Manufacturing And Reliability Challenges With QFN - SMTA

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Component Packaging• Most of us have little influence overcomponent packaging Most devices offer only one or two packagingstyles• Why should you care? Poor understanding of component qualificationprocedures Who tests what and why?© 2004 - 200910
Component Testing• <strong>Reliability</strong> testing performed by componentmanufacturers is driven by JEDEC JESD22 series (A & B)• Focus is almost entirely on die, packaging, and 1 stlevel interconnections (wire bond, solder bump, etc.)• Only focus on 2 nd level interconnects (solder joints)is JESD22-B113 Cyclic Bend TestDriven by cell phone industryThey have little interest in thermal cycling or vibration!© 2004 - 200911
Page 4 and 5: Who Uses DfR?Military / Avionics /
Page 6 and 7: Knowledge and Education(Website)•
Page 8 and 9: Introduction (cont.)• Why is know
Page 12 and 13: 2 nd Level Interconnect Reliability
Page 14 and 15: Solder Wearout (cont.)• Eliminati
Page 17 and 18: Industry Response to SJ Wearout?•
Page 19 and 20: Quad Flat Pack No-Lead (QFN)© 2004
Page 21 and 22: QFN (cont.)• Availability 1 x 2 m
Page 24 and 25: Advantages: Thermal Performance•
Page 26 and 27: QFN: Why Not?• QFN is a ‘next g
Page 28 and 29: Bond Pads (cont.)• Extend bond pa
Page 30 and 31: Singulated operationTitle: Reliabil
Page 32 and 33: Title: Reliability study of surface
Page 34 and 35: Manufacturability (Rework)• Can b
Page 36 and 37: Manufacturability (cont.)• QFN so
Page 38 and 39: Reliability (Thermal Cycling)• Or
Page 40 and 41: Reliability (Bend Cycling)• Low d
Page 42 and 43: Dendritic Growth (cont.)• The ele
Page 44: QFN: Risk Mitigation• Assess manu

Manufacturing And Reliability Challenges With QFN - SMTA

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