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SMJ55172048·WORD BY 8·BIT STATIC RAM,.. rn,.. I»n'::a~s:I»:lQ.s:CD3o- A 2047A6(1)A7A8 (23)A9 (22)(19)A1010 ...(18) _E[PWR OWN)La. G1G - (20) G2W (21) 1.2 EN [READ)L.. 1C3 [WRITE)(9) ~ rDQ14- A.3D A.Z4 ..\74(10).....DQ2(11) _.DQ3DQ4 (13).... .(14)_ ..DQ5(15) ... :DQ6(16) .....DQ7(17) '.DQ8-..FUNCTION TABLEW E G DQ1-DQ8 MODEL L X VALID DATA WRITEH L L DATA OUTPUT READX H X HI-Z POWER DOWNH L H HI-Z OUTPUT DISABLED
SMJ55172048·WORD BY 8·BIT STATIC RAMrecommended operating conditionsSupply voltage, VCCSupply voltage, VSSHigh-level input voltage, VIHLow-level input voltage, VIL (see Note 2)Operating case temperature, TCPARAMETERMIN NOM MAX UNIT4.5 5 5.5 V0 V2.2 VCC- 0 .2 VVSS-0.2 o.a V-55 125 °cNOTE 2:The algebraic convention, where the more negative (less positive I limit is designated as minimum, is used in this data sheet for logic voltage levels only.electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)PARAMETER TEST CONDITIONS MIN Typt MAXVOH High-level output voltage IOH = -2 mA 2.4VOL . Low-level output voltage 10L = 2 mA 0.4IIInput current<strong>Al</strong>l inputs exceptD01-DOa VI = 0 V to 5.5 V,D01-DOainputs onlyVCC = 5.5 V-1 1-5 5ICC1 Operating supply current from VCC VCC = 5.5 V, 30 90ICC2 Standby supply current from VCC 10 = 0, E = VIH MIN 5ICC3 Data retention supply current from VCC E = VCC -0.2 V 100VCC(DR) VCC required for data retention ~ = VCC(DR) -0.2 V 2 5.5t <strong>Al</strong>l typical values are at VCC = 5 V, TC = 25°C.timing requirements over recommended supply voltage range and operating case temperature range ttc(rd)tc(W)tw(W)tsu(A)tsu(E)tsu(D)th(A)th(D)tAVWHRead cycle timeWrite cycle timeWrite pulse durationAddress setup timeChip enable setup timeData setup timeAddress hold timeData hold timePARAMETERAddress valid to write enable highSMJ5517-15SMJ5517-20MIN MAX MIN MAX150 200150 20090 12010 1090 12050 7010 1010 10100 130UNITVVp.Ap.AmAmAp.AVUNITnsnsnsnsnsnsnsnsns(I)Q)CJ'$Q)C1::oc.c.~en...>oEQ)~"CCCO~«IX:CJ'';:CO....ent AC test conditions:Input pulse levels: 0.8 V and 2.2 VInput rise and fall times: tr = tf = 5 nsInput and output timing reference levels: 0.8 v and 2.2 VOutput load: 1 TIL gate, CL = 100 pF34TEXASINSTRUMENTSPOST OFFICE BOX 225012 • DALLAS. TEXAS 752658-29
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SMYOOO2.,MOS MemoryData Book1984II
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ALPHANUMERIC INDEX TO DATA SHEETSSM
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TABLE OF CONTENTSALPHANUMERIC INDEX
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MOSLSIRAMs, ROMs, EPROMsSELECTION G
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If you want to give it a try for yo
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INTERCHANGEABILITY GUIDEPART 1 -ALT
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INTERCHANGEABILITY GUIDEFUJITSUMB 8
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INTERCHANGEABILITY GUIDEMOTOROLAMCM
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INTERCHANGEABILITY GUIDETOSHIBATMM
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INTERCHANGEABILITY GUIDESTATIC RAMS
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Alphanumeric Index, Table of Conten
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GLOSSARY fTIMING CONVENTIONS/DATA S
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GLOSSARY/TIMING CONVENTIONS/DATA SH
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GLOSSARY!TIMING CONVENTIONS/DATA SH
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MOSLSITMS411616,384-811 DYNAMIC RAN
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TMS411616,384·811 DYNAMIC RANDOM·
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1MS411616,384-811 DYNAMIC RANDOM-AC
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TMS411616.384·81T DYNAMIC RANDOM·
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zIiADDRESSES~!.....RASCASwDO"*. i,*
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TMS411616,384-81T DYNAMIC RANDOM-AC
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MOSLSITMS416165,536-81T MULTIPORT M
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TMS416165,536-811 MULTIPORT MEMORYf
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TMS416165,536-BIT MULTIPORT MEMORYs
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TMS416165,536-0IT MULTIPORT MEMORYc
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TMS416165,536·BIT MUL TIPORT MEMOR
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TMS416165,536 o BIT MUL TIPORT MEMO
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TMS416165,536·811 MULTIPORT MEMORY
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zI[~~~co,.. twiRL) _,RAS:::~ SI l L
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TMS416165,536·BIT MULTIPORT MEMORY
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~ ___TMS416165.536-BIT MUL TIPORT M
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0>~a~~i'i_';:;Z~~~d~c:::• s:~lTl~
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TMS416165,536-8IT MULTIPORT MEMORY1
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MOSLSITMS4164, SMJ416465,536-8IT DY
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TMS4164, SMJ416465,536-811. DYNAMIC
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TMS416465,536-811 DYNAMIC RANDOM-AC
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TMS416465,536-811 DYNAMIC RANDOM-AC
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SMJ416465,536-011 DYNAMIC RANDOM-AC
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SMJ416465,536-81T DYNAMIC RANDOM-AC
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SMJ416465,536-011 DYNAMIC RANDOM-AC
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TMS4164, SMJ416465,536·81T DYNAMIC
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TMS4164, SMJ416465,536·8IT DYNAMIC
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z~~gz~.J:>.c1J
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Z~d~~~~0,'...."CIIICCCD:3of. twIRL)
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MOSLSITMS4256. TMS4257262.144·8IT
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TMS4256, TMS4257262,144·8IT DYNAMI
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TMS4256, TMS4257262,144-8IT DYNAMIC
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TMS4257262.144·8IT DYNAMIC RANDOM
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TMS4256, TMS4257262,144·BIT DYNAMI
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TMS4257262,144·81T DYNAMIC RANDOM
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Z~d~~~~.!..JcoNOTE:'CIIICO(1),- twI
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i:Z~d~~z~+:>0Co ......"CCICCCD:3og.
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MOSLSITMS4416. SMJ441616.384·WORD
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TMS4416, SMJ441616,384·WORD BY 4·
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TMS441616,384-WORD BY 4-BI1 DYNAMIC
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TMS441616,384-WORD BY 4-BIT DYNAMIC
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SMJ441616,384·WORD BY 4·BIT DYNAM
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SMJ441616,384-WORD BY 4-B11 DYNAMIC
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1MS4416, SMJ441616,384·WORD BY 4·
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TMS4416, SMJ441616,384·WORD BY 4·
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z~~~z@towRAs-{rCASAO·A7wDQG:::'.!A
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1:'QltC(()3oc..(()C3~~n_:::Z~~~;;;
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MOSLSITMS446465,536-WORD BY 4-BIT D
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TMS446465,536-WORD 8Y 4-81T DYNAMIC
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TMS446465,536·WORD BY 4·BIT DYNAM
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1MS446465,536·WORD BY 4·B11 DYNAM
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TMS446465,536·WORD BY 4·BIT DYNAM
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RASCAS----{! '.,ReIVIH i~VIL I tRLC
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~~~n_;;;z~~. ~~tTlg ;O~d ;;;t::=z~@
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~Z~~iZ~tw '"[:;-~~~~~:TCDCO ".;:r0~
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MEMORY SUPPORTLSITMS4500ADYNAMIC RA
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TMS4500ADYNAMIC RAM CONTROLLERpin d
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TMS4500ADYNAMIC RAM CONTROLLERarbit
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TMS4500ADYNAMIC RAM CONTROLLERswitc
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TMS4500ADYNAMIC RAM CONTROLLERacces
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TMS4500ADYNAMIC RAM CONTROLLERoutpu
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TMS4500ADYNAMIC RAM CONTROLLERtypic
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TMS4500ADYNAMIC RAM CONTROLLERtypic
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•••••MOSLSI65,536 X 4 Org
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TM4164EC465,536 BY 4·BIT DYNAMIC R
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MOSLSITM4164EL965,536 BY 9·BIT DYN
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TM4164EL965,536 BY 9-BIT DYNAMIC RA
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••••••••0MOSLSI65,5
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TM4164FL865,536 BY 8·BIT DYNAMIC R
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MOSLSITMS2516. SMJ251616.384-BIT ER
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TMS2516, SMJ251616,384-BIT ERASABLE
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TMS251616,384·BIT ERASABLE PROGRAM
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SMJ251616,384-BIT ERASABLE PROGRAMM
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o 441MS2516, SMJ251616,384·B11 ERA
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MOSLSITMS2532, SMJ253232,768·BIT E
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TMS253232,768-BI1 ERASABLE PROGRAMM
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MOSLSITMS2564, SMJ256465,536-BIT ER
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TMS256465,536-BIT ERASABLE PROGRAMM
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TMS2564 r SMJ256465 r536-BIT ERASAB
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MOSLSITMS2708, TMS27L08, SMJ2708, S
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TMS270B, TMS27LOBSMJ270B, SMJ27LOB1
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TMS2708. TMS27L081024·WORD BY 8·B
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SMJ2708, SMJ27L081024·WORD BY 8·B
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TMS2708, TMS27L08SMJ2708, SMJ27L081
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MOSLSITMS27162048·WORD BY 8·BIT E
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TMS27162048·WORD BY 8·BIT ERASABL
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TMS27162048-WORD BY 8-BIT ERASABLEP
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TMS2732A32,76B-BIT ERASABLE PROGRAM
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TMS2732A32,768-BIT ERASABLE PROGRAM
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TMS2732A32,768·BIT ERASABLE PROGRA
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MOSLSITMS276465,536-BI1 ERASABLE PR
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TMS276465,536·BIT ERASABLE PROGRAM
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MOSLSITMS27128131,072·BIT ERASABLE
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TMS27128131,072·BI1 ERASABLE PROGR
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TMS27128131,072·BIT ERASABLE PROGR
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TMS27128131,072·BIT ERASABLE PROGR
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MOSLSITMS46648192·WORD BY 8·BIT R
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TMS46648192·WORD BY 8·BIT READ·O
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MOSLSITMS47324096~WORD BY B·BIT RE
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MOSLSITMS47648192·WORD BY 8·BIT R
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MOSLSI, TMS49648192·WORD BY 8·BIT
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Page 291 and 292: TMS49648192·WORD BY 8·BIT READ·O
Page 293 and 294: MOSLSITMS4712816,384·WORD BY 8·BI
Page 295 and 296: TMS4712816,384·WORD BY 8·BIT READ
Page 297 and 298: TMS4712816,384-WORD BY 8-BIT READ-O
Page 303 and 304: MOSLSITMS4725632.768·WORD BY 8·BI
Page 305 and 306: TMS4725632.768·WORD BY 8·BIT READ
Page 313 and 314: Alphanumeric Index, Table of Conten
Page 315 and 316: MOSLSITMS2114, TMS2114L1024·WORD B
Page 317 and 318: TMS2114, TMS2114L1024·WDRD BY 4·B
Page 319 and 320: TMS2114. TMS2114L1024·WORD BV 4·B
Page 321 and 322: ADVANCED MEMORYDEVELOPMENT•Fast A
Page 323 and 324: TMS2150CACHE ADDRESS COMPARATORabso
Page 325 and 326: TMS2150CACHE ADDRESS COMPARATORPARA
Page 327 and 328: MOSLSITMS40162048·WORD BY 8·BIT S
Page 329 and 330: TMS4016204H-WORD BY H-BIT STATIC RA
Page 331 and 332: TMS40162048-WDRD BY 8-BIT STATIC RA
Page 333 and 334: MOSLSITMS4044, TMS40L444096-WORD BY
Page 335 and 336: TMS4044, TMS40L444096·WORD BY 1·B
Page 337 and 338: TMS4044, TMS40L444096·WORD BY l·B
Page 339 and 340: MILITARYCMOSLSISMJ55172048-WORD BY
Page 341: SMJ5517204a·WORD BY a·BIT STATIC
Page 345 and 346: SMJ55172048-WDRD BY 8-BIT STATIC RA
Page 347 and 348: SMJ5517204B·WORD BY B·BIT STATIC
Page 349: Alphanumeric Index, Table of Conten
Page 352 and 353: However, the TMS 4164 provides the
Page 354 and 355: EXPANSION OF 3242 FOR 256-CYCLE REF
Page 356 and 357: •9-6
Page 358 and 359: PAD OPENINGIN OVERCOATPADMETALPADME
Page 360 and 361: Figure 5 shows how the driver outpu
Page 362 and 363: cpI UO,leWJOJUI suo'le:>!ldd"f\)W(3
Page 364 and 365: The falling edge of RAS causes R 1
Page 366 and 367: ~--------::~~:~:~~~:--------~~7,34(
Page 368 and 369: J-Lead AdvantageTexas Instruments P
Page 370 and 371: Surface Mount Component Availabilit
Page 372 and 373: fiSECONDARYVAPOR(VAPOR BLANKET)..Fi
Page 374 and 375: l>'C'2.ri'Q),..o·:::Jen5'....... o
Page 376 and 377: l>"C'2..(i"Dl...0":=(I)5"....o...3D
Page 378 and 379: An external refresh counter has bee
Page 380 and 381: l>'C'CC:)"Q).-+o·::::sen:ro ... ""
Page 382 and 383: uo!~ew"oJul suo!~ea!ldd"CD .,.., w7
Page 384 and 385: DOTCLOCKCLOCK ACLOCK C2 xWCLKRAS (A
Page 386 and 387: B. If dynamic RAM refresh is enable
Page 388 and 389: •9-38
Page 390 and 391: The TMS4416/TMS4500A board is arran
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RAS ~CAS \ I2AI \ I '-2BI '-iiD1Ro2
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9-44
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ALEACXRASMAO-MA7CASFIGURE 1 -ALE LE
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The ALE high to ClK low time is giv
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ClKALEACXRASMAO-MA7CASREFREQROY•
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CDinN~1~12 MHzClKINClKOUTWE/iOclKRD
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UO!leWJOJUI SUOlle:ludd"com~'~,i'74
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coen(J)CLOCKWRITEREADROYALEA14-A5MS
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. Access Grant CyclesThe precharge
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whereta(C)tp(BFR)(-103 + tc2 - tp(B
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•9-62
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tt(REH)TCHLLtAEL-RELRAS rise time (
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. Refresh CyclesOn refresh cycles t
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wherethus,fCLKfCLKtCACfCLK[1/2 (tCA
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R/W approach does a normal read-mod
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II(0~""6 MHzI UO!leWJO,ulSUo!le:l!l
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ClKAlE.ACR\ ,----\,\ ,----R/W\ ,---
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4. Row address setup and hold timeT
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CLKrWRITE -------I.~ ..~---REFRESH-
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The read access time on access gran
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implementations in order to relieve
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"C'2..c:rm...o·j(I)....5'o3...mo·
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RELATIVE MEMORY SIZEARCHIVAL STORAG
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increments till satisfied. This pro
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In the example shown in Figure 5, t
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»'C"E..crQ)r+0':::Jtil:;-....o...3
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•9-94
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184LOGIC SYMBOLS1. INTRODUCTIONEXPl
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LOGIC SYMBOLS4.DIAGRAMATIC SUMMARYI
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lOGIC SYMBOLSWhen RAS goes low, it
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MECHANICAL DATAgeneralElectrical ch
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MECHANICAL DATAceramic packages -ce
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MECHANICAL DATAplastic packages (N
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MECHANICAL DATAceramic chip carrier
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Texas InstrumentsSemiconductor Tech
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TI Sales Offices TI DistributorsALA
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Printed in U.S.A.•TEXASINSTRUMENT
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