13.07.2015 Views

Study of radiation damage in silicon detectors for high ... - F9

Study of radiation damage in silicon detectors for high ... - F9

Study of radiation damage in silicon detectors for high ... - F9

SHOW MORE
SHOW LESS
  • No tags were found...

Create successful ePaper yourself

Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.

2. Operation and Radiation Damage <strong>of</strong> Silicon Detectors 152.1.2 Inuence <strong>of</strong> External VoltageFor charged particle detection, the e;h pairs created <strong>in</strong> the depletion region by a travers<strong>in</strong>gparticle are separated by the electric eld, collected and read out. The charge created<strong>in</strong> the neutral, non-depleted region recomb<strong>in</strong>es with free carriers and is lost. Increas<strong>in</strong>gthe depth <strong>of</strong> the space charge region thus <strong>in</strong>creases the collected signal.To obta<strong>in</strong> maximal signal one would like tohave the whole thickness <strong>of</strong> the detectordepleted <strong>of</strong> free carriers. This can be achieved by apply<strong>in</strong>g an external voltage V withthe same polarity as the built <strong>in</strong> potential. In that case V bi <strong>in</strong> equation 2.7 is replaced byV bi + V . S<strong>in</strong>ce usually V V bi , V bi can be omitted and we obta<strong>in</strong>w(V ) =r2Si 0e 0 N DV : (2.9)The voltage necessary to deplete the full depth <strong>of</strong> the detector (W ), called the full depletionvoltage (FDV or V FD ), is thus given byV FD = e 0N D W 22 Si 0: (2.10)It can be seen that the relation between V FD and N D depends quadratically on sampledepth. For 300 m thick samples, the conversion constant isV FD =6:95 10 ;11 Vcm 3 N D .For a semiconductor with both electrons and holes as carriers, bulk resistivity isgiven by [8] =1e 0 ( e n + h p)(2.11)where e and h are electron and hole mobilities (1350 and 480 cm 2 /Vs at room temperature,respectively). For a fully ionised shallow-dopant n-type <strong>silicon</strong>, n N D and p n.Equation 2.11 can thus be simplied to =1e 0 e N D (2.12)relat<strong>in</strong>g resistivity and <strong>in</strong>itial donor concentration. For a typical value <strong>of</strong> = 5 kcm oneobta<strong>in</strong>s N D 9 10 11 cm ;3 .High resistivityn-type material ( >2 kcm), that is usually used <strong>for</strong> the low dopedn side <strong>of</strong> <strong>silicon</strong> track<strong>in</strong>g <strong>detectors</strong>, is obta<strong>in</strong>ed by donor compensation 7 . This means thatdonor and acceptor concentrations are <strong>of</strong> the same order <strong>of</strong> magnitude, and N D has to bereplaced by the dierence <strong>of</strong> the donor and acceptor concentrationsN D ! N eff = jN D ; N A j : (2.13)7Neutron dop<strong>in</strong>g is usually used to obta<strong>in</strong> <strong>high</strong> resistivity n-type material [8, 9].

Hooray! Your file is uploaded and ready to be published.

Saved successfully!

Ooh no, something went wrong!