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TMS4725632,768-WORD BY 8-BIT READ-ONLY MEMORYfunctional block diagramsSTANDARD ROMDATA OUTPUTSQ1-Q84--Vcc+-vss.BANK SELECT ROMDATA OUTPUTSQ1-Q84--Vcc4--VSS7-40TEXASINSTRUMENTSPOST OFFICE BOX 225012 • DALLAS, TEXAS 75265H
TMS4725632,768·WORD BY 8·BIT READ·ONLY MEMORYabsolute maximum ratingsSupply voltage to ground potential (see Note ·1) .................................. - 0.5 V to 7 VApplied output voltage (see Note 1) ............................................. - 1 V to 7 VApplied input voltage (see Note 1) .............................................. - 1 V to 7 VPower dissipation .............................................................. 500 mWOperating free-air temperature ................................................. OOC to 70°CStorage temperature ..................................................... - 55°C to 150°CNOTE 1:Voltage values are with respect to vss.recommended operating conditionsPARAMETER MIN NOM MAX UNITSupply voltage. VCC 4.5 5 5.5 VHigh-level input voltage. VIH 2 VCC VLow-level input voltage. VIL -1 0.8 VOperating free-air temperature. T A 0 70 °Celectrical characteristics, T A o °C to 70°C, VOO 5 V ±. 10% (unless otherwise noted)PARAMETER TEST CONDITIONS MIN MAX UNITVOH High-level output voltage Vee = 4.5 V. IOH = -1 rnA 2.4 VVOL Low-level output voltage VCC = 4.5 V. 10L = 2.1 rnA 0.4 VII Input current Vee 5.5 V. Ov :$ VIN :$ 5.5 V 10 p.A10 Output leakage current Vo = 0.4 V to Vcc. Chip deselected ±10 p.AICC1 Supply current from VCC (active) VCC = 5.5 V. VI = VCC Output not loaded 60 rnAICC2 Supply current from VCC (power down) VCC = 5.5 V 12 rnACi Input capacitanceVo = 0 V.TA = 25°C.f = 1 MHz6 pFCo Output capacitanceVo = 0 V.TA = 25°C.f = 1 MHz12 pFenQ)(J'S;Q)Q:2Eoa:switching characteristics, T A5 V ± 10%, see figure 1 tPARAMETER- TMS47256-25 TMS47256-35 TMS47256-45MIN MAX MIN MAX MIN MAXUNITta(AD) Access time from address 250 350 450ta(S) Access time from chip select 120 120 120ta(PD) Access time from power down/chip enable 250 350 450tvtA) Output data valid after address change 10 10 10 nstdis Output disable time from chip select/chip enable 100 100 100tentS) Output enable time from chip select 10 10 10ten(E) Output enable time from chip enable 10 10 10t<strong>Al</strong>i AC measurements are made at 10% and 90% points.34TEXASINSTRUMENTSPOST OFFICE BOX 225012 • DALLAS, TEXAS 752657-41
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SMYOOO2.,MOS MemoryData Book1984II
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ALPHANUMERIC INDEX TO DATA SHEETSSM
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TABLE OF CONTENTSALPHANUMERIC INDEX
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MOSLSIRAMs, ROMs, EPROMsSELECTION G
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If you want to give it a try for yo
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INTERCHANGEABILITY GUIDEPART 1 -ALT
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INTERCHANGEABILITY GUIDEFUJITSUMB 8
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INTERCHANGEABILITY GUIDEMOTOROLAMCM
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INTERCHANGEABILITY GUIDETOSHIBATMM
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INTERCHANGEABILITY GUIDESTATIC RAMS
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Alphanumeric Index, Table of Conten
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GLOSSARY fTIMING CONVENTIONS/DATA S
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GLOSSARY/TIMING CONVENTIONS/DATA SH
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GLOSSARY!TIMING CONVENTIONS/DATA SH
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MOSLSITMS411616,384-811 DYNAMIC RAN
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TMS411616,384·811 DYNAMIC RANDOM·
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1MS411616,384-811 DYNAMIC RANDOM-AC
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TMS411616.384·81T DYNAMIC RANDOM·
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zIiADDRESSES~!.....RASCASwDO"*. i,*
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TMS411616,384-81T DYNAMIC RANDOM-AC
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MOSLSITMS416165,536-81T MULTIPORT M
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TMS416165,536-811 MULTIPORT MEMORYf
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TMS416165,536-BIT MULTIPORT MEMORYs
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TMS416165,536-0IT MULTIPORT MEMORYc
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TMS416165,536·BIT MUL TIPORT MEMOR
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TMS416165,536 o BIT MUL TIPORT MEMO
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TMS416165,536·811 MULTIPORT MEMORY
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zI[~~~co,.. twiRL) _,RAS:::~ SI l L
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TMS416165,536·BIT MULTIPORT MEMORY
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~ ___TMS416165.536-BIT MUL TIPORT M
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0>~a~~i'i_';:;Z~~~d~c:::• s:~lTl~
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TMS416165,536-8IT MULTIPORT MEMORY1
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MOSLSITMS4164, SMJ416465,536-8IT DY
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TMS4164, SMJ416465,536-811. DYNAMIC
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TMS416465,536-811 DYNAMIC RANDOM-AC
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TMS416465,536-811 DYNAMIC RANDOM-AC
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SMJ416465,536-011 DYNAMIC RANDOM-AC
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SMJ416465,536-81T DYNAMIC RANDOM-AC
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SMJ416465,536-011 DYNAMIC RANDOM-AC
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TMS4164, SMJ416465,536·81T DYNAMIC
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TMS4164, SMJ416465,536·8IT DYNAMIC
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z~~gz~.J:>.c1J
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Z~d~~~~0,'...."CIIICCCD:3of. twIRL)
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MOSLSITMS4256. TMS4257262.144·8IT
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TMS4256, TMS4257262,144·8IT DYNAMI
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TMS4256, TMS4257262,144-8IT DYNAMIC
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TMS4257262.144·8IT DYNAMIC RANDOM
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TMS4256, TMS4257262,144·BIT DYNAMI
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TMS4257262,144·81T DYNAMIC RANDOM
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Z~d~~~~.!..JcoNOTE:'CIIICO(1),- twI
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i:Z~d~~z~+:>0Co ......"CCICCCD:3og.
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MOSLSITMS4416. SMJ441616.384·WORD
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TMS4416, SMJ441616,384·WORD BY 4·
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TMS441616,384-WORD BY 4-BI1 DYNAMIC
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TMS441616,384-WORD BY 4-BIT DYNAMIC
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SMJ441616,384·WORD BY 4·BIT DYNAM
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SMJ441616,384-WORD BY 4-B11 DYNAMIC
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1MS4416, SMJ441616,384·WORD BY 4·
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TMS4416, SMJ441616,384·WORD BY 4·
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z~~~z@towRAs-{rCASAO·A7wDQG:::'.!A
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1:'QltC(()3oc..(()C3~~n_:::Z~~~;;;
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MOSLSITMS446465,536-WORD BY 4-BIT D
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TMS446465,536-WORD 8Y 4-81T DYNAMIC
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TMS446465,536·WORD BY 4·BIT DYNAM
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1MS446465,536·WORD BY 4·B11 DYNAM
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TMS446465,536·WORD BY 4·BIT DYNAM
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RASCAS----{! '.,ReIVIH i~VIL I tRLC
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~~~n_;;;z~~. ~~tTlg ;O~d ;;;t::=z~@
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~Z~~iZ~tw '"[:;-~~~~~:TCDCO ".;:r0~
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MEMORY SUPPORTLSITMS4500ADYNAMIC RA
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TMS4500ADYNAMIC RAM CONTROLLERpin d
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TMS4500ADYNAMIC RAM CONTROLLERarbit
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TMS4500ADYNAMIC RAM CONTROLLERswitc
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TMS4500ADYNAMIC RAM CONTROLLERacces
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TMS4500ADYNAMIC RAM CONTROLLERoutpu
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TMS4500ADYNAMIC RAM CONTROLLERtypic
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TMS4500ADYNAMIC RAM CONTROLLERtypic
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•••••MOSLSI65,536 X 4 Org
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TM4164EC465,536 BY 4·BIT DYNAMIC R
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MOSLSITM4164EL965,536 BY 9·BIT DYN
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TM4164EL965,536 BY 9-BIT DYNAMIC RA
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••••••••0MOSLSI65,5
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TM4164FL865,536 BY 8·BIT DYNAMIC R
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MOSLSITMS2516. SMJ251616.384-BIT ER
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TMS2516, SMJ251616,384-BIT ERASABLE
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TMS251616,384·BIT ERASABLE PROGRAM
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SMJ251616,384-BIT ERASABLE PROGRAMM
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o 441MS2516, SMJ251616,384·B11 ERA
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MOSLSITMS2532, SMJ253232,768·BIT E
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TMS253232,768-BI1 ERASABLE PROGRAMM
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MOSLSITMS2564, SMJ256465,536-BIT ER
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TMS256465,536-BIT ERASABLE PROGRAMM
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TMS2564 r SMJ256465 r536-BIT ERASAB
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MOSLSITMS2708, TMS27L08, SMJ2708, S
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TMS270B, TMS27LOBSMJ270B, SMJ27LOB1
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TMS2708. TMS27L081024·WORD BY 8·B
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SMJ2708, SMJ27L081024·WORD BY 8·B
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TMS2708, TMS27L08SMJ2708, SMJ27L081
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MOSLSITMS27162048·WORD BY 8·BIT E
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TMS27162048·WORD BY 8·BIT ERASABL
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TMS27162048-WORD BY 8-BIT ERASABLEP
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TMS2732A32,76B-BIT ERASABLE PROGRAM
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TMS2732A32,768-BIT ERASABLE PROGRAM
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TMS2732A32,768·BIT ERASABLE PROGRA
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MOSLSITMS276465,536-BI1 ERASABLE PR
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TMS276465,536·BIT ERASABLE PROGRAM
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TMS276465,536-BIT ERASABLE PROGRAMM
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Page 265 and 266: Alphanumeric Index, Table of Conten
Page 267 and 268: MOSLSITMS46648192·WORD BY 8·BIT R
Page 269 and 270: TMS46648192·WORD BY 8·BIT READ·O
Page 273 and 274: MOSLSITMS47324096~WORD BY B·BIT RE
Page 279 and 280: MOSLSITMS47648192·WORD BY 8·BIT R
Page 285 and 286: MOSLSI, TMS49648192·WORD BY 8·BIT
Page 293 and 294: MOSLSITMS4712816,384·WORD BY 8·BI
Page 295 and 296: TMS4712816,384·WORD BY 8·BIT READ
Page 297 and 298: TMS4712816,384-WORD BY 8-BIT READ-O
Page 299 and 300: TMS4712816,384·WORD BY 8·BIT READ
Page 303 and 304: MOSLSITMS4725632.768·WORD BY 8·BI
Page 305: TMS4725632.768·WORD BY 8·BIT READ
Page 313 and 314: Alphanumeric Index, Table of Conten
Page 315 and 316: MOSLSITMS2114, TMS2114L1024·WORD B
Page 317 and 318: TMS2114, TMS2114L1024·WDRD BY 4·B
Page 319 and 320: TMS2114. TMS2114L1024·WORD BV 4·B
Page 321 and 322: ADVANCED MEMORYDEVELOPMENT•Fast A
Page 323 and 324: TMS2150CACHE ADDRESS COMPARATORabso
Page 325 and 326: TMS2150CACHE ADDRESS COMPARATORPARA
Page 327 and 328: MOSLSITMS40162048·WORD BY 8·BIT S
Page 329 and 330: TMS4016204H-WORD BY H-BIT STATIC RA
Page 331 and 332: TMS40162048-WDRD BY 8-BIT STATIC RA
Page 333 and 334: MOSLSITMS4044, TMS40L444096-WORD BY
Page 335 and 336: TMS4044, TMS40L444096·WORD BY 1·B
Page 337 and 338: TMS4044, TMS40L444096·WORD BY l·B
Page 339 and 340: MILITARYCMOSLSISMJ55172048-WORD BY
Page 341 and 342: SMJ5517204a·WORD BY a·BIT STATIC
Page 343 and 344: SMJ55172048·WORD BY 8·BIT STATIC
Page 345 and 346: SMJ55172048-WDRD BY 8-BIT STATIC RA
Page 347 and 348: SMJ5517204B·WORD BY B·BIT STATIC
Page 349: Alphanumeric Index, Table of Conten
Page 352 and 353: However, the TMS 4164 provides the
Page 354 and 355: EXPANSION OF 3242 FOR 256-CYCLE REF
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•9-6
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PAD OPENINGIN OVERCOATPADMETALPADME
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Figure 5 shows how the driver outpu
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cpI UO,leWJOJUI suo'le:>!ldd"f\)W(3
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The falling edge of RAS causes R 1
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~--------::~~:~:~~~:--------~~7,34(
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J-Lead AdvantageTexas Instruments P
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Surface Mount Component Availabilit
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fiSECONDARYVAPOR(VAPOR BLANKET)..Fi
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l>'C'2.ri'Q),..o·:::Jen5'....... o
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l>"C'2..(i"Dl...0":=(I)5"....o...3D
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An external refresh counter has bee
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l>'C'CC:)"Q).-+o·::::sen:ro ... ""
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uo!~ew"oJul suo!~ea!ldd"CD .,.., w7
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DOTCLOCKCLOCK ACLOCK C2 xWCLKRAS (A
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B. If dynamic RAM refresh is enable
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•9-38
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The TMS4416/TMS4500A board is arran
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RAS ~CAS \ I2AI \ I '-2BI '-iiD1Ro2
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9-44
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ALEACXRASMAO-MA7CASFIGURE 1 -ALE LE
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The ALE high to ClK low time is giv
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ClKALEACXRASMAO-MA7CASREFREQROY•
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CDinN~1~12 MHzClKINClKOUTWE/iOclKRD
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UO!leWJOJUI SUOlle:ludd"com~'~,i'74
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coen(J)CLOCKWRITEREADROYALEA14-A5MS
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. Access Grant CyclesThe precharge
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whereta(C)tp(BFR)(-103 + tc2 - tp(B
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•9-62
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tt(REH)TCHLLtAEL-RELRAS rise time (
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. Refresh CyclesOn refresh cycles t
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wherethus,fCLKfCLKtCACfCLK[1/2 (tCA
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R/W approach does a normal read-mod
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II(0~""6 MHzI UO!leWJO,ulSUo!le:l!l
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ClKAlE.ACR\ ,----\,\ ,----R/W\ ,---
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4. Row address setup and hold timeT
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CLKrWRITE -------I.~ ..~---REFRESH-
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The read access time on access gran
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implementations in order to relieve
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"C'2..c:rm...o·j(I)....5'o3...mo·
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RELATIVE MEMORY SIZEARCHIVAL STORAG
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increments till satisfied. This pro
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In the example shown in Figure 5, t
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»'C"E..crQ)r+0':::Jtil:;-....o...3
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•9-94
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184LOGIC SYMBOLS1. INTRODUCTIONEXPl
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LOGIC SYMBOLS4.DIAGRAMATIC SUMMARYI
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lOGIC SYMBOLSWhen RAS goes low, it
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MECHANICAL DATAgeneralElectrical ch
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MECHANICAL DATAceramic packages -ce
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MECHANICAL DATAplastic packages (N
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MECHANICAL DATAceramic chip carrier
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Texas InstrumentsSemiconductor Tech
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TI Sales Offices TI DistributorsALA
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Printed in U.S.A.•TEXASINSTRUMENT
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