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uo!~ew"oJul suo!~ea!ldd"CD .,.., w745299ADDRESS LATCH ADDRESS MUX VIDEO DATA7 V5YNC11.34 MHzt--------4:> HSYNCFigure 1. TMS441617220 Interface
allows the use of multiple rows of memory since both CASand G have to be low for the TMS4416 outputs to be active(see TMS4416 operation, 1982 MOS Memory Data Book).The cycle is terminated by the rising edge of ALE (edge G).On RMW cycles, the 7220 uses the DBIN signal to gatedata from the memory onto the bus signifying the read operation.The rising edge of DBIN is then used to disable theG signal terminating the read portion of the cycle (seeFigure 3). The 7220 does not provide a separate write signalso the memory control circuit must use the presence of DB INto generate the write signal. This is accomplished by shiftingDBIN two clock C cycles (edge E) with two 74LS74s.Again the rising edge of ALE terminates the memory cycle(edge G).The 7220 runs at a relatively slow clock speed (1.4 MHz)in this design allowing the use of Low Power Schottky componentsfor most of the memory control circuitry. Thenecessary memory calculations given below show the actualmargins and also provide an easy means for determining themaximum speed of the design with Schottky components.The critical memory timings to be covered are: RASprecharge, row address setup and hold, CAS access, datavalid to write enable time and refresh interval.RAS Precharge TimetRP = tRW - tS(74LS08)where: tRW = ALE width (MIN, 7220 Spec.)ts = Skew between tpHL and tpLH, 74LS08thus: tRP = [113(705) -10) ns= 225 nsRow Address Setup TimetASR = 1I2(tCLK) - tAD - tpLH(74LS373)- tPLH(74S157) + tRF- tPHL(74LS08)where: tCLK = 2 x WCLK cycle timetAD = Address/data delay from 2 x CCLK(MAX, 7220 Spec.)tRF = ALE delay from 2 x CCLK (MIN, 7220Spec.)thus: tASR = [1/2(705) - 130 - 18 - 7.5 + 20+ 4) ns= 221 nsRow Address Hold TimetRAH = 1I2(tCLK) - tPHL(74LS08)+ tPLH(74LS74) + tPHL(74S157)thus: tRAH = [1/2(705) - 20 + 6 + 6) ns= 344.5 nsCAS Access TimeA. DisplaytCAC = 7(tDCLK) - tPLH(74S163)- tPHL(74LS74) - tPHL(74LS139)- tsu(74S299)where: tDCLK = Dot clock cycle timethus: tCAC = [7(88) - 15 - 40 - 33 - 7) ns= 521 nsB. RMW cyclestCAC = 5.5(tCLKA) - tPHL(74S04)- tPHL(74LS74) - tPHL(74LS139)- tOIswhere: tCLKA = Clock A cycletOIs = Input data setup to 2 x CCLK (MIN,7220 Spec)thus: tCAC = [5.5(176) - 5 - 40 - 33 - 40) ns= 850 nsData Valid to Write EnabletDS = 112 (tcLK) - tAD - tPLH(74S04)+ tPLH(74LS74)thus: tDS = [112(705) - 5 - 130 + 6) ns= 223.5 nsRefresh IntervalFor this circuit the least significant address lines correspondto the DRAM row addresses which are incrementedevery display cycle. This provides a refresh rate given by:Refresh Interval = (256/number of display words)x line time= (256/32) x 63.5 p.s= .5 msTherefore the memory is refreshed by normal displayaccesses and the 7220 refresh feature is not needed for thisdesign.A comparison of the previous calculations to the DRAMspecification indicates there are no memory speed restrictionsfor the design. To attain the maximum speed of thisparticuI'ar design, Schottky components may be substitutedand the appropriate parameters placed into the above equationsto determine the maximum dot clock frequency. By usinghigh performance logic, a dot clock rate of approximately22 MHz can be used.co.~~...E..... o.5enco.~~.~Q.c.«9-33
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SMYOOO2.,MOS MemoryData Book1984II
Page 9 and 10:
ALPHANUMERIC INDEX TO DATA SHEETSSM
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TABLE OF CONTENTSALPHANUMERIC INDEX
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MOSLSIRAMs, ROMs, EPROMsSELECTION G
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If you want to give it a try for yo
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INTERCHANGEABILITY GUIDEPART 1 -ALT
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INTERCHANGEABILITY GUIDEFUJITSUMB 8
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INTERCHANGEABILITY GUIDEMOTOROLAMCM
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INTERCHANGEABILITY GUIDETOSHIBATMM
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INTERCHANGEABILITY GUIDESTATIC RAMS
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Alphanumeric Index, Table of Conten
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GLOSSARY fTIMING CONVENTIONS/DATA S
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GLOSSARY/TIMING CONVENTIONS/DATA SH
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GLOSSARY!TIMING CONVENTIONS/DATA SH
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MOSLSITMS411616,384-811 DYNAMIC RAN
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TMS411616,384·811 DYNAMIC RANDOM·
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1MS411616,384-811 DYNAMIC RANDOM-AC
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TMS411616.384·81T DYNAMIC RANDOM·
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zIiADDRESSES~!.....RASCASwDO"*. i,*
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TMS411616,384-81T DYNAMIC RANDOM-AC
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MOSLSITMS416165,536-81T MULTIPORT M
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TMS416165,536-811 MULTIPORT MEMORYf
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TMS416165,536-BIT MULTIPORT MEMORYs
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TMS416165,536-0IT MULTIPORT MEMORYc
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TMS416165,536·BIT MUL TIPORT MEMOR
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TMS416165,536 o BIT MUL TIPORT MEMO
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TMS416165,536·811 MULTIPORT MEMORY
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zI[~~~co,.. twiRL) _,RAS:::~ SI l L
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TMS416165,536·BIT MULTIPORT MEMORY
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~ ___TMS416165.536-BIT MUL TIPORT M
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0>~a~~i'i_';:;Z~~~d~c:::• s:~lTl~
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TMS416165,536-8IT MULTIPORT MEMORY1
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MOSLSITMS4164, SMJ416465,536-8IT DY
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TMS4164, SMJ416465,536-811. DYNAMIC
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TMS416465,536-811 DYNAMIC RANDOM-AC
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TMS416465,536-811 DYNAMIC RANDOM-AC
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SMJ416465,536-011 DYNAMIC RANDOM-AC
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SMJ416465,536-81T DYNAMIC RANDOM-AC
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SMJ416465,536-011 DYNAMIC RANDOM-AC
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TMS4164, SMJ416465,536·81T DYNAMIC
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TMS4164, SMJ416465,536·8IT DYNAMIC
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z~~gz~.J:>.c1J
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Z~d~~~~0,'...."CIIICCCD:3of. twIRL)
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MOSLSITMS4256. TMS4257262.144·8IT
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TMS4256, TMS4257262,144·8IT DYNAMI
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TMS4256, TMS4257262,144-8IT DYNAMIC
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TMS4257262.144·8IT DYNAMIC RANDOM
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TMS4256, TMS4257262,144·BIT DYNAMI
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TMS4257262,144·81T DYNAMIC RANDOM
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Z~d~~~~.!..JcoNOTE:'CIIICO(1),- twI
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i:Z~d~~z~+:>0Co ......"CCICCCD:3og.
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MOSLSITMS4416. SMJ441616.384·WORD
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TMS4416, SMJ441616,384·WORD BY 4·
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TMS441616,384-WORD BY 4-BI1 DYNAMIC
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TMS441616,384-WORD BY 4-BIT DYNAMIC
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SMJ441616,384·WORD BY 4·BIT DYNAM
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SMJ441616,384-WORD BY 4-B11 DYNAMIC
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1MS4416, SMJ441616,384·WORD BY 4·
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TMS4416, SMJ441616,384·WORD BY 4·
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z~~~z@towRAs-{rCASAO·A7wDQG:::'.!A
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1:'QltC(()3oc..(()C3~~n_:::Z~~~;;;
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MOSLSITMS446465,536-WORD BY 4-BIT D
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TMS446465,536-WORD 8Y 4-81T DYNAMIC
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TMS446465,536·WORD BY 4·BIT DYNAM
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1MS446465,536·WORD BY 4·B11 DYNAM
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TMS446465,536·WORD BY 4·BIT DYNAM
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RASCAS----{! '.,ReIVIH i~VIL I tRLC
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~~~n_;;;z~~. ~~tTlg ;O~d ;;;t::=z~@
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~Z~~iZ~tw '"[:;-~~~~~:TCDCO ".;:r0~
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MEMORY SUPPORTLSITMS4500ADYNAMIC RA
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TMS4500ADYNAMIC RAM CONTROLLERpin d
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TMS4500ADYNAMIC RAM CONTROLLERarbit
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TMS4500ADYNAMIC RAM CONTROLLERswitc
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TMS4500ADYNAMIC RAM CONTROLLERacces
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TMS4500ADYNAMIC RAM CONTROLLERoutpu
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TMS4500ADYNAMIC RAM CONTROLLERtypic
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TMS4500ADYNAMIC RAM CONTROLLERtypic
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•••••MOSLSI65,536 X 4 Org
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TM4164EC465,536 BY 4·BIT DYNAMIC R
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MOSLSITM4164EL965,536 BY 9·BIT DYN
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TM4164EL965,536 BY 9-BIT DYNAMIC RA
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••••••••0MOSLSI65,5
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TM4164FL865,536 BY 8·BIT DYNAMIC R
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MOSLSITMS2516. SMJ251616.384-BIT ER
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TMS2516, SMJ251616,384-BIT ERASABLE
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TMS251616,384·BIT ERASABLE PROGRAM
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SMJ251616,384-BIT ERASABLE PROGRAMM
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o 441MS2516, SMJ251616,384·B11 ERA
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MOSLSITMS2532, SMJ253232,768·BIT E
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TMS253232,768-BI1 ERASABLE PROGRAMM
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MOSLSITMS2564, SMJ256465,536-BIT ER
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TMS256465,536-BIT ERASABLE PROGRAMM
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TMS2564 r SMJ256465 r536-BIT ERASAB
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MOSLSITMS2708, TMS27L08, SMJ2708, S
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TMS270B, TMS27LOBSMJ270B, SMJ27LOB1
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TMS2708. TMS27L081024·WORD BY 8·B
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SMJ2708, SMJ27L081024·WORD BY 8·B
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TMS2708, TMS27L08SMJ2708, SMJ27L081
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MOSLSITMS27162048·WORD BY 8·BIT E
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TMS27162048·WORD BY 8·BIT ERASABL
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TMS27162048-WORD BY 8-BIT ERASABLEP
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TMS2732A32,76B-BIT ERASABLE PROGRAM
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TMS2732A32,768-BIT ERASABLE PROGRAM
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TMS2732A32,768·BIT ERASABLE PROGRA
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MOSLSITMS276465,536-BI1 ERASABLE PR
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TMS276465,536·BIT ERASABLE PROGRAM
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MOSLSITMS27128131,072·BIT ERASABLE
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TMS27128131,072·BI1 ERASABLE PROGR
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TMS27128131,072·BIT ERASABLE PROGR
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TMS27128131,072·BIT ERASABLE PROGR
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MOSLSITMS46648192·WORD BY 8·BIT R
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TMS46648192·WORD BY 8·BIT READ·O
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MOSLSITMS47324096~WORD BY B·BIT RE
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MOSLSITMS47648192·WORD BY 8·BIT R
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MOSLSI, TMS49648192·WORD BY 8·BIT
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MOSLSITMS4712816,384·WORD BY 8·BI
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TMS4712816,384·WORD BY 8·BIT READ
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TMS4712816,384-WORD BY 8-BIT READ-O
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MOSLSITMS4725632.768·WORD BY 8·BI
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TMS4725632.768·WORD BY 8·BIT READ
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MOSLSITMS2114, TMS2114L1024·WORD B
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TMS2114, TMS2114L1024·WDRD BY 4·B
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TMS2114. TMS2114L1024·WORD BV 4·B
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ADVANCED MEMORYDEVELOPMENT•Fast A
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TMS2150CACHE ADDRESS COMPARATORabso
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TMS2150CACHE ADDRESS COMPARATORPARA
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MOSLSITMS40162048·WORD BY 8·BIT S
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TMS4016204H-WORD BY H-BIT STATIC RA
Page 331 and 332: TMS40162048-WDRD BY 8-BIT STATIC RA
Page 333 and 334: MOSLSITMS4044, TMS40L444096-WORD BY
Page 335 and 336: TMS4044, TMS40L444096·WORD BY 1·B
Page 337 and 338: TMS4044, TMS40L444096·WORD BY l·B
Page 339 and 340: MILITARYCMOSLSISMJ55172048-WORD BY
Page 341 and 342: SMJ5517204a·WORD BY a·BIT STATIC
Page 343 and 344: SMJ55172048·WORD BY 8·BIT STATIC
Page 345 and 346: SMJ55172048-WDRD BY 8-BIT STATIC RA
Page 347 and 348: SMJ5517204B·WORD BY B·BIT STATIC
Page 349: Alphanumeric Index, Table of Conten
Page 352 and 353: However, the TMS 4164 provides the
Page 354 and 355: EXPANSION OF 3242 FOR 256-CYCLE REF
Page 356 and 357: •9-6
Page 358 and 359: PAD OPENINGIN OVERCOATPADMETALPADME
Page 360 and 361: Figure 5 shows how the driver outpu
Page 362 and 363: cpI UO,leWJOJUI suo'le:>!ldd"f\)W(3
Page 364 and 365: The falling edge of RAS causes R 1
Page 366 and 367: ~--------::~~:~:~~~:--------~~7,34(
Page 368 and 369: J-Lead AdvantageTexas Instruments P
Page 370 and 371: Surface Mount Component Availabilit
Page 372 and 373: fiSECONDARYVAPOR(VAPOR BLANKET)..Fi
Page 374 and 375: l>'C'2.ri'Q),..o·:::Jen5'....... o
Page 376 and 377: l>"C'2..(i"Dl...0":=(I)5"....o...3D
Page 378 and 379: An external refresh counter has bee
Page 380 and 381: l>'C'CC:)"Q).-+o·::::sen:ro ... ""
Page 384 and 385: DOTCLOCKCLOCK ACLOCK C2 xWCLKRAS (A
Page 386 and 387: B. If dynamic RAM refresh is enable
Page 388 and 389: •9-38
Page 390 and 391: The TMS4416/TMS4500A board is arran
Page 392 and 393: RAS ~CAS \ I2AI \ I '-2BI '-iiD1Ro2
Page 394 and 395: 9-44
Page 396 and 397: ALEACXRASMAO-MA7CASFIGURE 1 -ALE LE
Page 398 and 399: The ALE high to ClK low time is giv
Page 400 and 401: ClKALEACXRASMAO-MA7CASREFREQROY•
Page 402 and 403: CDinN~1~12 MHzClKINClKOUTWE/iOclKRD
Page 404 and 405: UO!leWJOJUI SUOlle:ludd"com~'~,i'74
Page 406 and 407: coen(J)CLOCKWRITEREADROYALEA14-A5MS
Page 408 and 409: . Access Grant CyclesThe precharge
Page 410 and 411: whereta(C)tp(BFR)(-103 + tc2 - tp(B
Page 412 and 413: •9-62
Page 414 and 415: tt(REH)TCHLLtAEL-RELRAS rise time (
Page 416 and 417: . Refresh CyclesOn refresh cycles t
Page 418 and 419: wherethus,fCLKfCLKtCACfCLK[1/2 (tCA
Page 420 and 421: R/W approach does a normal read-mod
Page 422 and 423: II(0~""6 MHzI UO!leWJO,ulSUo!le:l!l
Page 424 and 425: ClKAlE.ACR\ ,----\,\ ,----R/W\ ,---
Page 426 and 427: 4. Row address setup and hold timeT
Page 428 and 429: CLKrWRITE -------I.~ ..~---REFRESH-
Page 430 and 431: The read access time on access gran
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implementations in order to relieve
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"C'2..c:rm...o·j(I)....5'o3...mo·
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RELATIVE MEMORY SIZEARCHIVAL STORAG
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increments till satisfied. This pro
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In the example shown in Figure 5, t
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»'C"E..crQ)r+0':::Jtil:;-....o...3
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•9-94
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184LOGIC SYMBOLS1. INTRODUCTIONEXPl
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LOGIC SYMBOLS4.DIAGRAMATIC SUMMARYI
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lOGIC SYMBOLSWhen RAS goes low, it
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MECHANICAL DATAgeneralElectrical ch
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MECHANICAL DATAceramic packages -ce
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MECHANICAL DATAplastic packages (N
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MECHANICAL DATAceramic chip carrier
Page 463 and 464:
Texas InstrumentsSemiconductor Tech
Page 465 and 466:
TI Sales Offices TI DistributorsALA
Page 468:
Printed in U.S.A.•TEXASINSTRUMENT
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