Manufacturing And Reliability Challenges With QFN - SMTA

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Title: <strong>Reliability</strong> study of surface mount printed circuit board assemblies with lead-free solder jointsAuthor(s): Jeffery C.C. Lo, B.F. Jia, Z. Liu, J. Zhu, S.W. Ricky LeeJournal: Soldering & Surface Mount TechnologyYear: 2008, Volume: 20, Issue: 2, Page: 30 - 38© 2004 - 200932
• A large convex fillet is often an indication of issuesPoor wetting under the <strong>QFN</strong>Tilting due to excessive solder paste under the thermal padElevated solder surface tension, from insufficient solderpaste under the thermal pad, pulling the package down© 2004 - 200933
Page 4 and 5: Who Uses DfR?Military / Avionics /
Page 6 and 7: Knowledge and Education(Website)•
Page 8 and 9: Introduction (cont.)• Why is know
Page 10 and 11: Component Packaging• Most of us h
Page 12 and 13: 2 nd Level Interconnect Reliability
Page 14 and 15: Solder Wearout (cont.)• Eliminati
Page 17 and 18: Industry Response to SJ Wearout?•
Page 19 and 20: Quad Flat Pack No-Lead (QFN)© 2004
Page 21 and 22: QFN (cont.)• Availability 1 x 2 m
Page 24 and 25: Advantages: Thermal Performance•
Page 26 and 27: QFN: Why Not?• QFN is a ‘next g
Page 28 and 29: Bond Pads (cont.)• Extend bond pa
Page 30 and 31: Singulated operationTitle: Reliabil
Page 34 and 35: Manufacturability (Rework)• Can b
Page 36 and 37: Manufacturability (cont.)• QFN so
Page 38 and 39: Reliability (Thermal Cycling)• Or
Page 40 and 41: Reliability (Bend Cycling)• Low d
Page 42 and 43: Dendritic Growth (cont.)• The ele
Page 44: QFN: Risk Mitigation• Assess manu

Manufacturing And Reliability Challenges With QFN - SMTA

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