Manufacturing And Reliability Challenges With QFN - SMTA

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Dendritic Growth (cont.)• The electric field strength between adjacent conductors is astrong driver for dendritic growth Voltage / distance• Digital technology typically has a maximum field strength of0.5 V/mil TSSOP80 with 3.3VDC power and 16 mil pitch• Previous generation analog / power technology had a maximumfield strength of 1.6 V/mil SOT23 with 50VDC power and 50 mil pitch• Introduction of <strong>QFN</strong> has resulted in electric fields as high as3.5 V/mil 24VDC and 16 mil pitch© 2004 - 200943
Dendritic Growth (cont.)• Some component manufacturers are aware of thisissue and separate power and groundLinear Technologies (left) has strong separation power andgroundIntersil (right) has power and ground on adjacent pins© 2004 - 200944
Page 4 and 5: Who Uses DfR?Military / Avionics /
Page 6 and 7: Knowledge and Education(Website)•
Page 8 and 9: Introduction (cont.)• Why is know
Page 10 and 11: Component Packaging• Most of us h
Page 12 and 13: 2 nd Level Interconnect Reliability
Page 14 and 15: Solder Wearout (cont.)• Eliminati
Page 17 and 18: Industry Response to SJ Wearout?•
Page 19 and 20: Quad Flat Pack No-Lead (QFN)© 2004
Page 21 and 22: QFN (cont.)• Availability 1 x 2 m
Page 24 and 25: Advantages: Thermal Performance•
Page 26 and 27: QFN: Why Not?• QFN is a ‘next g
Page 28 and 29: Bond Pads (cont.)• Extend bond pa
Page 30 and 31: Singulated operationTitle: Reliabil
Page 32 and 33: Title: Reliability study of surface
Page 34 and 35: Manufacturability (Rework)• Can b
Page 36 and 37: Manufacturability (cont.)• QFN so
Page 38 and 39: Reliability (Thermal Cycling)• Or
Page 40 and 41: Reliability (Bend Cycling)• Low d
Page 44: QFN: Risk Mitigation• Assess manu

Manufacturing And Reliability Challenges With QFN - SMTA

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