should assessthe nature, volume, etc., of all fluidsand gases that will be contact withthe isolation devices in their applications.These assessments should bediscussed with Parker applications en-Chomerics 46

gineers in selecting and designing theappropriate isolation device solution.2.4.3 Compatibility: EMI ShieldingFluid and gas compatibility concerns inEMI shielding applications include thepotential effects on electrical conductivity,corrosion, and issues related toshielding materials that also provideenvironmental sealing. ConsiderALL media that may come in contactwith the shielding components. Forexample, if the system is to be cleanedor purged periodically, be sure toanticipate what cleaning fluids will beused. Exposure to fluids and gasesmay effect shielding performance(immediately and long term) andthe application conditions should bediscussed with Parker engineers. Occurrenceof galvanic corrosion shouldbe a major concern where metalor metal-filled shielding materialsare used in the presence of fluids orhumidity. This includes metallic partsused for attaching shielding gaskets orother shielding components. Consultwith Parker applications engineersto optimize the shielding design and/or choice of shielding materials toaddress corrosion issues. Many EMIgasket forms will provide little or nobarrier to fluids or gases, unless theyinclude an integrated sealing system.The environmental seal, such as anon-conductive rubber, will featureits own fluid and gas compatibilityissues. (Refer to 2.4.1 when consideringnon-conductive and/or conductiveelastomers for use in an EMI shieldingsystem.) In all cases, fluid and gascompatibility should be addressed ineach EMI shielding application, andfully discussed with Parker technicalservice department.2.4.4 Compatibility: ThermalManagement MaterialsFluid and gas concerns in thermalmanagement applications include thepotential effects on thermal performance,and safety-related effectssuch as corrosion occurring to theParker thermal product or associatedhardware. Consider ALL mediathat may come in contact with thethermal components. For example, ifthe system is to be cleaned or purgedperiodically, be sure to anticipate whatcleaning fluids will be used. Exposureto fluids and gases may effect thermalperformance (immediately and longterm) and the application conditionsshould be discussed with Parker engineers.Fluid or gas exposure may alsoaffect integral portions of the suppliedthermal management product, such aspressure sensitive adhesives. Occurrenceof corrosion should be a concernwhere metal or metal-filled thermalmaterials are used in the presence offluids or humidity. This also includesmetallic parts used for attachingthermal management components.Consult with Parker applications engineersto optimize the thermal designand/or choice of materials to addresscorrosion issues. In all cases, fluid andgas compatibility should be addressedin each application, and fully discussedwith Parker technical service department.2.5 CORROSION ANDENVIRONMENT2.5.1 Corrosion and Environment:SealsSeal corrosion is not typically seenwith elastomer-based sealing materials,but corrosion of integrated metalseal components, mounting devicesand mating hardware can be a safetyrelatedfactor when choosing sealingsolutions. Corrosion of these materialscan compromise the integrity,proper function and normal resultsof the seal design. As such, potentialcorrosion opportunities should be determinedand accounted for in the sealdesign process (e.g., using coated orplated metals). Similarly, environmentalissues should be considered whendeveloping sealing designs and specifyingseal materials. Environmentalconditions, e.g., weather, temperature,salt spray, dust, etc. can affect thesealing material, sealing hardwareand/or the media being sealed, whichin turn can affect the sealing properties.Consult with Parker Seal specialistson seal design in respect to corrosionand environmental issues.2.5.2 Corrosion and Environment:Isolation DevicesCorrosion issues should factor intoselecting elastomeric and thermoplastic-basedisolation devices. Isolationdevices with integral metal plates,flanges, screws, fasteners and othermetallic features may experiencecorrosion under certain conditions.Further, corrosion can affect theintegrity of other component parts inan isolation system. Corrosion controlshould be part of the design and selectionprocess when choosing isolationdevices.Some types of isolation devices, suchas boots and bellows, are typicallydesigned for preventing ingress ofenvironmental dust and dirt, water,fuel and other fluids, grease and otherpotential contaminants. Users shouldcarefully review potential environmentalconditions and contaminantsto which an isolation device or systemmay be exposed. Some isolationmaterials may also be affected byexposure to ultraviolet (UV) light, e.g.reflected solar energy. Selection ofthe materials, attachment systems andoverall design should have the primarygoal of keeping out contamination fromthe environment. Review corrosionand environmental issues with Parkerapplications engineers as part of theselection process.2.5.3 Corrosion and Environment:EMI ShieldingCorrosion issues must be consideredin the design and selection of EMIshielding. The metals used in providinga conductive pathway, enclosure,etc. and ultimately an effective EMIshield can be subject to corrosion thatcan affect shielding performance. Thelevel of this corrosion is determined bythe metals used and by their exposureto corrosion-supporting environments.For example, galvanic corrosion canoccur when conductive shieldingmaterials experience battery-likephysical conditions. As such, potentialcorrosion opportunities should bedetermined and accounted for in theEMI shielding design process (e.g.,choice of EMI gasket type, use of corrosioninhibiting coatings, weather seals,etc.). Similarly, environmental factorsshould be considered when developingEMI shielding designs and selectingshielding materials. Environmentalsituations, e.g., weather, temperature,radiation, salt spray, dust, etc. can affectthe shielding material, integratedhardware and other components ofa system’s overall shielding design.Consult with Parker technical servicedepartment on shielding design inrespect to corrosion and environmentalissues.2.5.4 Corrosion and Environment:Thermal Management MaterialsCorrosion should be addressed whendesigning and choosing thermal managementproducts. Those productscontaining metals as thermal conductorsor as part of an integral thermalChomerics 47

management assembly can be subjectto corrosion that may affect thermalperformance. The level of this corrosionis determined by the metals usedand by their exposure to corrosionsupportingenvironments. Potentialcorrosion opportunities should bedetermined and accounted for in thethermal management design process(e.g., choice of thermally conductivematerials, integrated fasteners orother components, use of corrosion inhibitingcoatings, weather seals, etc.).Similarly, environmental issues shouldbe considered when designing andselecting thermal management systems.Environmental situations, e.g.,weather, temperature, radiation, saltspray, dust, etc. can affect the thermaltransfer material, integrated hardware(fasteners, clips, heat sinks, etc.), andother components of a system’s overallthermal management design. Consultwith Parker specialists on thermalmanagement design in respect to corrosionand environmental issues.2.6 LEAKAGE2.6.1 Leakage: SealsLeakage control and acceptable leakagerates are fundamental to thedesign of any efficient sealing system.When properly used in sealing liquidsthere should be no detectable leakageof a liquid over a given period of timein the case of static sealing. Dynamicsealing provides of a controlled leakagethat is typically very low concentrationsover extended periods of time.Gases, on the other hand, will typicallydiffuse through the rubber at somevery low rate that can be detected by aleak detector, a mass spectrometer orother very sensitive measuring device.The leakage rate depends primarily onthe temperature, the pressure differential,the type of gas and the typeof elastomer used. Out-gassing is avacuum phenomenon wherein a substancespontaneously releases volatileconstituents in the form of vapors orgases. In rubber compounds, theseconstituents may include water vapor,plasticizers, air, inhibitors, etc. Toidentify and address safety concerns,consult with Parker Seal applicationsengineers on leakage issues relevantto all seal designs and selections.2.6.2 Leakage: Isolation DevicesWhen properly designed and installed,isolation devices for preventing ingressof contaminants should demonstrateeither no leakage or an ingress levelwell within the user-provided specifications.This need for properly selectingisolation devices may also pertainto preventing or minimizing ‘leakage’,or egress, of noise, vibration, shock orother phenomena. Leakage problemscan lead to system malfunctions,breakdowns, and safety hazards toequipment, operators and other personnel.User-specifications must addressany and all safety concerns overleakage. These should be reviewedwith Parker applications engineersearly in the selection process.2.6.3 Leakage (Including ElectromagneticEnergy Leakage): EMIShieldingLeakage in an EMI shielding design canrefer to the flow of fluids and gases, aswell as the passage of electromagneticenergy through the shield.With respect to the flow of fluids andgases, some Parker EMI shieldingproducts will provide a certain barrierlevel to fluid and gas leakage, e.g.,shielded windows, conductive elastomergaskets. However, only a limitednumber of these products are specificallydesigned for this feature, e.g.,conductive sealants. Other Parkershielding products e.g., shielded vents,are actually designed to facilitate airflow.Conductive elastomers and otherkinds of conductive shielding materialsmay also experience out-gassing. Thisis a vacuum phenomenon wherein asubstance spontaneously releases volatileconstituents in the form of vaporsor gases. In rubber compounds, theseconstituents may include water vapor,plasticizers, air, inhibitors, etc. In addition,improperly installed shieldingproducts, as well as gaps throughouta device’s shielding system, may leadto leakage. This includes any leakageof improperly cured shielding compounds,e.g., coatings, inks, epoxies,etc. To help you identify and addressfluid and gas leakage concerns, consultwith Parker Seal applications specialistson leakage issues relevant to allEMI shielding designs and selections.With respect to the passage of electromagneticenergy through the EMIshielding material, EMI shielding materialsreduce but do not eliminate thispassage. Specifications and testing ofEMI shielding materials are directedtoward the amount of the reduction.The electromagnetic energy that isemitted from any electronic device isdependent upon many factors includingthe source of the electromagneticenergy, the amount of electromagneticenergy developed or transmitted bythe source, the distance from thesource, and any desired transmissionof signals from the device such asthrough an antennae. The EMI shieldingmaterial is just one component ofthe entire device, and the designersof the device are solely responsible todetermine the amount of electromagneticenergy transmitted by the deviceunder all conditions and to assure thatall performance, endurance, maintenance,safety and warning requirementsfor the device are met.2.6.4 Leakage: ThermalManagement MaterialsLeakage potential of fluids or gasesthrough thermal management materialsshould be addressed by consultingwith Parker Seal design engineersbefore or during the material selectionprocess. Some Parker thermalmanagement products will provide acertain barrier level to fluid and gasleakage, but only a limited numberof these products are specificallydesigned for this feature, e.g., thermalpotting compounds. Elastomers andother types of thermally conductivematerials may also experience outgassing.This is a vacuum phenomenonwherein a substance spontaneouslyreleases volatile constituents inthe form of vapors or gases. In rubbercompounds, these constituents mayinclude water vapor, plasticizers, air,inhibitors, etc. In addition, improperlyinstalled thermal managementproducts, as well as gaps throughouta thermal management system, maylead to leakage and resulting safetyproblems. This includes any leakageof improperly cured thermally compounds,e.g., adhesives, caulks, etc. Toidentify and address safety concerns,consult with Parker Seal applicationsspecialists on leakage issues relevantto all thermal management designsand selections.2.7 AGINGProduct selection should consider boththe shelf life and the installed life.Parker maintains cure date records formany Products. For some Products,Parker also follows established industrial,customer, United States or otherglobal age control standards. Certainmaterials, e.g. conductive coatings,Chomerics 48

inks, adhesives, etc. have a relativelylimited shelf life and use life. Integralmaterials, e.g., pressure sensitiveadhesives; on Products may haveaging properties different from themain Product material. Users shouldconsult available Parker data, andconsult with Parker applications engineersto determine shelf life standardsand installed seal life guidelines, andrelevant procedures, when selectingseals for their applications.2.8 SYSTEM WEIGHTProduct selection should include considerationsrelated to Product weight,hardware/peripherals weight, andtotal system weight. Material weightsare available from Parker web sites,literature, or from Parker applicationsengineers. When weight is critical toachieving a proper application, thisshould be addressed as early as possiblewith Parker applications engineers.Parker can often provide technicalprediction of Product performancevia finite element analysis and otheranalytical tools. Successful results arebest accomplished by working closelywith Parker applications engineersbeginning early in the design stages.3.0 HANDLINGSafe handling of Products refers to thesafety of the handlers and to the securityof the seal parts. Any safety concernsrelative to the safety of Productassemblers; inspectors, maintenancepersonnel, etc. should be addressedwith Parker before the Products enterthe handling stages. Though not usuallyrequired, Parker can provide availableMaterial Safety Data Sheets andother safe handling and storage documentsfor certain Products. Consultwith Parker applications engineers onthe need and availability of this form ofdocumentation. The Products shouldalways be handled in ways that will notcause physical (visible or not) changesto the materials that could affect performancein their intended application.It is recommended that Parker applicationsengineers be consulted on bestpractices for safe storage and handlingof these ProductsSafe operation of automated handling,assembly, insertion, storage, etc.equipment used with the Products,should be optimized for safe use by operators,maintenance personnel, etc.Automated or manual equipment, usedfor handling seal products, should notaffect the Products in any way thatcan alter their attributes and result inunsafe conditions. It is recommendedthat Parker applications engineers beconsulted on best practices for safehandling of the Products.3.1 PRE-INSTALLATIONINSPECTIONPrior to installation, a careful examinationof the Product must beperformed. This includes checkingfor correct size, style, quantity, andpart number. The Product should beexamined for cleanliness, abrasionand any other visible defects. FaultyProducts should be properly discardedor carefully stored away from otherinventories. Quality assurance testingprograms for the Products should beestablished in consultation with Parkerquality engineers or other authorizedpersonnel.3.2 PREPARING THEINSTALLATION AREACleanliness of the Product and itsinstallation area are key to successfulinstallation and performance. Everyprecaution must be taken to insure thatall parts are clean at assembly. Cleanlinessis important for proper Productfunctions. Foreign particles in theinstallation area, including dirt, metaldebris etc. can damage the Productor impede function. Remove all sharpedges near mounting surfaces. Whenrequired, use lubricants on the isolationparts and/or contacting surfacesonly after discussion with Parker applicationsengineers. Cleaning solventscan cause swelling or other damageof some Products. Thus, cleaning solventsshould be cleaned off thoroughly.Some Products may require priming ofinstallation surfaces. These processesshould be done according to instructionsfrom Parker. EMI gaskets mayhave specific installation requirementsdepending on their construction andcomposition. Consult with Parker applicationsengineers for specific gasketapplication needs and to review installationrequirements for all Parker EMIshielding. Customer assumes responsibility/riskassessment when handlinghazardous substances for cleaning orsurface preparation.3.3 ASSEMBLY3.3.1 Assembly: SEALS AND ISO-LATION DEVICESSeal and isolation devices typically donot have assembly requirements beyondnormal installation into a systemor a system sub-assembly.3.3.2 Assembly: EMI Shielding andThermal Management MaterialsWhile most Parker EMI shielding andthermal management materials areprovided ready to install, some typesrequire minor assembly, sizing, mixingor other preparatory operations priorto installation. Assembly may includecustomer-performed integration ofattachment systems, i.e. adding hardwareor adhesive. Sizing operationsinclude customer-performed trimmingor other fabrication. Mixing operationsare often required of customers usingParker conductive coatings and adhesiveproducts. In all cases, customersshould use good safety proceduresand equipment used in performingthese functions. Consult with ParkerSeals applications engineers with anyquestions or concerns regarding thesafe assembly, sizing or mixing of EMIshielding and thermal managementmaterials.3.4 INSTALLATIONThe Products have various installationmethods, including manual insertion,,use of hand tools and automated systems.Sharp-edged installation toolsshould be used with care, or avoided,to prevent Product damage. If clampingor crimping is used, avoid overclamping or over crimping. Consultwith Parker applications engineers todetermine the issues to be addressedusing whatever installation method isselected.3.5 CURE/SET TIME3.5.1 Cure/Set Time: Seals andIsolation DevicesParker seals and isolation devices aretypically supplied in cured form. Whenusing uncured seal material (or othercurable products) follow the cure timeinstructions provided by Parker.3.5.2 Cure/Set Time: EMI Shieldingand Thermal ManagementMaterialsSome Parker EMI shielding and thermalmanagement materials requirecustomer-managed cure periods.These include conductive coatings,inks, adhesives, and form-in-placeChomerics 49

gasket compounds, caulks and primers.Some adhesives (conductive ornon-conductive) used for bonding mayhave a recommended set time. Temperature,humidity and other conditionscan affect curing. Improperlycured materials may provide abnormalperformance, working life, abrasionresistance, attachment, and otherproperties. Some curable materialsare volatile and/or pose health issuesin uncured form. Refer to all relevantMaterial Safety Data Sheets (MSDS)and consult with Parker applicationsengineers on the appropriate curingmethods, timing and evaluation forProducts requiring curing or settingperiods.3.6 POST INSTALLATIONINSPECTION AND TESTINGInstalled Products should be inspectedfor proper fit and any damage incurredduring installation. In some cases,pressure, conductivity (electrical orthermal), or impedance testing, orother procedures can help identifyany performance problems. Identifiedproblems should be documented andbrought to the attention of all associatesinvolved. Consult with Parkerapplications engineers in developingappropriate inspection and test standardsand procedures.3.7 REMOVAL3.7.1 Removal: SealsSeal removal may require use of manualor automated tools. Safety proceduresand training may also be necessaryto ensure the safe use of removaltools, compounds, etc. Care must betaken to preserve surface finishesand other application part features.Inspect and clean/repair applicationparts as needed prior to installing newseals. Inspect removed seals for wear,damage and other features that mayindicate conditions requiring attention.Consult with Parker regarding appropriateremoval tools and procedures.3.7.2 Removal: Isolation DevicesMany isolation devices are intendedto remain in place for the life of thesystem, e.g. vehicle. When necessary,these parts must be carefully removedto avoid damaging material or attachmenthardware; changing the part dimensions,or contaminating protectedareas. Inspect removed devices forwear, damage and other features thatmay indicate conditions requiring attention.Consult with Parker regardingappropriate tools and procedures.3.7.3 Removal: EMI Shielding andThermal Management MaterialsRemoving EMI shielding or thermalmanagement materials may requireuse of manual or automated tools, aswell as the use of solvents, abrasivesor other compounds. Safety proceduresand training may also be necessaryto ensure the safe use of removaltools, compounds, etc. Care must betaken to preserve surface finishes andother part features, particularly thosecomprising the shielding or thermalmanagement system. Inspect andclean/repair application parts as neededprior to installing new Products. Ifpossible, inspect removed materialsfor wear, damage, performance andother features that may indicate conditionsrequiring attention. Consult withParker regarding appropriate removaltools and procedures.4.0 STORAGEStorage conditions can affect Productintegrity and performance, andpose safety issues. These includetemperature extremes, contaminationand time. Storage proceduresshould address these issues. Typically,the Products should be kept at roomtemperature, and away from temperatureextremes or high humidity.Product lots and part numbers shouldbe identified and tracked to ensureattention to shelf life and that thecorrect Products are always installed.Products installed on stored equipmentshould also be protected frompotential temperature and environmentaleffects. Avoid sulfur containingpackaging materials when storing conductiveelastomers as it will promotecorrosion. Their working life mustalso be tracked and distinguished fromtypical bulk/bag storage life. Discussproper storage procedures with Parkerengineers. Follow guidelines in Parkerliterature for special handling andstorage instructions.4.1 MAINTENANCEUsers of these Products should establishmaintenance procedures, andthese are typically determined throughcustomer component testing. Maintenanceshould normally include Productinspection, correct part replacement,and for those specific Products approvedby Parker, conditioning of theProduct for reuse. Parker applicationsengineers can be consulted when creatingmaintenance procedures.5.0 USERRESPONSIBILITYThis document and other informationfrom the world wide Parker-Hannifinorganization (including Chomerics)and its subsidiaries and authorizeddistributors provide product or systemoptions for further investigation byusers having technical expertise. Tothe extent that Parker or its subsidiariesor authorized distributors providecomponent or system options basedupon data or specifications providedby the user, the user is responsible fordetermining that such data and specificationsare suitable and sufficientfor all applications and reasonablyforeseeable uses of the componentsor systems. The user, through its ownanalysis and testing, is solely responsiblefor making the final selectionof the system and components andassuring that all performance, endurance,maintenance, safety and warningrequirements of the applicationare met. The user must analyze allaspects of the application, follow applicableindustry standards, and followthe information concerning the productin the current product catalog and inany other materials provided fromParker or its subsidiaries or authorizeddistributors.Chomerics 50

CHOMERICS DIVISION OF PARKER HANNIFIN CORPORATIONTERMS AND CONDITIONS OF SALE (7/21/04)1. Terms and Conditions of Sale: Alldescriptions, quotations, proposals,offers, acknowledgments, acceptancesand sales of Seller’s productsare subject to and shall be governedexclusively by the terms and conditionsstated herein. Seller’s prices for theproducts have been established on theunderstanding and condition that theterms set forth herein shall apply to thissale to the exclusion of any other terms.Seller expressly reserves the right to anequitable adjustment to the price in theevent that any material provision hereofis deemed not to govern the rightsand obligations of the parties hereto.Buyer’s acceptance of any offer to sellis limited to these terms and conditions.Any terms or conditions in addition to,or inconsistent with those stated herein,proposed by Buyer in any acceptance ofan offer by Seller, are hereby objectedto. No such additional, different orinconsistent terms and conditions shallbecome part of the contract betweenBuyer and Seller unless expresslyaccepted in writing by Seller. Seller’sacceptance of any offer to purchaseby Buyer is expressly conditional uponBuyer’s assent to all the terms andconditions stated herein, including anyterms in addition to, or inconsistentwith those contained in Buyer’s offer.Acceptance of Seller’s products shall inall events constitute such assent.2. Product Selection. If Seller hasprovided Buyer with any componentand/or system recommendations, suchrecommendations are based on dataand specifications supplied to Seller byBuyer. Final acceptance and approvalof the individual components as wellas the system must be made by theBuyer after testing their performanceand endurance in the entire applicationunder all conditions which might beencountered.3. Payment: Payment shall be made byBuyer net 30 days from the date of deliveryof the items purchased hereunder.Any claims by Buyer for omissions orshortages in a shipment shall be waivedunless Seller receives notice thereofwithin 30 days after Buyer’s receipt ofthe shipment.4. Delivery: Unless otherwise providedon the face hereof, delivery shall bemade F.O.B. Seller’s plant. Regardlessof the method of delivery, however, riskof loss shall pass to Buyer upon Seller’sdelivery to a carrier. Any delivery datesshown are approximate only and Sellershall have no liability for any delays indelivery.5. Warranty: Seller warrants that theitems sold hereunder shall be free fromdefects in material or workmanship fora period of 365 days from the date ofshipment to Buyer. THIS WARRANTYCOMPRISES THE SOLE AND ENTIREWARRANTY PERTAINING TO ITEMSPROVIDED HEREUNDER. SELLERMAKES NO OTHER WARRANTY,GUARANTEE, OR REPRESENTATION OFANY KIND WHATSOEVER. ALL OTHERWARRANTIES, INCLUDING BUT NOTLIMITED TO, MERCHANTABILITY ANDFITNESS FOR PURPOSE, WHETHEREXPRESS, IMPLIED, OR ARISING BYOPERATION OF LAW, TRADE USAGE,OR COURSE OF DEALING ARE HEREBYDISCLAIMED.NOTWITHSTANDING THE FOREGOING,THERE ARE NO WARRANTIES WHATSO-EVER ON ITEMS BUILT OR ACQUIRED,WHOLLY OR PARTIALLY, TO BUYER’SDESIGNS OR SPECIFICATIONS.6. Limitation of Remedy: SELLER’S LI-ABILITY ARISING FROM OR IN ANY WAYCONNECTED WITH THE ITEMS SOLDOR THIS CONTRACT SHALL BE LIMITEDEXCLUSIVELY TO REPAIR OR REPLACE-MENT OF THE ITEMS SOLD OR RE-FUND OF THE PURCHASE PRICE PAIDBY BUYER, AT SELLER’S SOLE OPTION.IN NO EVENT SHALL SELLER BE LI-ABLE FOR ANY INCIDENTAL, CONSE-QUENTIAL OR SPECIAL DAMAGES OFANY KIND OR NATURE WHATSOEVER,INCLUDING BUT NOT LIMITED TO LOSTPROFITS ARISING FROM OR IN ANYWAY CONNECTED WITH THIS AGREE-MENT OR ITEMS SOLD HEREUNDER,WHETHER ALLEGED TO ARISE FROMBREACH OF CONTRACT, EXPRESSOR IMPLIED WARRANTY, OR IN TORT,INCLUDING WITHOUT LIMITATION,NEGLIGENCE, FAILURE TO WARN ORSTRICT LIABILITY.7. Inspection: Seller shall be given theopportunity to correct or replace defectiveproducts prior to cancellation. Finalacceptance by Buyer shall take placenot later than 90 days after shipment.8. Changes, Reschedules and Cancellations:Buyer may request to modifythe designs or specifications for theitems sold hereunder as well as thequantities and delivery dates thereof,or may request to cancel all or part ofthis order; however, no such requestedmodification or cancellation shallbecome part of the contract betweenBuyer and Seller unless accepted bySeller in a written amendment to thisAgreement. Acceptance of any suchrequested modification or cancellationshall be at Seller’s discretion, and shallbe upon such terms and conditions asSeller may require.9. Special Tooling: A tooling charge maybe imposed for any special tooling, includingwithout limitation, dies, fixtures,molds and patterns, acquired to manufactureitems sold pursuant to this contract.Such special tooling shall be andremain Seller’s property notwithstandingpayment of any charges by Buyer. Inno event will Buyer acquire any interestin apparatus belonging to Sellerthat is utilized in the manufacture ofthe items sold hereunder, even if suchapparatus has been specially convertedor adapted for such manufacture andnotwithstanding any charges paid byBuyer. Unless otherwise agreed, Sellershall have the right to alter, discard orotherwise dispose of any special toolingor other property in its sole discretion atany time.10. Buyer’s Property: Any designs, tools,patterns, materials, drawings, confidentialinformation or equipment furnishedby Buyer or any other items whichbecome Buyer’s property, may be consideredobsolete and may be destroyedby Seller after two (2) consecutive yearshave elapsed without Buyer placing anorder for the items which are manufacturedusing such property. Sellershall not be responsible for any loss ordamage to such property while it is inSeller’s possession or control.11. Taxes: Unless otherwise indicatedon the face hereof, all prices andcharges are exclusive of excise, sales,use, property, occupational or like taxeswhich may be imposed by any taxingTerms of SaleChomerics 51

authority upon the manufacture, sale ordelivery of the items sold hereunder. Ifany such taxes must be paid by Selleror if Seller is liable for the collection ofsuch tax, the amount thereof shall bein addition to the amounts for the itemssold. Buyer agrees to pay all such taxesor to reimburse Seller therefor uponreceipt of its invoice. If Buyer claimsexemption from any sales, use or othertax imposed by any taxing authority,Buyer shall save Seller harmless fromand against any such tax, together withany interest or penalties thereon whichmay be assessed if the items are held tobe taxable.12. Indemnity For Infringement of IntellectualProperty Rights: Seller shallhave no liability for infringement ofany patents, trademarks, copyrights,trade secrets or similar rights exceptas provided in this Part 12. Seller willdefend and indemnify Buyer againstallegations of infringement of U.S. patents,U.S. trademarks, copyrights, andtrade secrets (hereinafter ‘IntellectualProperty Rights’). Seller will defend atits expense and will pay the cost of anysettlement or damages awarded in anaction brought against Buyer based onan allegation that an item sold pursuantto this contract infringes the IntellectualProperty Rights of a third party. Seller’sobligation to defend and indemnifyBuyer is contingent on Buyer notifyingSeller within ten (10) days after Buyerbecomes aware of such allegations ofinfringement, and Seller having solecontrol over the defense of any allegationsor actions including all negotiationsfor settlement or compromise. Ifan item sold hereunder is subject to aclaim that it infringes the IntellectualProperty Rights of a third party, Sellermay, at its sole expense and option,procure for Buyer the right to continueusing said item, replace or modify saiditem so as to make it noninfringing,or offer to accept return of said itemand return the purchase price less areasonable allowance for depreciation.Notwithstanding the foregoing, Sellershall have no liability for claims ofinfringement based on information providedby Buyer, or directed to items deliveredhereunder for which the designsare specified in whole or part by Buyer,or infringements resulting from themodification, combination or use in asystem of any item sold hereunder. Theforegoing provisions of this Part 12 shallconstitute Seller’s sole and exclusiveliability and Buyer’s sole and exclusiveremedy for infringement of IntellectualProperty Rights. If a claim is based oninformation provided by Buyer or if thedesign for an item delivered hereunderis specified in whole or in part by Buyer,Buyer shall defend and indemnify Sellerfor all costs, expenses or judgmentsresulting from any claim that such iteminfringes any patent, trademark, copyright,trade secret or any similar right.13. Export Limitations. The items soldhereunder are authorized by the U.S.government for export only to the countryof ultimate destination indicated onthe face hereof for use by the end-user.The items may not be transferred,transshipped on a non-continuous voyage,or otherwise be disposed of in anyother country, either in their originalform or after being incorporated intoother end-items, without the prior writtenapproval of the U.S. government.14. Commercial Items. Unless otherwiseindicated on the face hereof,the items being sold hereunder ifsold for military or government purposesconstitute Commercial Itemsin accordance with FAR 2.101, and assuch the assertions delineated in theDFAR’s 252.227-7013, 252.227-7014,252.227-7017 and FAR 52.227-15 (c)shall not apply to this contract. Additionally,in view of the CommercialItem status, any deliverable technicaldata and/or computer software to beprovided will contain Seller’s normalcommercial legend subject to the restrictionscontained therein.15. Force Majeure: Seller does notassume the risk of and shall not beliable for delay or failure to performany of Seller’s obligations by reason ofcircumstances beyond the reasonablecontrol of Seller (hereinafter ‘Eventsof Force Majeure’). Events of ForceMajeure shall include without limitation,accidents, acts of God, strikes or labordisputes, acts, laws, rules or regulationsof any government or governmentagency, fires, floods, delays or failuresin delivery of carriers or suppliers,shortages of materials and any othercause beyond Seller’s control.16. Premier Conductive Plastics:Parker Chomerics Premier conductiveplastics are sold under licensesolely for use in the following applications:(i) EMI/RFI shielding, i.e.,electromagnetic and/or radio frequencyinterference shielding or compatibilityand surface grounding therefore;(ii) earth grounding, corona shielding,and anti-static and/or electrostaticdischarge protection shielding; and (iii)as thermally conductive members todissipate heat generated by electronicdevices.The resale of Premier conductiveplastics in pellet or any other raw materialform is expressly prohibited, as istheir use in any application other thanas stated above, and any such resaleor use by you or your customers shallrender any and all warranties null andvoid ab initio.You shall defend, indemnify, and holdParker Hannifin Corporation and itssubsidiaries (Parker) harmless fromand against any and all costs andexpenses, including attorney’s fees,settlements, and any awards, damages,including attorney’s fees, and costs, resultingfrom any claim, allegation, suitor proceeding made or brought againstParker arising from any prohibited useof Premier conductive plastics by youor your customers.17. Entire Agreement/Governing Law:The terms and conditions set forthherein, together with any amendments,modifications and any different termsor conditions expressly accepted bySeller in writing, shall constitute theentire Agreement concerning the itemssold, and there are no oral or otherrepresentations or agreements whichpertain thereto. This Agreement shallbe governed in all respects by the law ofthe State of Ohio. No actions arising outof the sale of the items sold hereunderor this Agreement may be brought byeither party more than two (2) yearsafter the cause of action accrues.Chomerics 52

Parker Hannifin plcConditions of Sale(Practice Note: These terms are notsuitable for use in other countries unlessParker Hannifin Plc is the Seller)(as of March, 08 2005)Goods sold under these conditions aresubject to retention of title - Condition101. DEFINITIONSIn these Conditions:“the Company” means Parker Hannifinplc including all divisions andbusinesses thereof and any subsidiaryundertaking thereof (as defined in Sections258 and 259 Companies Act 1985as amended);“Conditions” means the Standard Conditionsof Sale set out in this documenttogether with any special terms agreedin writing between the Company and theBuyer;“Contract” means any contract betweenthe Company and the Buyer for the saleand purchase of the Goods formed inaccordance with Condition 2;“the Buyer” means any company, firmor individual or agent thereof to whomthe Company’s quotation or acknowledgementof order is addressed;“the Goods” means the products(including any parts or accessories),materials and/or services to be suppliedby the Company.2. APPLICABILITY OF CONDITIONSThe Company concludes Contractsfor the supply of Goods subject only tothese Conditions. The Buyer acceptsthat these Conditions shall governrelations between himself and theCompany to the exclusion of any otherterms and conditions including, withoutlimitation, conditions and warrantieswritten or oral express or implied evenif contained in any of the Buyer’s documentswhich purport to provide that theBuyer’s own terms and conditions shallprevail. No variation or qualification ofthese Conditions or of any quotationor Contract arising herefrom shall bevalid unless agreed in writing by theSecretary or a Director of the Companyor other person duly authorised by theBoard of Directors of the Company.3. QUOTATIONSThe Company’s quotations are givenwithout commitment and no Contractbetween the Company and the Buyershall arise unless and until the Companyhas accepted in writing the Buyer’sorder placed on the Company’s quotation.Quotations shall be valid for aperiod of 30 days from the date of issue,or (if different) the period specified withthe quotation itself.4. REPRESENTATIONSNo employee of the Company otherthan the Secretary or a Director of theCompany is authorised to make anystatement or representations as to theGoods, save that this restriction shallnot apply to any notice or statementcontaining a warning or restriction ofuse (“Warnings”) which may be providedin connection with the Goods. Subjectto such Warnings, the Buyer, therefore,shall not be entitled to rely or to seek torely upon any statement or representationmade by an employee or agent ofthe Company other than the Secretaryor a Director.5. PRICES(i). Subject to Condition 3, prices containedin a quotation price list catalogueand similar matter shall be based uponcurrent costs ruling at the date thereofand are for guidance only. Subject to thelater provisions of this Condition 5 thecontract price shall be the price currentat the date of delivery of the goods and/or when services are performed as thecase may be.(ii). Where firm prices are agreed (includingwithout limitation any quotationwhere the price is fixed pursuant toCondition 3) the prices will remain firmprovided that full information permittingmanufacture to proceed is received bythe Company promptly after acknowledgementof the order by the Company,and further provided the Buyer takesdelivery of the order when ready. Ifdelivery of the order or any part thereofis delayed at the ‘Buyer’s request orthrough the Buyer’s failure to providethe full information mentioned above,the Company reserves the right toamend the price of the undelivered portionto the Company’s price list prevailingat the date when delivery is made.(iii). Where a quotation is given dependenton information supplied by theBuyer, the Buyer will be responsiblefor the accuracy of the informationgiven, and for the supply of all relevantparticulars. Any increased cost incurredeither during or after manufacture resultingfrom any inaccuracy or omissionshall be borne by the Buyer alone andshall be paid promptly, and independentlyof the main contract price.(iv). Unless otherwise stated prices donot include VAT which will be chargeableat the date of despatch and/orperformance of services as the casemay be.6. DESPATCH AND DELIVERY(i). Delivery shall be deemed to occurand the risk of loss or damage ofany kind in the Goods shall pass to theBuyer on whichever of the followingevents occur earlier.(a) collection by or on behalf of theBuyer or by a carrier for despatch to theBuyer (whether or not such carrier bethe Company’s agent or servant)(b) 14 days from the date of notice givenby the Company that the Goods areready for collection or despatch.(ii). In the event that the Company shallat the specific request of the Buyerstore the Goods or arrange for theGoods to be despatched or dealt withotherwise than by collection by theBuyer then the Buyer shall pay to theCompany any reasonable charges madein the Company’s absolute discretion forthe provision or procurement of suchservices. Any such services providedby the Company shall be performedsubject to these Conditions. In the eventthat such services are to be providedby a carrier or other third party thenthe Company shall in arranging for theprovision of the same act only as theagent of the Buyer and the Buyer shallindemnify the Company against anycost, charge liability or expense (includingdemurrage) thereby incurred by theCompany.Chomerics 53

(iii). The Buyer shall carefully examinethe Goods on receipt of the same andshall by written notice to be received bythe Company within 21 days of receiptof the Goods notify the Company ofany short delivery, over delivery or anydefects reasonably discoverable oncareful examination. In the absence ofreceipt of such notice, then subject onlyto Condition 11, the Company shall bedischarged from all liability in respect ofsuch defects or short or over delivery.(iv). If the Buyer neglects to serve noticeunder sub Condition (iii) above of anyover delivery then the Company may atits option either repossess the excessGoods or invoice them and be paidforthwith by the Buyer for the excessGoods at the price ruling at the date ofdelivery.7. TIME FOR AND FORM OF DELIVERY(i). The Company will use reasonablecommercial endeavours to deliver theGoods and to perform services in accordancewith any time stated in thecontract but time of delivery or performanceshall not be of the essence tothe contract. Any such times are statedby way of general information only andin the event of failure to despatch ordeliver or perform within such times forany cause (whether within or) outsidethe Company’s reasonable control, thesame shall not be a breach or repudiationof the contract nor shall theCompany have any liability to the Buyerfor any direct, indirect or consequentialloss (all three of which terms includewithout limitation pure economic loss,loss of profits, loss of business, depletionof goodwill and like loss) howevercaused (including as a result of negligence)by delay or failure in deliveryexcept as set out in this Condition 7(i).Any delay or failure in delivery will notentitle the Buyer to cancel the orderunless and until the Buyer has given60 days’ written notice to the Companyrequiring delivery to be made and theCompany has not fulfilled deliverywithin that time. If the Buyer then cancelsthe order:(a) the Company will refund the Buyerany sums the Buyer has paid to theCompany in respect of that cancelledorder; and(b) the Buyer will be under no liability tomake any payments in respect of thatcancelled order.(ii). (a) If the Contract does not otherwiseprovide the Company shall be entitledto deliver Goods by single deliveryor by instalments at its option.(b) If the Contract provides for deliveryby instalments or the Company soelects each instalment shall be deemedto be the subject of a separate contracton these conditions and withoutprejudice to sub-paragraph (i) hereofnon-delivery or delay in delivery shallnot affect the balance of the contractnor entitle the Buyer to terminate thesame.(iii). In the event that the Goods shallnot have been collected by or on behalfof the Buyer or by a carrier for despatchto the Buyer within 14 days of theCompany’s written notice pursuant toCondition 6 (i) (b) hereof then the Companymay at any time thereafter send tothe Buyer a further notice notifying theBuyer of the Company’s intention to sellthe same after the expiration of a periodof not less than 7 days from the dateof the notice and any such sale by theCompany may be on a forced sale basis.The Buyer shall be liable for the Company’scharges and expenses for thesale and for the storage of the Goods(which shall be at the risk of the Buyer)pending their sale hereunder or deliveryto the Buyer. The Company shall chargeall costs incurred on a weekly basis forstorage.8. PERFORMANCE PREVENTED ORHINDEREDThe Company shall not be liable for anydelay of failure in carrying out its obligationswhich is caused wholly or partlyby reason of act of God, delay in transportation,labour disputes, fire, flood,war, accident, Government action, inabilityto obtain adequate labour, materials,manufacturing facilities or energy,or any other cause beyond the Company’scontrol or that of its servants oragents, and if the delay or failure hascontinued for a period of 3 months theneither party may give notice in writing tothe other determining the contract andon such termination the Company shallrefund to the Buyer the price of theGoods or any part thereof already paidto the Company after deduction of anyamount due to the Company includingany amount under Condition 17 hereof.9. PAYMENT(i). Unless expressly agreed in writingpayment shall be made in sterling incleared funds without any deductionset-off, restriction condition or defermenton account of any disputes orcross claims or present or future taxes,levies, duties or charges whatsoever(unless and to the extent the Buyer isrequired by law to make such deduction)on or before the last day of themonth following the month of the invoicefor the Goods. Where full paymentis not received by the due date interestshall accrue on the sum outstandingat the rate of 3% per annum above thebase rate of Lloyds Bank plc (as variedfrom time to time) calculated on a dailybasis but without prejudice to the Company’srights to receive payments on thedue dates.(ii). Time for payment shall be of theessence and in the event of delay ordefault in any payment for more than7 days, the Company shall be entitledto suspend deliveries of Goods (beingthose Goods the subject of the defaultand any other Goods the subject of anyagreed order) and/or treat the Contract(and any other Contract between theCompany and the Buyer) as repudiatedand/or re sell any of the Goods in itspossession and be indemnified by theBuyer for any loss thereby incurred.(iii). All sums payable to the Companyunder the Contract will become dueimmediately on termination of theContract.(iv). The Buyer shall pay for any samples,sale or return, loan or demonstrationgoods and/or materials, includingdrawings, plans, specifications etc. notreturned within one month from thedate of receipt by the Buyer unless adifferent period for the return of suchgoods and/or materials is agreed betweenthe Company and the Buyer.10. PROPERTY IN GOODS(i) The Company shall retain absoluteownership of the property in the Goodswhich shall not pass to the Buyer andthe Buyer shall keep and retain theGoods as bailee for and on behalf ofthe Company and shall deliver up theGoods to the Company at the Company’srequest until the Company has receivedfull payment of the price of the Goodsand full payment of any other sumswhatsoever which are outstanding fromthe Buyer to the Company whether ornot due and owing, and until such timethe Buyer:(a) shall insure the Goods against theusual risks with an insurance office ofrepute;(b) shall store separately the Goodsor in some other way ensure that theGoods are readily identifiable as theproperty of the Company;Chomerics 54

(c) irrevocably authorises the representativesof the Company at any timein circumstances where the provisionsof Condition 19 may apply to enter theBuyer’s premises where the Goods areor are thought by the Company to bestored for the purpose of repossessingthe Goods;(d) shall keep and retain the Goods freefrom any charge lien or other encumbrancethereon.(ii). Provided always that no circumstanceshave arisen where the provisionsof Condition 17 may apply theBuyer shall be entitled to offer forsale and sell the Goods in the ordinarycourse of business as principal and notas agent at the best obtainable price,and shall be a sale of the Company’sproperty on the Buyer’s own behalfand the Buyer will deal as principal inrespect of such sale. Notwithstandingthe other provisions of the Contract,payment shall become due (unless paymenthas already become due or beenpaid) when the Buyer receives paymentupon its own sale of the Goods (or otheritems incorporating the Goods).(iii). If the Buyer incorporates any Goodswithin other equipment or productsprovided that the Goods remain readilyidentifiable and a removable part ofsuch other equipment or products theprovisions of Condition 10(i) shall apply.(iv). If the provisions of Condition 10(iii)apply the Buyer shall store separatelythe other equipment or products incorporatingthe Goods and shall notifythe Company of the precise locationand position thereof. The provisions ofCondition 10(ii) hereof shall apply mutatismutandis in respect of the Goodscontained within such other equipmentor products owned by the Company.(v). The Company shall be entitled toexercise a general lien or right of retentionon all goods or any parts thereofin the Company’s possession whichare the Buyer’s property for any sumswhatsoever due to the Company andpursuant to such lien or right the Companyshall be entitled without notice tothe Buyer to sell all or any part of suchGoods or part thereof privately or byauction or otherwise and to keep theproceeds of sale in diminution of suchsums and of all costs and expensesincurred by the Company in effectingthe said sales.11. WARRANTY AND LIMITATIONOF LIABILITY(i). The Company warrants that products,parts or materials manufacturedby it will be of good materials and workmanshipand that reasonable care willbe employed in assembling or incorporatingitems not manufactured by it andin performing services so that upon theBuyer giving written notice to the Companythat Goods have not been suppliedor services performed as aforesaid ifthe same be established the Companywill at its own expense at its optionreplace or repair such defective goodsor remedy such defaults in service.The warranty obligation shall not applywhere the Goods have been tamperedwith, improperly altered, repaired ormaintained, installed or connected orsubject to misuse (in each case otherthan as a result of the Company’s ownacts or omissions). The Buyer shall atits own cost return the Goods to theCompany for inspection.(ii). The same term shall apply mutatismutandis in respect of such replacement,repair or remedial services.(iii). The above warranty shall apply inrespect of matters whereof the Buyergives written notice within 12 monthsof delivery or 6 months from installation(whichever is the shorter period)or within 12 months of performance orof replacement repair or remedial servicesrespectively after which any claimin respect thereof shall be absolutelybarred (subject to the other provisionsof this Condition 11).(iv) . The Company does not exclude itsliability (if any) to the Buyer:(a) for breach of the Company’s obligationsarising under Section 12 Sale ofGoods Act 1979 or Section 2 Supply ofGoods and Services Act 1982;(b) for personal injury or death resultingfrom the Company’s negligence;(c) under section 2(3) Consumer ProtectionAct 1987;(d) for any matter which it would beillegal for the Company to exclude or toattempt to exclude its liability; or(e) for fraud.(v). Except as provided in Conditions 7(i)and 11(i) to (iv), the Company will beunder no liability to the Buyer whatsoever(whether in contract, tort (includingnegligence), breach of statutoryduty, restitution or otherwise) for anyinjury, death, damage or direct, indirector consequential loss (all three of whichterms include, without limitation, pureeconomic loss, loss of profits, loss ofbusiness, depletion of goodwill and likeloss) howsoever caused arising out of orin connection with:(a) any of the Goods, or the manufactureor sale or supply, or failure or delay insupply, of the Goods or performanceor failure or delay in performance ofservices by the Company or on the partof the Company’s employees, agents orsub-contractors;(b) any breach by the Company of anyof the express or implied terms of theContract;(c) any use made or resale by the Buyerof any of the Goods, or of any productincorporating any of the Goods;(d) any statement made or not made,or advice given or not given, by or onbehalf of the Company.(vi). Except as set out in Conditions 7(i)and 11(i) to (iv), the Company excludesto the fullest extent permissible by lawall conditions, warranties and stipulations,express (other than those set outin the Contract) or implied, statutory,customary or otherwise which, but forsuch exclusion, would or might subsistin favour of the Buyer.(vii) Each of the Company’s employees,agents and subcontractors may relyupon and enforce the exclusions andrestrictions of liability in Conditions 7(i)and 11(iv) to (vi) in that person’s ownname and for that person’s own benefitas if the words “its employees, agentsand subcontractors” followed “Company”where it appears in those Conditions(save for Condition 11(v)(a)).(viii). Without prejudice to the foregoingif called upon so to do by the Buyer inwriting the Company shall use its bestendeavours to assign to the Buyer thebenefits of any warranty, guarantee, indemnity,claim, privilege or other rightswhich the Company may have in regardto manufacturers or suppliers of anygoods not manufactured by the Companyin relation to the quality, conditionor description of such goods.12. OPERATING INSTRUCTIONS(i) The Company supplies with theGoods adequate information as to theirdesign and conditions of the instructionsfor operation for compliance withits obligations under Section 6 (1) (c) ofthe Health and Safety at Work Act 1974.(ii) The Buyer undertakes that all necessarysteps will be taken to ensure thatthe Goods will be safe and without riskto health when properly used in ac-Chomerics 55

cordance with Section 6 (8) of the Healthand Safety at Work etc. Act 1974.13. DRAWINGS, SPECIFICATIONSETC.(i) All descriptions, drawings, illustrations,particulars of weights andmeasures rating standard statementsor details or specifications or otherdescriptive matter, whether or notcontained in the contract document, areapproximate only. The Goods will be inaccordance with the Company’s specificationsat the time of manufactureand any earlier specifications drawings,descriptions, illustrations, particularsas to weights and measures ratingstandard statements or details shall notform part of the description of the partsor services supplied or to be suppliedso that the Company shall not be underany liability in respect thereof.(ii) Where Goods are supplied by theCompany to the Buyer in accordancewith the Buyer’s design or specificationor where the Company shall designitems not within the standard range ofproducts at the Buyer’s request no warrantyis given or implied as to the suitabilityof such goods or items unless theBuyer has made the Company awareof the particular purpose for which theBuyer is proposing to use the goods oritems in which case Condition 11 shallapply. The Company shall be entitled tocharge a fee for any research or designundertaken in connection with the supplyof Goods not within their standardrange of products.14. INSPECTION AND TESTINGThe Company undertakes inspection ofall Goods prior to delivery and wherepracticable submits to standard tests atthe Company’s premises Special testsor standard tests in the presence of theBuyer or his representative may be undertakenby the Company at the requestand expense of the Buyer but unlessotherwise agreed such tests shall beconducted at the Company’s premises.15. INDUSTRIAL PROPERTYRIGHTS(i) All intellectual property rights subsistingin or relating to any calculations,data, specifications, designs, drawings,papers, documents, procedures,techniques, acceptance, maintenanceand other tests special and recommendedparts and other equipmentand any other material and informationwhatsoever given to the Buyer by theCompany in connection with the supplyof the Goods by the Company to theBuyer or otherwise are vested in theCompany. The Buyer will not whether byitself its officers servants agents or anyof them or otherwise howsoever copy orreproduce any such items or material inwhole or in part nor will it disclose anysuch information in whole or in part toany third party. Further the Companyshall be entitled to the ownership of allintellectual property rights subsistingin or relating to any calculations, data,specifications, designs, drawings, papers,documents or other items materialor information conceived originateddeveloped or produced by the Companyfor the Buyer pursuant to the contractfor the supply of Goods.(ii) The Buyer shall not at any time forany reason whatsoever disclose orpermit to be disclosed to any person orpersons whatsoever or otherwise makeuse of or permit to be made use ofany trade secrets or other confidentialinformation relating to the equipmenttechnology business affairs or financesof the Company or any associated Companyor organisation of the Companyor relating to the Company’s agentsdistributors licensees or other customersor in respect of any of their dealingsor transactions.(iii) The Buyer shall not seek to applyor apply to register in its own name anyof the Company’s intellectual propertyrights and in particular those subsistingin or relating to the Goods or a partthereof nor shall it represent in any waythat it has any right or title to the ownershipof any such intellectual propertyrights nor shall it do any act or thingwhich might be contrary to the interestor rights of the Company in such rightsand in particular challenge the ownershipor validity of such rights.(iv) The Buyer at its own expense shalldo all such acts and things and shallsign and execute all such deeds anddocuments as the Company in its solediscretion may require in connectionwith any steps or proceedings taken bythe Company to restrain the infringementof it intellectual property rights.(v) The Buyer undertakes and agreesthat the use of any of its calculations,data, specifications, designs, drawings,papers, documents, procedures,techniques, acceptance, maintenanceand other tests special and recommendedparts and other equipment andother material and information by thecompany when manufacturing and supplyingthe Goods will not infringe anyintellectual property rights of a thirdparty and shall indemnify the Companyin respect of any such infringement.(vi) The Buyer shall not alter or removeany trade mark of the Company whichhas been applied to the Goods nor applyany other trade mark to the Goods normake any alteration to their packagingand get up.(vii) The provisions of this Condition 15shall survive the expiry or terminationof any Contract for whatever reason.16. SUB CONTRACTINGThe Company shall be entitled to subcontract all or any of its obligationshereunder.17. DETERMINATIONIf the Buyer shall make default in orcommit a breach of the contract or ofany of his obligations to the Companyor if any distress or execution shallbe levied upon the Buyer’s propertyor assets, or if the Buyer shall makeor offer to make any arrangement orcomposition with creditors or commitany act of bankruptcy, or if any petitionor receiving order in bankruptcy shallbe presented or made against him, orif the Buyer is a limited company andany resolution or petition to wind upsuch company’s business (other thanfor the purpose of a solvent amalgamationor reconstruction) shall bepassed or presented, or if a receiverof such company’s undertaking propertyor assets or any part thereof shallbe appointed the Company shall havethe right forthwith to determine anyContract then subsisting and uponwritten notice of such determinationbeing given to the Buyer any subsistingContracts shall be deemed to have beendetermined and the Company shall beentitled to recover from the Buyer alllosses thereby arising including but notlimited to those under Condition 18 ofthese Conditions or otherwise.18. PARTIAL COMPLETIONIn the case of partial completion of anorder by reason of any of the eventsreferred to in Conditions 8 or 17 theCompany shall be entitled to a quantummeruit in respect of all work done byit including labour costs and materialsand any charges or expenses which theCompany is committed to pay sub contractorsor third parties without prejudiceto its rights should non completionbe occasioned by the Buyer.Chomerics 56

19. NOTICESUnless otherwise provided in writingany written communication or noticeunder the Contract shall be made orgiven by sending the same by ordinaryprepaid first class letter post in the caseof the Company to its current addressand in the case of the Buyer to its lastknown address and if so sent shall bedeemed to be made or given two daysafter the date when posted.20. WAIVERAny failure by the Company to enforceany or all these Conditions shall notbe construed as a waiver of any of theCompany’s rights.21. CONTRACTS (RIGHTS OF THIRDPARTIES) ACTThe parties to the Contract do notintend that any of its terms will beenforceable by virtue of the Contracts(Rights of Third Parties) Act 1999 by anyperson not a party to it.22. LAW AND INTERPRETATIONThe Contract shall be governed byEnglish law and the Buyer shall submitto the non exclusive jurisdiction of theEnglish Courts. If any of these Conditionsor any part thereof is renderedvoid or unenforceable by any legislationto which it is subject or by any rule oflaw it shall be void or unenforceable tothat extent and no further.Chomerics 57

Chomerics Capabilities Include:THERMAL MANAGEMENT & CONTROL• Thermally conductive gap filler pads• Dispensed thermal gap fillers• Silicone-free thermal pads• Phase-change materials (PCM)• Polymer solder hybrids (PSH)• Dispensable thermal compounds• Thermal grease and gels• Insulator pads• Thin flexible heat spreaders• Custom integrated thermal/EMI assembliesEMI SHIELDING & COMPLIANCE• Conductive elastomers – molded, extruded, and form-in-place (FIP)• Conductive foam based gaskets – fabric-over-foam and z-axis foam• Conductive compounds – adhesives, sealants and caulks• RF and thermal/RF absorbing materials• EMI shielding plastics and injection molding services• Coatings – direct metallization and conductive paints• Metal gaskets – Springfingers, metal mesh and combination gaskets• Foil laminates and conductive tapes• EMI shielding vents – commercial and military honeycomb vents• Shielded optical windows• Cable shielding – ferrites and heat-shrink tubing/wire mesh tape/zippered cable shielding• Compliance and safety test servicesOPTICAL DISPLAY PRODUCTS• EMI shielding filters(conductive coating & wire mesh)• Ant-reflective/contrast enhancement filters• Plastic or glass laminations• Hard coated lens protectors• Touch screen lensesAbout Parker Hannifin CorporationWith annual sales exceeding $12 billion, Parker Hannifin is the world’s leading diversified manufacturerof motion and control technologies and systems, providing precision-engineered solutionsfor a wide variety of commercial, mobile, industrial and aerospace markets. The companyemploys more than 61,000 people in 48 countries around the world. Parker has increased its annualdividends paid to shareholders for 52 consecutive years, among the top five longest-runningdividend-increase records in the S&P 500 index. For more information, visit the company’s website at http://www.parker.com, or its investor information site at http://www.phstock.com.Chomerics

Chomerics WorldwideCorporate FacilitiesTo Place an Order Please Contact a Customer Service Representative at the Following LocationsNorth AmericaDivision HeadquartersWoburn, MAPhone +1 781-935-4850Fax +781-933-4318chomailbox@parker.comEuropeHigh Wycombe, UKPhone +44 1494 455400Fax +44 14944 55466chomerics_europe@parker.comAsia PacificHong KongPhone +852 2428 8008Fax +852 2786 3446chomerics_ap@parker.comCranford, NJPhone +1 908-272-5500Fax + 1 908-272-2741Saint Ouen l’Aumône, FrancePhone +33 1343 23900Fax +33 1343 25800Manufacturing FacilitiesWoburn, MA; Cranford, NJ ; Millville, NJ; Fairport, NY; Grantham, UK, Beijing; Shanghai; Shenzhen; Tokyo, Japan.Additional Facilities:Hudson, NH; Guadalajara & Monterrey, Mexico; Oulu, Finland; Sadska, Czech Republic; Tianjin, China; Chennai, India.www.chomerics.comwww.parker.com/chomericsCHOMERICS, CHO-FORM, THERMATTACH, THERMFLOW, and T-WING are registered trademarks of Parker Hannifin Corporation.C-WING, THERM-A-FORM, and THERM-A-GAP are trademarks of Parker Hannifin Corporation. Other trademarks are the property of theirrespective owners.© 2008 Parker Hannifin Corporation. All rights reserved.Literature Number: THERM CAT 1001 EN April 2009 Rev EChomericsENGINEERING YOUR SUCCESS.