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coen(J)CLOCKWRITEREADROYALEA14-A5MSA-MSOMSE,MSFMSGDRAMCS'R/W015-00- --8~10 T2 ...r2~,4,A14-A7• See Table 1 for Strap Configuration.I" UO!JewAoJul SUO!Je3!!ddy-..-- --_--A6-A5-..-..MSE-..~- -1.;~...TMS4500ATMS4416(x4) .... f--ClK RASo RAS ~ACW CAS CAs"ACRCAO N_C.ROYGCA7 N.C.ALE.. AO-A7REFREQ N.C. -8 If •RAO-RA7CA1-CA2CA3-CA6V;OQ1-0Q4 - :::: ~TMS4416(x4)---f--f-oRAS1 RAS ~CASREN1 W OQ1-0Q4.-I- ~CS MAO-MA7 ~118 GFSO FS1 TWST AO-A7-L, I I I ,L•*74lS155MSF 2YO ~.. A2Y1B2Y2FIGURE 6 -2Y31G1YO2G1Y11ClY22C1Y3'l ~} FOR EXPANS'ON Of_ .: ADD'l 64K WORDS16 ~-8r~L TMS4418,x4I-- ~RAS ~CAS- - WOQ1-0Q4 10- ~ ~P""- G.. AO-A7,.8 •I- I18TMS4500A AND 64K WORD OF MODULAR DYNAMIC MEMORY USING TMS4416sI- TMS4416(x4) f--f--RASf--~10- CASW OQ1-DQ4 ~ ~~ G~....- AO-A7--J~~
1. Refresh TimeTABLE 1 -STRAP CONFIGURATIONWAITSTRAP INPUT MODESSTATESCLOCKFOR MINIMUM CYCLESMEMORY REFRESH CLK FREQ. REFRESH FOR EACHTWST FS1 FSO ACCESS RATE IMHz) FREQ.lkHz) REFRES~l l Lt 0 EXTERNAL - REFREQ 4l l H 0 elK + 31 1,984 64 - 95t 3l H l 0 elK + 46 2,944 64 - 85t 3l H H 0 elK + 61 3,904 64 - 82§ 4H l l 1 elK + 46 2,944 64 - 85t 3H l H 1 elK + 61 3,904 64 - 80* 4H H l 1 elK + 76 4,864 64 -7H 4H H H 1 elK + 91 5,824 64 ~ 88+."4This strap configuration resets the Refresh TImer circui.try.Upper figure in refresh frequency is the frequency that is prodllced if the minimum elK frequency of the next select state is Ilsed.Refresh frequency if ClK frequency is 5 MHz.+ Refresh frequency if ClK frequency is 8 MHz.From Table 1 of the TMS4500A data sheet, there are two strap selections that would be appropriate for a 3 MHz clockfrequency. One selection inserts a wait state on every memory access while the other does not. Assuming that no waitstates will be necessary, select the strap input: FSO = TWST = 0 and FS1 = 1. This will yield a refresh rate of (3 MHz)/46or approximately 65 kHz. Each refresh will take 3 clock cycles.2. Memory Precharge Time (RAS precharge)The memory precharge time must be calculated for access, refresh, and access grant memory cycles to ensure the minimumRAS precharge time is satisfied.a. Access CyclesThe precharge time on access cycles is given by:wheretRPtRPtc2td1tc2/4+td1 +tAEL-REL* - td7 - tACH-REH - tt(REH)RAS precharge timeCLKOUT periodDelay from ALATCH low from reference line (ry1AX,99000 Spec.)tc2/4 + 10co"';::mE~~.5enco"~CJ=&c.~thustAEL-RELtd7tACH-REHtt(REH)tRPTime delay, ALE low to RAS starting low (MAX, 4500A-20 Spec. *)WE, AD control release delay (MAX, 99000 Spec.)Time delay, ACX high to RAS starting high (MAX, 4500A-20 Spec.)RAS rise time (MAX, 4500A-20 Spec.)(333/4 + 333/4 + 10 + 36 - 30 - 40 - 20) ns123 ns RAs precharge time.This value should otherwise be a minimum value; however as all propagation delays on a given chip will tend to track each other, the maximumvalue is multiplied by a skew factor to reflect variations in same-chip propagation delays. The skew factor used here is 0.9. AU values (followedby an asterisk) are obtained by multiplying the specified maximum value by 0.9.9-57
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SMYOOO2.,MOS MemoryData Book1984II
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ALPHANUMERIC INDEX TO DATA SHEETSSM
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TABLE OF CONTENTSALPHANUMERIC INDEX
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MOSLSIRAMs, ROMs, EPROMsSELECTION G
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If you want to give it a try for yo
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INTERCHANGEABILITY GUIDEPART 1 -ALT
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INTERCHANGEABILITY GUIDEFUJITSUMB 8
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INTERCHANGEABILITY GUIDEMOTOROLAMCM
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INTERCHANGEABILITY GUIDETOSHIBATMM
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INTERCHANGEABILITY GUIDESTATIC RAMS
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Alphanumeric Index, Table of Conten
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GLOSSARY fTIMING CONVENTIONS/DATA S
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GLOSSARY/TIMING CONVENTIONS/DATA SH
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GLOSSARY!TIMING CONVENTIONS/DATA SH
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MOSLSITMS411616,384-811 DYNAMIC RAN
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TMS411616,384·811 DYNAMIC RANDOM·
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1MS411616,384-811 DYNAMIC RANDOM-AC
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TMS411616.384·81T DYNAMIC RANDOM·
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zIiADDRESSES~!.....RASCASwDO"*. i,*
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TMS411616,384-81T DYNAMIC RANDOM-AC
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MOSLSITMS416165,536-81T MULTIPORT M
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TMS416165,536-811 MULTIPORT MEMORYf
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TMS416165,536-BIT MULTIPORT MEMORYs
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TMS416165,536-0IT MULTIPORT MEMORYc
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TMS416165,536·BIT MUL TIPORT MEMOR
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TMS416165,536 o BIT MUL TIPORT MEMO
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TMS416165,536·811 MULTIPORT MEMORY
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zI[~~~co,.. twiRL) _,RAS:::~ SI l L
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TMS416165,536·BIT MULTIPORT MEMORY
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~ ___TMS416165.536-BIT MUL TIPORT M
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0>~a~~i'i_';:;Z~~~d~c:::• s:~lTl~
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TMS416165,536-8IT MULTIPORT MEMORY1
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MOSLSITMS4164, SMJ416465,536-8IT DY
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TMS4164, SMJ416465,536-811. DYNAMIC
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TMS416465,536-811 DYNAMIC RANDOM-AC
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TMS416465,536-811 DYNAMIC RANDOM-AC
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SMJ416465,536-011 DYNAMIC RANDOM-AC
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SMJ416465,536-81T DYNAMIC RANDOM-AC
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SMJ416465,536-011 DYNAMIC RANDOM-AC
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TMS4164, SMJ416465,536·81T DYNAMIC
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TMS4164, SMJ416465,536·8IT DYNAMIC
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z~~gz~.J:>.c1J
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Z~d~~~~0,'...."CIIICCCD:3of. twIRL)
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MOSLSITMS4256. TMS4257262.144·8IT
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TMS4256, TMS4257262,144·8IT DYNAMI
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TMS4256, TMS4257262,144-8IT DYNAMIC
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TMS4257262.144·8IT DYNAMIC RANDOM
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TMS4256, TMS4257262,144·BIT DYNAMI
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TMS4257262,144·81T DYNAMIC RANDOM
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Z~d~~~~.!..JcoNOTE:'CIIICO(1),- twI
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i:Z~d~~z~+:>0Co ......"CCICCCD:3og.
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MOSLSITMS4416. SMJ441616.384·WORD
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TMS4416, SMJ441616,384·WORD BY 4·
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TMS441616,384-WORD BY 4-BI1 DYNAMIC
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TMS441616,384-WORD BY 4-BIT DYNAMIC
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SMJ441616,384·WORD BY 4·BIT DYNAM
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SMJ441616,384-WORD BY 4-B11 DYNAMIC
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1MS4416, SMJ441616,384·WORD BY 4·
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TMS4416, SMJ441616,384·WORD BY 4·
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z~~~z@towRAs-{rCASAO·A7wDQG:::'.!A
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1:'QltC(()3oc..(()C3~~n_:::Z~~~;;;
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MOSLSITMS446465,536-WORD BY 4-BIT D
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TMS446465,536-WORD 8Y 4-81T DYNAMIC
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TMS446465,536·WORD BY 4·BIT DYNAM
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1MS446465,536·WORD BY 4·B11 DYNAM
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TMS446465,536·WORD BY 4·BIT DYNAM
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RASCAS----{! '.,ReIVIH i~VIL I tRLC
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~~~n_;;;z~~. ~~tTlg ;O~d ;;;t::=z~@
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~Z~~iZ~tw '"[:;-~~~~~:TCDCO ".;:r0~
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MEMORY SUPPORTLSITMS4500ADYNAMIC RA
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TMS4500ADYNAMIC RAM CONTROLLERpin d
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TMS4500ADYNAMIC RAM CONTROLLERarbit
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TMS4500ADYNAMIC RAM CONTROLLERswitc
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TMS4500ADYNAMIC RAM CONTROLLERacces
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TMS4500ADYNAMIC RAM CONTROLLERoutpu
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TMS4500ADYNAMIC RAM CONTROLLERtypic
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TMS4500ADYNAMIC RAM CONTROLLERtypic
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•••••MOSLSI65,536 X 4 Org
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TM4164EC465,536 BY 4·BIT DYNAMIC R
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MOSLSITM4164EL965,536 BY 9·BIT DYN
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TM4164EL965,536 BY 9-BIT DYNAMIC RA
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••••••••0MOSLSI65,5
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TM4164FL865,536 BY 8·BIT DYNAMIC R
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MOSLSITMS2516. SMJ251616.384-BIT ER
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TMS2516, SMJ251616,384-BIT ERASABLE
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TMS251616,384·BIT ERASABLE PROGRAM
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SMJ251616,384-BIT ERASABLE PROGRAMM
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o 441MS2516, SMJ251616,384·B11 ERA
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MOSLSITMS2532, SMJ253232,768·BIT E
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TMS253232,768-BI1 ERASABLE PROGRAMM
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MOSLSITMS2564, SMJ256465,536-BIT ER
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TMS256465,536-BIT ERASABLE PROGRAMM
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TMS2564 r SMJ256465 r536-BIT ERASAB
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MOSLSITMS2708, TMS27L08, SMJ2708, S
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TMS270B, TMS27LOBSMJ270B, SMJ27LOB1
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TMS2708. TMS27L081024·WORD BY 8·B
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SMJ2708, SMJ27L081024·WORD BY 8·B
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TMS2708, TMS27L08SMJ2708, SMJ27L081
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MOSLSITMS27162048·WORD BY 8·BIT E
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TMS27162048·WORD BY 8·BIT ERASABL
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TMS27162048-WORD BY 8-BIT ERASABLEP
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TMS2732A32,76B-BIT ERASABLE PROGRAM
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TMS2732A32,768-BIT ERASABLE PROGRAM
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TMS2732A32,768·BIT ERASABLE PROGRA
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MOSLSITMS276465,536-BI1 ERASABLE PR
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TMS276465,536·BIT ERASABLE PROGRAM
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MOSLSITMS27128131,072·BIT ERASABLE
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TMS27128131,072·BI1 ERASABLE PROGR
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TMS27128131,072·BIT ERASABLE PROGR
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TMS27128131,072·BIT ERASABLE PROGR
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MOSLSITMS46648192·WORD BY 8·BIT R
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TMS46648192·WORD BY 8·BIT READ·O
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MOSLSITMS47324096~WORD BY B·BIT RE
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MOSLSITMS47648192·WORD BY 8·BIT R
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MOSLSI, TMS49648192·WORD BY 8·BIT
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MOSLSITMS4712816,384·WORD BY 8·BI
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TMS4712816,384·WORD BY 8·BIT READ
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TMS4712816,384-WORD BY 8-BIT READ-O
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MOSLSITMS4725632.768·WORD BY 8·BI
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TMS4725632.768·WORD BY 8·BIT READ
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MOSLSITMS2114, TMS2114L1024·WORD B
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TMS2114, TMS2114L1024·WDRD BY 4·B
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TMS2114. TMS2114L1024·WORD BV 4·B
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ADVANCED MEMORYDEVELOPMENT•Fast A
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TMS2150CACHE ADDRESS COMPARATORabso
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TMS2150CACHE ADDRESS COMPARATORPARA
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MOSLSITMS40162048·WORD BY 8·BIT S
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TMS4016204H-WORD BY H-BIT STATIC RA
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TMS40162048-WDRD BY 8-BIT STATIC RA
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MOSLSITMS4044, TMS40L444096-WORD BY
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TMS4044, TMS40L444096·WORD BY 1·B
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TMS4044, TMS40L444096·WORD BY l·B
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MILITARYCMOSLSISMJ55172048-WORD BY
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SMJ5517204a·WORD BY a·BIT STATIC
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SMJ55172048·WORD BY 8·BIT STATIC
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SMJ55172048-WDRD BY 8-BIT STATIC RA
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SMJ5517204B·WORD BY B·BIT STATIC
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However, the TMS 4164 provides the
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EXPANSION OF 3242 FOR 256-CYCLE REF
Page 356 and 357: •9-6
Page 358 and 359: PAD OPENINGIN OVERCOATPADMETALPADME
Page 360 and 361: Figure 5 shows how the driver outpu
Page 362 and 363: cpI UO,leWJOJUI suo'le:>!ldd"f\)W(3
Page 364 and 365: The falling edge of RAS causes R 1
Page 366 and 367: ~--------::~~:~:~~~:--------~~7,34(
Page 368 and 369: J-Lead AdvantageTexas Instruments P
Page 370 and 371: Surface Mount Component Availabilit
Page 372 and 373: fiSECONDARYVAPOR(VAPOR BLANKET)..Fi
Page 374 and 375: l>'C'2.ri'Q),..o·:::Jen5'....... o
Page 376 and 377: l>"C'2..(i"Dl...0":=(I)5"....o...3D
Page 378 and 379: An external refresh counter has bee
Page 380 and 381: l>'C'CC:)"Q).-+o·::::sen:ro ... ""
Page 382 and 383: uo!~ew"oJul suo!~ea!ldd"CD .,.., w7
Page 384 and 385: DOTCLOCKCLOCK ACLOCK C2 xWCLKRAS (A
Page 386 and 387: B. If dynamic RAM refresh is enable
Page 388 and 389: •9-38
Page 390 and 391: The TMS4416/TMS4500A board is arran
Page 392 and 393: RAS ~CAS \ I2AI \ I '-2BI '-iiD1Ro2
Page 394 and 395: 9-44
Page 396 and 397: ALEACXRASMAO-MA7CASFIGURE 1 -ALE LE
Page 398 and 399: The ALE high to ClK low time is giv
Page 400 and 401: ClKALEACXRASMAO-MA7CASREFREQROY•
Page 402 and 403: CDinN~1~12 MHzClKINClKOUTWE/iOclKRD
Page 404 and 405: UO!leWJOJUI SUOlle:ludd"com~'~,i'74
Page 408 and 409: . Access Grant CyclesThe precharge
Page 410 and 411: whereta(C)tp(BFR)(-103 + tc2 - tp(B
Page 412 and 413: •9-62
Page 414 and 415: tt(REH)TCHLLtAEL-RELRAS rise time (
Page 416 and 417: . Refresh CyclesOn refresh cycles t
Page 418 and 419: wherethus,fCLKfCLKtCACfCLK[1/2 (tCA
Page 420 and 421: R/W approach does a normal read-mod
Page 422 and 423: II(0~""6 MHzI UO!leWJO,ulSUo!le:l!l
Page 424 and 425: ClKAlE.ACR\ ,----\,\ ,----R/W\ ,---
Page 426 and 427: 4. Row address setup and hold timeT
Page 428 and 429: CLKrWRITE -------I.~ ..~---REFRESH-
Page 430 and 431: The read access time on access gran
Page 432 and 433: implementations in order to relieve
Page 434 and 435: "C'2..c:rm...o·j(I)....5'o3...mo·
Page 436 and 437: RELATIVE MEMORY SIZEARCHIVAL STORAG
Page 438 and 439: increments till satisfied. This pro
Page 440 and 441: In the example shown in Figure 5, t
Page 442 and 443: »'C"E..crQ)r+0':::Jtil:;-....o...3
Page 444 and 445: •9-94
Page 447 and 448: 184LOGIC SYMBOLS1. INTRODUCTIONEXPl
Page 449 and 450: LOGIC SYMBOLS4.DIAGRAMATIC SUMMARYI
Page 451 and 452: lOGIC SYMBOLSWhen RAS goes low, it
Page 453 and 454: Alphanumeric Index, Table of Conten
Page 455 and 456: MECHANICAL DATAgeneralElectrical ch
Page 457 and 458:
MECHANICAL DATAceramic packages -ce
Page 459 and 460:
MECHANICAL DATAplastic packages (N
Page 461 and 462:
MECHANICAL DATAceramic chip carrier
Page 463 and 464:
Texas InstrumentsSemiconductor Tech
Page 465 and 466:
TI Sales Offices TI DistributorsALA
Page 468:
Printed in U.S.A.•TEXASINSTRUMENT
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