Manufacturing And Reliability Challenges With QFN - SMTA

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Bond Pads (cont.)• Extend bond pad 0.2 – 0.3 mm beyondpackage footprintMay or may not solder to cut edgeAllows for better visual inspection• Really need X-ray for best resultsAllows for verification of bridging,adequate solder coverage andvoid percentageNote: Lacking in good criteriafor acceptable voiding© 2004 - 200928
Singulated through sawingSingulated through punching• Concave fillet possible with both sawed or punched <strong>QFN</strong> Short storage times, active flux• Greater opportunity with punched <strong>QFN</strong> More copper exposed© 2004 - 200929
Page 4 and 5: Who Uses DfR?Military / Avionics /
Page 6 and 7: Knowledge and Education(Website)•
Page 8 and 9: Introduction (cont.)• Why is know
Page 10 and 11: Component Packaging• Most of us h
Page 12 and 13: 2 nd Level Interconnect Reliability
Page 14 and 15: Solder Wearout (cont.)• Eliminati
Page 17 and 18: Industry Response to SJ Wearout?•
Page 19 and 20: Quad Flat Pack No-Lead (QFN)© 2004
Page 21 and 22: QFN (cont.)• Availability 1 x 2 m
Page 24 and 25: Advantages: Thermal Performance•
Page 26 and 27: QFN: Why Not?• QFN is a ‘next g
Page 30 and 31: Singulated operationTitle: Reliabil
Page 32 and 33: Title: Reliability study of surface
Page 34 and 35: Manufacturability (Rework)• Can b
Page 36 and 37: Manufacturability (cont.)• QFN so
Page 38 and 39: Reliability (Thermal Cycling)• Or
Page 40 and 41: Reliability (Bend Cycling)• Low d
Page 42 and 43: Dendritic Growth (cont.)• The ele
Page 44: QFN: Risk Mitigation• Assess manu

Manufacturing And Reliability Challenges With QFN - SMTA

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