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GLOSSARY/TIMING CONVENTIONS/DATA SHEET STRUCTUREPART 111- TIMING DIAGRAMS CONVENTIONSTIMING DIAGRAMSYMBOLINPUTFORCING FUNCTIONSMEANINGOUTPUTRESPONSE FUNCTIONS .Must be steady high or lowHigh-to-Iow changespermittedWill be steady high or lowWill be changing from highto low some time duringdesignated intervalC')5"(I)(I)Q)...-
GLOSSARY/TIMING CONVENTIONS/DATA SHEET STRUCTUREoperation once the inputs are applied. These parameters are guaranteed for the test conditions given. The interrelationshipof the timing requirements to the switching characteristics is illustrated in timing diagrams for each type ofmemory cycle (e.g." read, write, program).At the end of a data sheet additional applications information may be provided such as how to use the device, graphsof electrical characteristics, or other data on electrical characteristics.Q)..:::l....CJ:::l....en....Q)Q).cenC'O....C'OC-(I)co'+:;cQ)>CoUC)c'E..i=->C'O(I)(I)oc:5TEXAS INSTRUMENTSINCORPORATED3-9POST OFFICE BOX 225012 • PALLAS, TEXAS 75265
Page 1: SMYOOO2.,MOS MemoryData Book1984II
Page 9 and 10: ALPHANUMERIC INDEX TO DATA SHEETSSM
Page 11 and 12: TABLE OF CONTENTSALPHANUMERIC INDEX
Page 13 and 14: MOSLSIRAMs, ROMs, EPROMsSELECTION G
Page 15 and 16: If you want to give it a try for yo
Page 17 and 18: INTERCHANGEABILITY GUIDEPART 1 -ALT
Page 19 and 20: INTERCHANGEABILITY GUIDEFUJITSUMB 8
Page 21 and 22: INTERCHANGEABILITY GUIDEMOTOROLAMCM
Page 23 and 24: INTERCHANGEABILITY GUIDETOSHIBATMM
Page 25 and 26: INTERCHANGEABILITY GUIDESTATIC RAMS
Page 27 and 28: Alphanumeric Index, Table of Conten
Page 29 and 30: GLOSSARY fTIMING CONVENTIONS/DATA S
Page 31 and 32: GLOSSARY/TIMING CONVENTIONS/DATA SH
Page 33 and 34: GLOSSARY!TIMING CONVENTIONS/DATA SH
Page 35: GLOSSARY/TIMING CONVENTIONS/DATA SH
Page 39 and 40: Alphanumeric Index, Table of Conten
Page 41 and 42: MOSLSITMS411616,384-811 DYNAMIC RAN
Page 43 and 44: TMS411616,384·811 DYNAMIC RANDOM·
Page 45 and 46: 1MS411616,384-811 DYNAMIC RANDOM-AC
Page 47 and 48: TMS411616.384·81T DYNAMIC RANDOM·
Page 51 and 52: zIiADDRESSES~!.....RASCASwDO"*. i,*
Page 53 and 54: TMS411616,384-81T DYNAMIC RANDOM-AC
Page 55 and 56: MOSLSITMS416165,536-81T MULTIPORT M
Page 57 and 58: TMS416165,536-811 MULTIPORT MEMORYf
Page 59 and 60: TMS416165,536-BIT MULTIPORT MEMORYs
Page 61 and 62: TMS416165,536-0IT MULTIPORT MEMORYc
Page 63 and 64: TMS416165,536·BIT MUL TIPORT MEMOR
Page 65 and 66: TMS416165,536 o BIT MUL TIPORT MEMO
Page 67 and 68: TMS416165,536·811 MULTIPORT MEMORY
Page 69 and 70: zI[~~~co,.. twiRL) _,RAS:::~ SI l L
Page 71 and 72: TMS416165,536·BIT MULTIPORT MEMORY
Page 73 and 74: ~ ___TMS416165.536-BIT MUL TIPORT M
Page 75 and 76: 0>~a~~i'i_';:;Z~~~d~c:::• s:~lTl~
Page 77 and 78: TMS416165,536-8IT MULTIPORT MEMORY1
Page 79 and 80: MOSLSITMS4164, SMJ416465,536-8IT DY
Page 81 and 82: TMS4164, SMJ416465,536-811. DYNAMIC
Page 83 and 84: TMS416465,536-811 DYNAMIC RANDOM-AC
Page 87 and 88:
TMS416465,536-811 DYNAMIC RANDOM-AC
Page 89 and 90:
SMJ416465,536-011 DYNAMIC RANDOM-AC
Page 91 and 92:
SMJ416465,536-81T DYNAMIC RANDOM-AC
Page 93 and 94:
SMJ416465,536-011 DYNAMIC RANDOM-AC
Page 95 and 96:
TMS4164, SMJ416465,536·81T DYNAMIC
Page 97 and 98:
TMS4164, SMJ416465,536·8IT DYNAMIC
Page 99 and 100:
z~~gz~.J:>.c1J
Page 101 and 102:
Z~d~~~~0,'...."CIIICCCD:3of. twIRL)
Page 103 and 104:
MOSLSITMS4256. TMS4257262.144·8IT
Page 105 and 106:
TMS4256, TMS4257262,144·8IT DYNAMI
Page 107 and 108:
TMS4256, TMS4257262,144-8IT DYNAMIC
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Page 111 and 112:
TMS4257262.144·8IT DYNAMIC RANDOM
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TMS4256, TMS4257262,144·BIT DYNAMI
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Page 117 and 118:
TMS4257262,144·81T DYNAMIC RANDOM
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Z~d~~~~.!..JcoNOTE:'CIIICO(1),- twI
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i:Z~d~~z~+:>0Co ......"CCICCCD:3og.
Page 123 and 124:
Page 125 and 126:
MOSLSITMS4416. SMJ441616.384·WORD
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TMS4416, SMJ441616,384·WORD BY 4·
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TMS441616,384-WORD BY 4-BI1 DYNAMIC
Page 131 and 132:
TMS441616,384-WORD BY 4-BIT DYNAMIC
Page 133 and 134:
Page 135 and 136:
SMJ441616,384·WORD BY 4·BIT DYNAM
Page 137 and 138:
SMJ441616,384-WORD BY 4-B11 DYNAMIC
Page 139 and 140:
1MS4416, SMJ441616,384·WORD BY 4·
Page 141 and 142:
TMS4416, SMJ441616,384·WORD BY 4·
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z~~~z@towRAs-{rCASAO·A7wDQG:::'.!A
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1:'QltC(()3oc..(()C3~~n_:::Z~~~;;;
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MOSLSITMS446465,536-WORD BY 4-BIT D
Page 149 and 150:
TMS446465,536-WORD 8Y 4-81T DYNAMIC
Page 151 and 152:
TMS446465,536·WORD BY 4·BIT DYNAM
Page 153 and 154:
1MS446465,536·WORD BY 4·B11 DYNAM
Page 155 and 156:
TMS446465,536·WORD BY 4·BIT DYNAM
Page 157 and 158:
Page 159 and 160:
RASCAS----{! '.,ReIVIH i~VIL I tRLC
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~~~n_;;;z~~. ~~tTlg ;O~d ;;;t::=z~@
Page 163 and 164:
~Z~~iZ~tw '"[:;-~~~~~:TCDCO ".;:r0~
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MEMORY SUPPORTLSITMS4500ADYNAMIC RA
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TMS4500ADYNAMIC RAM CONTROLLERpin d
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TMS4500ADYNAMIC RAM CONTROLLERarbit
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TMS4500ADYNAMIC RAM CONTROLLERswitc
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TMS4500ADYNAMIC RAM CONTROLLERacces
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TMS4500ADYNAMIC RAM CONTROLLERoutpu
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TMS4500ADYNAMIC RAM CONTROLLERtypic
Page 179 and 180:
TMS4500ADYNAMIC RAM CONTROLLERtypic
Page 181 and 182:
Alphanumeric Index, Table of Conten
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•••••MOSLSI65,536 X 4 Org
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TM4164EC465,536 BY 4·BIT DYNAMIC R
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MOSLSITM4164EL965,536 BY 9·BIT DYN
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TM4164EL965,536 BY 9-BIT DYNAMIC RA
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••••••••0MOSLSI65,5
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TM4164FL865,536 BY 8·BIT DYNAMIC R
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Page 197 and 198:
MOSLSITMS2516. SMJ251616.384-BIT ER
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TMS2516, SMJ251616,384-BIT ERASABLE
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TMS251616,384·BIT ERASABLE PROGRAM
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SMJ251616,384-BIT ERASABLE PROGRAMM
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o 441MS2516, SMJ251616,384·B11 ERA
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MOSLSITMS2532, SMJ253232,768·BIT E
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Page 211 and 212:
TMS253232,768-BI1 ERASABLE PROGRAMM
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Page 215 and 216:
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MOSLSITMS2564, SMJ256465,536-BIT ER
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TMS256465,536-BIT ERASABLE PROGRAMM
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TMS2564 r SMJ256465 r536-BIT ERASAB
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MOSLSITMS2708, TMS27L08, SMJ2708, S
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TMS270B, TMS27LOBSMJ270B, SMJ27LOB1
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TMS2708. TMS27L081024·WORD BY 8·B
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SMJ2708, SMJ27L081024·WORD BY 8·B
Page 235 and 236:
TMS2708, TMS27L08SMJ2708, SMJ27L081
Page 237 and 238:
MOSLSITMS27162048·WORD BY 8·BIT E
Page 239 and 240:
TMS27162048·WORD BY 8·BIT ERASABL
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TMS27162048-WORD BY 8-BIT ERASABLEP
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TMS2732A32,76B-BIT ERASABLE PROGRAM
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TMS2732A32,768-BIT ERASABLE PROGRAM
Page 247 and 248:
TMS2732A32,768·BIT ERASABLE PROGRA
Page 249 and 250:
MOSLSITMS276465,536-BI1 ERASABLE PR
Page 251 and 252:
TMS276465,536·BIT ERASABLE PROGRAM
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Page 255 and 256:
Page 257 and 258:
MOSLSITMS27128131,072·BIT ERASABLE
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TMS27128131,072·BI1 ERASABLE PROGR
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TMS27128131,072·BIT ERASABLE PROGR
Page 263 and 264:
TMS27128131,072·BIT ERASABLE PROGR
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Page 267 and 268:
MOSLSITMS46648192·WORD BY 8·BIT R
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TMS46648192·WORD BY 8·BIT READ·O
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Page 273 and 274:
MOSLSITMS47324096~WORD BY B·BIT RE
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Page 277 and 278:
Page 279 and 280:
MOSLSITMS47648192·WORD BY 8·BIT R
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Page 283 and 284:
Page 285 and 286:
MOSLSI, TMS49648192·WORD BY 8·BIT
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Page 289 and 290:
Page 291 and 292:
Page 293 and 294:
MOSLSITMS4712816,384·WORD BY 8·BI
Page 295 and 296:
TMS4712816,384·WORD BY 8·BIT READ
Page 297 and 298:
TMS4712816,384-WORD BY 8-BIT READ-O
Page 299 and 300:
Page 301 and 302:
Page 303 and 304:
MOSLSITMS4725632.768·WORD BY 8·BI
Page 305 and 306:
TMS4725632.768·WORD BY 8·BIT READ
Page 307 and 308:
Page 309 and 310:
Page 311 and 312:
Page 313 and 314:
Page 315 and 316:
MOSLSITMS2114, TMS2114L1024·WORD B
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TMS2114, TMS2114L1024·WDRD BY 4·B
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TMS2114. TMS2114L1024·WORD BV 4·B
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ADVANCED MEMORYDEVELOPMENT•Fast A
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TMS2150CACHE ADDRESS COMPARATORabso
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TMS2150CACHE ADDRESS COMPARATORPARA
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MOSLSITMS40162048·WORD BY 8·BIT S
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TMS4016204H-WORD BY H-BIT STATIC RA
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TMS40162048-WDRD BY 8-BIT STATIC RA
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MOSLSITMS4044, TMS40L444096-WORD BY
Page 335 and 336:
TMS4044, TMS40L444096·WORD BY 1·B
Page 337 and 338:
TMS4044, TMS40L444096·WORD BY l·B
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MILITARYCMOSLSISMJ55172048-WORD BY
Page 341 and 342:
SMJ5517204a·WORD BY a·BIT STATIC
Page 343 and 344:
SMJ55172048·WORD BY 8·BIT STATIC
Page 345 and 346:
SMJ55172048-WDRD BY 8-BIT STATIC RA
Page 347 and 348:
SMJ5517204B·WORD BY B·BIT STATIC
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Page 352 and 353:
However, the TMS 4164 provides the
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EXPANSION OF 3242 FOR 256-CYCLE REF
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•9-6
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PAD OPENINGIN OVERCOATPADMETALPADME
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Figure 5 shows how the driver outpu
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cpI UO,leWJOJUI suo'le:>!ldd"f\)W(3
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The falling edge of RAS causes R 1
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~--------::~~:~:~~~:--------~~7,34(
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J-Lead AdvantageTexas Instruments P
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Surface Mount Component Availabilit
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fiSECONDARYVAPOR(VAPOR BLANKET)..Fi
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l>'C'2.ri'Q),..o·:::Jen5'....... o
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l>"C'2..(i"Dl...0":=(I)5"....o...3D
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An external refresh counter has bee
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l>'C'CC:)"Q).-+o·::::sen:ro ... ""
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uo!~ew"oJul suo!~ea!ldd"CD .,.., w7
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DOTCLOCKCLOCK ACLOCK C2 xWCLKRAS (A
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B. If dynamic RAM refresh is enable
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•9-38
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The TMS4416/TMS4500A board is arran
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RAS ~CAS \ I2AI \ I '-2BI '-iiD1Ro2
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9-44
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ALEACXRASMAO-MA7CASFIGURE 1 -ALE LE
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The ALE high to ClK low time is giv
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ClKALEACXRASMAO-MA7CASREFREQROY•
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CDinN~1~12 MHzClKINClKOUTWE/iOclKRD
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UO!leWJOJUI SUOlle:ludd"com~'~,i'74
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coen(J)CLOCKWRITEREADROYALEA14-A5MS
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. Access Grant CyclesThe precharge
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whereta(C)tp(BFR)(-103 + tc2 - tp(B
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•9-62
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tt(REH)TCHLLtAEL-RELRAS rise time (
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. Refresh CyclesOn refresh cycles t
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wherethus,fCLKfCLKtCACfCLK[1/2 (tCA
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R/W approach does a normal read-mod
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II(0~""6 MHzI UO!leWJO,ulSUo!le:l!l
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ClKAlE.ACR\ ,----\,\ ,----R/W\ ,---
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4. Row address setup and hold timeT
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CLKrWRITE -------I.~ ..~---REFRESH-
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The read access time on access gran
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implementations in order to relieve
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"C'2..c:rm...o·j(I)....5'o3...mo·
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RELATIVE MEMORY SIZEARCHIVAL STORAG
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increments till satisfied. This pro
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In the example shown in Figure 5, t
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»'C"E..crQ)r+0':::Jtil:;-....o...3
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•9-94
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184LOGIC SYMBOLS1. INTRODUCTIONEXPl
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LOGIC SYMBOLS4.DIAGRAMATIC SUMMARYI
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lOGIC SYMBOLSWhen RAS goes low, it
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MECHANICAL DATAgeneralElectrical ch
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MECHANICAL DATAceramic packages -ce
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MECHANICAL DATAplastic packages (N
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MECHANICAL DATAceramic chip carrier
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Texas InstrumentsSemiconductor Tech
Page 465 and 466:
TI Sales Offices TI DistributorsALA
Page 468:
Printed in U.S.A.•TEXASINSTRUMENT
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