Manufacturing And Reliability Challenges With QFN - SMTA
Manufacturing And Reliability Challenges With QFN - SMTA
Manufacturing And Reliability Challenges With QFN - SMTA
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Solder Wearout in Next GenPackagingPerformance Needs• Higher frequencies and data transfer rates Lower resistance-capacitance (RC) constants• Higher densities More inside less• Lower voltage, but higher current Joule heating is I 2 R• Has resulted in less robust package designs© 2004 - 200913