Manufacturing And Reliability Challenges With QFN - SMTA

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Solder Wearout (cont.)• Elimination of leaded devices Provides lower RC and higher package densities Reduces complianceCycles to failure-40 to 125C QFP: >10,000 BGA: 3,000 to 8,000CSP / Flip Chip:
Solder Wearout (cont.)• Design change: More silicon, less plastic• Increases mismatch in coefficient of thermalexpansion (CTE)BOARD LEVEL ASSEMBLY AND RELIABILITYCONSIDERATIONS FOR <strong>QFN</strong> TYPE PACKAGES,Ahmer Syed and WonJoon Kang, Amkor Technology.© 2004 - 200915
Page 4 and 5: Who Uses DfR?Military / Avionics /
Page 6 and 7: Knowledge and Education(Website)•
Page 8 and 9: Introduction (cont.)• Why is know
Page 10 and 11: Component Packaging• Most of us h
Page 12 and 13: 2 nd Level Interconnect Reliability
Page 17 and 18: Industry Response to SJ Wearout?•
Page 19 and 20: Quad Flat Pack No-Lead (QFN)© 2004
Page 21 and 22: QFN (cont.)• Availability 1 x 2 m
Page 24 and 25: Advantages: Thermal Performance•
Page 26 and 27: QFN: Why Not?• QFN is a ‘next g
Page 28 and 29: Bond Pads (cont.)• Extend bond pa
Page 30 and 31: Singulated operationTitle: Reliabil
Page 32 and 33: Title: Reliability study of surface
Page 34 and 35: Manufacturability (Rework)• Can b
Page 36 and 37: Manufacturability (cont.)• QFN so
Page 38 and 39: Reliability (Thermal Cycling)• Or
Page 40 and 41: Reliability (Bend Cycling)• Low d
Page 42 and 43: Dendritic Growth (cont.)• The ele
Page 44: QFN: Risk Mitigation• Assess manu

Manufacturing And Reliability Challenges With QFN - SMTA

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