Manufacturing And Reliability Challenges With QFN - SMTA

More documents

Recommendations

Info

QFN: What is it?• Quad Flat Pack No Lead or Quad Flat Non-Leaded‘The poor man’s ball grid array’Also known as• Leadframe Chip Scale Package (LF-CSP)• MicroLeadFrame (MLF)• Others (MLP, LPCC, QLP, HVQFN, etc.)• Overmolded leadframe with bond pads exposed on thebottom and arranged alongthe periphery of the packageDeveloped in the early tomid-1990’s by Motorola,Toshiba, Amkor, etc.Standardized by JEDEC/EIAJ inlate-1990’sFastest growing package type© 2004 - 200920
QFN (cont.)• Availability 1 x 2 mm (3 leads) to 14 x 14 mm (120 leads) Dual row may increase I/O count to above 150• Expected to dominate lead counts between 8 to 68Obsolescence of QFP and SOP?• Numerous package outline versions (JEDEC) MO-196 (1998) Available in two and four-sided• Other variationsSingulated (punched) and sawedSingle row and dual row© 2004 - 200921
Page 4 and 5: Who Uses DfR?Military / Avionics /
Page 6 and 7: Knowledge and Education(Website)•
Page 8 and 9: Introduction (cont.)• Why is know
Page 10 and 11: Component Packaging• Most of us h
Page 12 and 13: 2 nd Level Interconnect Reliability
Page 14 and 15: Solder Wearout (cont.)• Eliminati
Page 17 and 18: Industry Response to SJ Wearout?•
Page 19: Quad Flat Pack No-Lead (QFN)© 2004
Page 24 and 25: Advantages: Thermal Performance•
Page 26 and 27: QFN: Why Not?• QFN is a ‘next g
Page 28 and 29: Bond Pads (cont.)• Extend bond pa
Page 30 and 31: Singulated operationTitle: Reliabil
Page 32 and 33: Title: Reliability study of surface
Page 34 and 35: Manufacturability (Rework)• Can b
Page 36 and 37: Manufacturability (cont.)• QFN so
Page 38 and 39: Reliability (Thermal Cycling)• Or
Page 40 and 41: Reliability (Bend Cycling)• Low d
Page 42 and 43: Dendritic Growth (cont.)• The ele
Page 44: QFN: Risk Mitigation• Assess manu

Manufacturing And Reliability Challenges With QFN - SMTA

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?