Manufacturing And Reliability Challenges With QFN - SMTA

More documents

Recommendations

Info

<strong>QFN</strong> Advantages: Size and Cost• Smaller, lighter and thinner than comparable leadedpackagesAllows for greater functionality per volume• Reduces costComponent manufacturers: More ICs per frameOEMs: Reduced board size• Attempts to limit the footprint of lower I/O deviceshave previously been stymied for cost reasonsBGA materials and process too expensive© 2004 - 200922
Page 4 and 5: Who Uses DfR?Military / Avionics /
Page 6 and 7: Knowledge and Education(Website)•
Page 8 and 9: Introduction (cont.)• Why is know
Page 10 and 11: Component Packaging• Most of us h
Page 12 and 13: 2 nd Level Interconnect Reliability
Page 14 and 15: Solder Wearout (cont.)• Eliminati
Page 17 and 18: Industry Response to SJ Wearout?•
Page 19 and 20: Quad Flat Pack No-Lead (QFN)© 2004
Page 21: QFN (cont.)• Availability 1 x 2 m
Page 25 and 26: Advantages: Inductance• At higher
Page 27 and 28: QFN Manufacturability (BondPads)•
Page 29 and 30: Singulated through sawingSingulated
Page 31 and 32: • Convex or absence of fillet hig
Page 33 and 34: • A large convex fillet is often
Page 35 and 36: Manufacturability (Stencil Design)
Page 37 and 38: Manufacturability (Board Flexure)
Page 39 and 40: Thermal Cycling (ConformalCoating)
Page 41 and 42: Reliability (Dendritic Growth)• L
Page 43 and 44: Dendritic Growth (cont.)• Some co

Manufacturing And Reliability Challenges With QFN - SMTA

Create successful ePaper yourself

Delete template?

Save as template?