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TMS416165,536·81T MUL TIPORT MEMORYrecommended operating conditionsPARAMETER MIN NOM MAX UNITSupply voltage, VOO 4.5 5 5.5 VSupply voltage, VSS 0 VHigh-level input voltage, VIH 2.4 VOO+0.3 VLow-level input voltage, VIL (see Note 2) -1 0.8 VOperating free-air temperature, T A 0 70 °CNOTE 2:The algebraic convention, where the more negative (less positive) limit is designated as minimum, is used in this data sheet for logic voltage levels only.electrical characteristics over full range of recommended operating conditions (unless otherwise noted)c-s:mjc.s:(t)..3o-
TMS416165,536-0IT MULTIPORT MEMORYcapacitance over recommended supply voltage and operating free-air temperature range, f1 MHzPARAMETER Typt MAX UNITCi(A) Input capacitance, address inputs 4 5 pFCi(D) Input capacitance, data input 4 5 pFCURCI Input capacitance, strobe inputs 8 10 pFCi(W) Input capacitance, write enable input 8 10 pFCi(CK) Input capacitance, serial clock 8 10 pFCi(SI) Input capacitance, serial in 4 5 pFCi(SOE) Input capacitance, serial output enable 4 5 pFCi(TR) Input capacitance, register transfer input 4 5 pFCo(O) Output capacitance, random-access data 5 7 pFCo(SOUT) Output capacitance, serial out 5 7 pFt <strong>Al</strong>l typical values are at T A = 25°C and nominal supply voltages.switching characteristics over recommended supply voltage range and operating free-air temperature range(see figure 1)PARAMETERTEST CONDITIONSALT. TMS4161-15 TMS4161-20SYMBOL MIN MAX MIN MAXta(C) Access time from CAS CL = 100 pF tCAC 100 135Access time of a fromta(GE)CL = 100 pF 40 40ta(R)ta(RSO)ta(SOE;TR/DE lowAccess time from RASSOUT access time fromRAS highAccess time from SOElow to SOUTtRLCL = MAX,CL = 100 pFtRAC 150 200CL = 50 pF 60 60CL = 50 pF 20 25 nsta(SOI Access time from SCLK CL = 50 pF 30 30a output disable timetdis(CH)+tOFF20 25from CAS hightdis(OE)+tdis(SOE)+Q output disable timefrom 'fA/DE highSerial output disable timefrom SOE high20 2520 25t The maximum values for tdis(CH). tdis(QE). and tdis(SOE) define the time at which the output achieves the open circuit condition and are not referencedto VOH or VOL.UNITenQ)CJ'S:Q)c......oc.c.::::stJ)...>-oEQ)~'Cc:ca~
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SMYOOO2.,MOS MemoryData Book1984II
Page 9 and 10: ALPHANUMERIC INDEX TO DATA SHEETSSM
Page 11 and 12: TABLE OF CONTENTSALPHANUMERIC INDEX
Page 13 and 14: MOSLSIRAMs, ROMs, EPROMsSELECTION G
Page 15 and 16: If you want to give it a try for yo
Page 17 and 18: INTERCHANGEABILITY GUIDEPART 1 -ALT
Page 19 and 20: INTERCHANGEABILITY GUIDEFUJITSUMB 8
Page 21 and 22: INTERCHANGEABILITY GUIDEMOTOROLAMCM
Page 23 and 24: INTERCHANGEABILITY GUIDETOSHIBATMM
Page 25 and 26: INTERCHANGEABILITY GUIDESTATIC RAMS
Page 27 and 28: Alphanumeric Index, Table of Conten
Page 29 and 30: GLOSSARY fTIMING CONVENTIONS/DATA S
Page 31 and 32: GLOSSARY/TIMING CONVENTIONS/DATA SH
Page 33 and 34: GLOSSARY!TIMING CONVENTIONS/DATA SH
Page 39 and 40: Alphanumeric Index, Table of Conten
Page 41 and 42: MOSLSITMS411616,384-811 DYNAMIC RAN
Page 43 and 44: TMS411616,384·811 DYNAMIC RANDOM·
Page 45 and 46: 1MS411616,384-811 DYNAMIC RANDOM-AC
Page 47 and 48: TMS411616.384·81T DYNAMIC RANDOM·
Page 51 and 52: zIiADDRESSES~!.....RASCASwDO"*. i,*
Page 53 and 54: TMS411616,384-81T DYNAMIC RANDOM-AC
Page 55 and 56: MOSLSITMS416165,536-81T MULTIPORT M
Page 57 and 58: TMS416165,536-811 MULTIPORT MEMORYf
Page 59: TMS416165,536-BIT MULTIPORT MEMORYs
Page 63 and 64: TMS416165,536·BIT MUL TIPORT MEMOR
Page 65 and 66: TMS416165,536 o BIT MUL TIPORT MEMO
Page 67 and 68: TMS416165,536·811 MULTIPORT MEMORY
Page 69 and 70: zI[~~~co,.. twiRL) _,RAS:::~ SI l L
Page 71 and 72: TMS416165,536·BIT MULTIPORT MEMORY
Page 73 and 74: ~ ___TMS416165.536-BIT MUL TIPORT M
Page 75 and 76: 0>~a~~i'i_';:;Z~~~d~c:::• s:~lTl~
Page 77 and 78: TMS416165,536-8IT MULTIPORT MEMORY1
Page 79 and 80: MOSLSITMS4164, SMJ416465,536-8IT DY
Page 81 and 82: TMS4164, SMJ416465,536-811. DYNAMIC
Page 83 and 84: TMS416465,536-811 DYNAMIC RANDOM-AC
Page 87 and 88: TMS416465,536-811 DYNAMIC RANDOM-AC
Page 89 and 90: SMJ416465,536-011 DYNAMIC RANDOM-AC
Page 91 and 92: SMJ416465,536-81T DYNAMIC RANDOM-AC
Page 93 and 94: SMJ416465,536-011 DYNAMIC RANDOM-AC
Page 95 and 96: TMS4164, SMJ416465,536·81T DYNAMIC
Page 97 and 98: TMS4164, SMJ416465,536·8IT DYNAMIC
Page 99 and 100: z~~gz~.J:>.c1J
Page 101 and 102: Z~d~~~~0,'...."CIIICCCD:3of. twIRL)
Page 103 and 104: MOSLSITMS4256. TMS4257262.144·8IT
Page 105 and 106: TMS4256, TMS4257262,144·8IT DYNAMI
Page 107 and 108: TMS4256, TMS4257262,144-8IT DYNAMIC
Page 109 and 110: TMS4256, TMS4257262,144·8IT DYNAMI
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TMS4257262.144·8IT DYNAMIC RANDOM
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TMS4256, TMS4257262,144·BIT DYNAMI
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TMS4256, TMS4257262,144·8IT DYNAMI
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TMS4257262,144·81T DYNAMIC RANDOM
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Z~d~~~~.!..JcoNOTE:'CIIICO(1),- twI
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i:Z~d~~z~+:>0Co ......"CCICCCD:3og.
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TMS4256, TMS4257262,144·8IT DYNAMI
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MOSLSITMS4416. SMJ441616.384·WORD
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TMS4416, SMJ441616,384·WORD BY 4·
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TMS441616,384-WORD BY 4-BI1 DYNAMIC
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TMS441616,384-WORD BY 4-BIT DYNAMIC
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Page 135 and 136:
SMJ441616,384·WORD BY 4·BIT DYNAM
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SMJ441616,384-WORD BY 4-B11 DYNAMIC
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1MS4416, SMJ441616,384·WORD BY 4·
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TMS4416, SMJ441616,384·WORD BY 4·
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z~~~z@towRAs-{rCASAO·A7wDQG:::'.!A
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1:'QltC(()3oc..(()C3~~n_:::Z~~~;;;
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MOSLSITMS446465,536-WORD BY 4-BIT D
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TMS446465,536-WORD 8Y 4-81T DYNAMIC
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TMS446465,536·WORD BY 4·BIT DYNAM
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1MS446465,536·WORD BY 4·B11 DYNAM
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TMS446465,536·WORD BY 4·BIT DYNAM
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RASCAS----{! '.,ReIVIH i~VIL I tRLC
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~~~n_;;;z~~. ~~tTlg ;O~d ;;;t::=z~@
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~Z~~iZ~tw '"[:;-~~~~~:TCDCO ".;:r0~
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MEMORY SUPPORTLSITMS4500ADYNAMIC RA
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TMS4500ADYNAMIC RAM CONTROLLERpin d
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TMS4500ADYNAMIC RAM CONTROLLERarbit
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TMS4500ADYNAMIC RAM CONTROLLERswitc
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TMS4500ADYNAMIC RAM CONTROLLERacces
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TMS4500ADYNAMIC RAM CONTROLLERoutpu
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TMS4500ADYNAMIC RAM CONTROLLERtypic
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TMS4500ADYNAMIC RAM CONTROLLERtypic
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Alphanumeric Index, Table of Conten
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•••••MOSLSI65,536 X 4 Org
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TM4164EC465,536 BY 4·BIT DYNAMIC R
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MOSLSITM4164EL965,536 BY 9·BIT DYN
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TM4164EL965,536 BY 9-BIT DYNAMIC RA
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••••••••0MOSLSI65,5
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TM4164FL865,536 BY 8·BIT DYNAMIC R
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MOSLSITMS2516. SMJ251616.384-BIT ER
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TMS2516, SMJ251616,384-BIT ERASABLE
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TMS251616,384·BIT ERASABLE PROGRAM
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SMJ251616,384-BIT ERASABLE PROGRAMM
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o 441MS2516, SMJ251616,384·B11 ERA
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MOSLSITMS2532, SMJ253232,768·BIT E
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TMS253232,768-BI1 ERASABLE PROGRAMM
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MOSLSITMS2564, SMJ256465,536-BIT ER
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TMS256465,536-BIT ERASABLE PROGRAMM
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TMS2564 r SMJ256465 r536-BIT ERASAB
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MOSLSITMS2708, TMS27L08, SMJ2708, S
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TMS270B, TMS27LOBSMJ270B, SMJ27LOB1
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TMS2708. TMS27L081024·WORD BY 8·B
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SMJ2708, SMJ27L081024·WORD BY 8·B
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TMS2708, TMS27L08SMJ2708, SMJ27L081
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MOSLSITMS27162048·WORD BY 8·BIT E
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TMS27162048·WORD BY 8·BIT ERASABL
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TMS27162048-WORD BY 8-BIT ERASABLEP
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TMS2732A32,76B-BIT ERASABLE PROGRAM
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TMS2732A32,768-BIT ERASABLE PROGRAM
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TMS2732A32,768·BIT ERASABLE PROGRA
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MOSLSITMS276465,536-BI1 ERASABLE PR
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TMS276465,536·BIT ERASABLE PROGRAM
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Page 255 and 256:
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MOSLSITMS27128131,072·BIT ERASABLE
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TMS27128131,072·BI1 ERASABLE PROGR
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TMS27128131,072·BIT ERASABLE PROGR
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TMS27128131,072·BIT ERASABLE PROGR
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Page 267 and 268:
MOSLSITMS46648192·WORD BY 8·BIT R
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TMS46648192·WORD BY 8·BIT READ·O
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Page 273 and 274:
MOSLSITMS47324096~WORD BY B·BIT RE
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MOSLSITMS47648192·WORD BY 8·BIT R
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MOSLSI, TMS49648192·WORD BY 8·BIT
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MOSLSITMS4712816,384·WORD BY 8·BI
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TMS4712816,384·WORD BY 8·BIT READ
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TMS4712816,384-WORD BY 8-BIT READ-O
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MOSLSITMS4725632.768·WORD BY 8·BI
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TMS4725632.768·WORD BY 8·BIT READ
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MOSLSITMS2114, TMS2114L1024·WORD B
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TMS2114, TMS2114L1024·WDRD BY 4·B
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TMS2114. TMS2114L1024·WORD BV 4·B
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ADVANCED MEMORYDEVELOPMENT•Fast A
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TMS2150CACHE ADDRESS COMPARATORabso
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TMS2150CACHE ADDRESS COMPARATORPARA
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MOSLSITMS40162048·WORD BY 8·BIT S
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TMS4016204H-WORD BY H-BIT STATIC RA
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TMS40162048-WDRD BY 8-BIT STATIC RA
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MOSLSITMS4044, TMS40L444096-WORD BY
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TMS4044, TMS40L444096·WORD BY 1·B
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TMS4044, TMS40L444096·WORD BY l·B
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MILITARYCMOSLSISMJ55172048-WORD BY
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SMJ5517204a·WORD BY a·BIT STATIC
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SMJ55172048·WORD BY 8·BIT STATIC
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SMJ55172048-WDRD BY 8-BIT STATIC RA
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SMJ5517204B·WORD BY B·BIT STATIC
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However, the TMS 4164 provides the
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EXPANSION OF 3242 FOR 256-CYCLE REF
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•9-6
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PAD OPENINGIN OVERCOATPADMETALPADME
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Figure 5 shows how the driver outpu
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cpI UO,leWJOJUI suo'le:>!ldd"f\)W(3
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The falling edge of RAS causes R 1
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~--------::~~:~:~~~:--------~~7,34(
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J-Lead AdvantageTexas Instruments P
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Surface Mount Component Availabilit
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fiSECONDARYVAPOR(VAPOR BLANKET)..Fi
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l>'C'2.ri'Q),..o·:::Jen5'....... o
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l>"C'2..(i"Dl...0":=(I)5"....o...3D
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An external refresh counter has bee
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l>'C'CC:)"Q).-+o·::::sen:ro ... ""
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uo!~ew"oJul suo!~ea!ldd"CD .,.., w7
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DOTCLOCKCLOCK ACLOCK C2 xWCLKRAS (A
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B. If dynamic RAM refresh is enable
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•9-38
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The TMS4416/TMS4500A board is arran
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RAS ~CAS \ I2AI \ I '-2BI '-iiD1Ro2
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9-44
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ALEACXRASMAO-MA7CASFIGURE 1 -ALE LE
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The ALE high to ClK low time is giv
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ClKALEACXRASMAO-MA7CASREFREQROY•
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CDinN~1~12 MHzClKINClKOUTWE/iOclKRD
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UO!leWJOJUI SUOlle:ludd"com~'~,i'74
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coen(J)CLOCKWRITEREADROYALEA14-A5MS
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. Access Grant CyclesThe precharge
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whereta(C)tp(BFR)(-103 + tc2 - tp(B
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•9-62
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tt(REH)TCHLLtAEL-RELRAS rise time (
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. Refresh CyclesOn refresh cycles t
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wherethus,fCLKfCLKtCACfCLK[1/2 (tCA
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R/W approach does a normal read-mod
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II(0~""6 MHzI UO!leWJO,ulSUo!le:l!l
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ClKAlE.ACR\ ,----\,\ ,----R/W\ ,---
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4. Row address setup and hold timeT
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CLKrWRITE -------I.~ ..~---REFRESH-
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The read access time on access gran
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implementations in order to relieve
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"C'2..c:rm...o·j(I)....5'o3...mo·
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RELATIVE MEMORY SIZEARCHIVAL STORAG
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increments till satisfied. This pro
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In the example shown in Figure 5, t
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»'C"E..crQ)r+0':::Jtil:;-....o...3
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•9-94
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184LOGIC SYMBOLS1. INTRODUCTIONEXPl
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LOGIC SYMBOLS4.DIAGRAMATIC SUMMARYI
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lOGIC SYMBOLSWhen RAS goes low, it
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MECHANICAL DATAgeneralElectrical ch
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MECHANICAL DATAceramic packages -ce
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MECHANICAL DATAplastic packages (N
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MECHANICAL DATAceramic chip carrier
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Texas InstrumentsSemiconductor Tech
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TI Sales Offices TI DistributorsALA
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Printed in U.S.A.•TEXASINSTRUMENT
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