Manufacturing And Reliability Challenges With QFN - SMTA
Manufacturing And Reliability Challenges With QFN - SMTA
Manufacturing And Reliability Challenges With QFN - SMTA
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Manufacturability (Stencil Design)• Stencil thickness and aperture design can be crucial formanufacturabilityExcessive amount of paste can inducefloat, lifting the <strong>QFN</strong> off the boardExcessive voiding can also be inducedthrough inappropriate stencil design• Follow manufacturer’s guidelinesGoal is 2-3 mils of solder thickness• Rules of thumb (thermal pad) Ratio of aperture/pad ~0.5:1 Consider multiple, smaller apertures(avoid large bricks of solder paste) Reduces propensity for solder balling© 2004 - 200936