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TMS446465,536·WORD BY 4·BIT DYNAMIC RAMcapacitance over recommended supply voltage range and operating free·air temperature range. f1 MHzPARAMETERTMS4164Typt MAXUNITCi(A) Input capacitance, address inputs 4 7 pFCi(RC) Input capacitance strobe inputs 8 10 pFCi(W) Input capacitance, write enable input 8 10 pFCilo Output capacitance 8 10 pFt <strong>Al</strong>l typical values are at T A = 25 DC and nominal supply voltages,~witching characteristics over recommended supply voltage range and operating free-air temperature rangec-
1MS446465,536·WORD BY 4·B11 DYNAMIC RAMtiming requirements over recommended supply voltage range and operating free-air temperature rangeALT. TMS4464-10 TMS4464-12. PARAMETER UNITSYMBOL MIN MAX MIN MAXtc(P) Page mode cycle time tpc 110 130 nstc(PM) Page-mode cycle time (read-modify-write cycle) tpCM 180 210 nstc(rd) Read cycle time t tRC 200 230 nstc(W) Write cycle time twc 200 230 nstc(rdW) Read-write/read-modify-write cycle time tRWC 270 310 nstw(CH)P Pulse duration, CAS high (page mode) tcp 40 50 nstw(CH) Pulse duration, CAS high (non-page mode) tCPN 40 50 nstw(CL) Pulse duration, CAS low:!: tCAS 60 10,000 70 10,000 nstw!RH) Pulse duration, RAS high (precharge time) tRP 90 100 nstWIRL) Pulse duration, RAS low§ tRAS 100 10,000 120 10,000 nstw(W) Write pulse duration twp 35 40 nstt Transition times (rise and fall) for RAS and CAS tT 3 50 3 50 nstsu(CA) Column address setup time tASC 0 0 nstsu(RA) Row address setup time tASR 0 0 nstsu(D) Data setup time tDS 0 0 nstsu(rd) Read command setup time tRCS 0 0 nsEarly write command setuptsu(WCUtime before CAS lowtwcs 0 0nstsu(WCH) Write command setup time before CAS high tCWL 30 40 nstsu(WRH) Write command setup time before RAS high tRWL 30 40 nsth(CLCA) Column address hold time after CAS low tCAH 20 20 nsth(RA) Row address hold time tRAH 15 15 nsth(RLCA) Column address hold time after RAS low tAR 60 70 nsth(CLD) Data hold time after CAS low tDH 30 35 nsth(RLD) Data hold time after RAS low tDHR 70 85 nsth(WLDI Data hold time after W low tDH 30 35 nsth(CHrd) Read command hold time after CAS high tRCH 0 0 nsth(RHrd) Read command hold time after RAS high tRRH 10 10 nsth(CLW) Write command hold time after CAS low tWCH 30 35 nsth(RLW) Write command hold time after RAS low tWCR 70 85 nstRLCHR Delay time, RAS low to CAS high' tCHR 20 25 nstRLCH Delay time, RAS low to CAS high tCSH 100 120 nstCHRL Delay time, CAS high to RAS low tCRP 0 0 nstCLRH Delay time, CAS low to RAS high tRSH 60 70 nstCLWLDelay time, CAS low to W low(read-modify-write cycle only)#tCWD 95 105 ns'tCLRL Delay time, CAS low to RAS low' tCSR 20 25 nsDelay time, RAS low to CAS lowtRLCL (maximum value specified only tRCD 25 40 25 50 nsto guarantee access time)tRLWLDelay time, RAS low to W low(read-modify-write cycle only)#tRWD 135 155 nstGHDDelay time, G high beforedata applied at DQtGDD 30 30trf Refresh time interval tREF 4 4 mst <strong>Al</strong>l cycle times assume tt ~ 5 ns.~ In a read-modify-write cycle, tCLWL and tsu(WCH) must be observed. Depending on the user's transition times, this may require additional CAS low time(tw(CL))'§ In a read-modify-write cycle, tRLWL and tsu(WRH) must be observed. Depending on the user's transition times, this may require additional RAs low time~RL))', CAS-before-l'fAS refresh option only./I G must disable the output buffers prior to applying data to the device.nsCI)Q)(.)':;:Q)C..."-oc.C.:::len>"-oEQ):2:"Cs:::ca:2:
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SMYOOO2.,MOS MemoryData Book1984II
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ALPHANUMERIC INDEX TO DATA SHEETSSM
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TABLE OF CONTENTSALPHANUMERIC INDEX
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MOSLSIRAMs, ROMs, EPROMsSELECTION G
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If you want to give it a try for yo
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INTERCHANGEABILITY GUIDEPART 1 -ALT
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INTERCHANGEABILITY GUIDEFUJITSUMB 8
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INTERCHANGEABILITY GUIDEMOTOROLAMCM
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INTERCHANGEABILITY GUIDETOSHIBATMM
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INTERCHANGEABILITY GUIDESTATIC RAMS
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Alphanumeric Index, Table of Conten
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GLOSSARY fTIMING CONVENTIONS/DATA S
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GLOSSARY/TIMING CONVENTIONS/DATA SH
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GLOSSARY!TIMING CONVENTIONS/DATA SH
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MOSLSITMS411616,384-811 DYNAMIC RAN
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TMS411616,384·811 DYNAMIC RANDOM·
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1MS411616,384-811 DYNAMIC RANDOM-AC
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TMS411616.384·81T DYNAMIC RANDOM·
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zIiADDRESSES~!.....RASCASwDO"*. i,*
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TMS411616,384-81T DYNAMIC RANDOM-AC
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MOSLSITMS416165,536-81T MULTIPORT M
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TMS416165,536-811 MULTIPORT MEMORYf
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TMS416165,536-BIT MULTIPORT MEMORYs
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TMS416165,536-0IT MULTIPORT MEMORYc
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TMS416165,536·BIT MUL TIPORT MEMOR
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TMS416165,536 o BIT MUL TIPORT MEMO
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TMS416165,536·811 MULTIPORT MEMORY
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zI[~~~co,.. twiRL) _,RAS:::~ SI l L
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TMS416165,536·BIT MULTIPORT MEMORY
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~ ___TMS416165.536-BIT MUL TIPORT M
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0>~a~~i'i_';:;Z~~~d~c:::• s:~lTl~
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TMS416165,536-8IT MULTIPORT MEMORY1
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MOSLSITMS4164, SMJ416465,536-8IT DY
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TMS4164, SMJ416465,536-811. DYNAMIC
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TMS416465,536-811 DYNAMIC RANDOM-AC
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TMS416465,536-811 DYNAMIC RANDOM-AC
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SMJ416465,536-011 DYNAMIC RANDOM-AC
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SMJ416465,536-81T DYNAMIC RANDOM-AC
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SMJ416465,536-011 DYNAMIC RANDOM-AC
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TMS4164, SMJ416465,536·81T DYNAMIC
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TMS4164, SMJ416465,536·8IT DYNAMIC
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z~~gz~.J:>.c1J
Page 101 and 102: Z~d~~~~0,'...."CIIICCCD:3of. twIRL)
Page 103 and 104: MOSLSITMS4256. TMS4257262.144·8IT
Page 105 and 106: TMS4256, TMS4257262,144·8IT DYNAMI
Page 107 and 108: TMS4256, TMS4257262,144-8IT DYNAMIC
Page 111 and 112: TMS4257262.144·8IT DYNAMIC RANDOM
Page 113 and 114: TMS4256, TMS4257262,144·BIT DYNAMI
Page 117 and 118: TMS4257262,144·81T DYNAMIC RANDOM
Page 119 and 120: Z~d~~~~.!..JcoNOTE:'CIIICO(1),- twI
Page 121 and 122: i:Z~d~~z~+:>0Co ......"CCICCCD:3og.
Page 125 and 126: MOSLSITMS4416. SMJ441616.384·WORD
Page 127 and 128: TMS4416, SMJ441616,384·WORD BY 4·
Page 129 and 130: TMS441616,384-WORD BY 4-BI1 DYNAMIC
Page 131 and 132: TMS441616,384-WORD BY 4-BIT DYNAMIC
Page 135 and 136: SMJ441616,384·WORD BY 4·BIT DYNAM
Page 137 and 138: SMJ441616,384-WORD BY 4-B11 DYNAMIC
Page 139 and 140: 1MS4416, SMJ441616,384·WORD BY 4·
Page 141 and 142: TMS4416, SMJ441616,384·WORD BY 4·
Page 143 and 144: z~~~z@towRAs-{rCASAO·A7wDQG:::'.!A
Page 145 and 146: 1:'QltC(()3oc..(()C3~~n_:::Z~~~;;;
Page 147 and 148: MOSLSITMS446465,536-WORD BY 4-BIT D
Page 149 and 150: TMS446465,536-WORD 8Y 4-81T DYNAMIC
Page 151: TMS446465,536·WORD BY 4·BIT DYNAM
Page 155 and 156: TMS446465,536·WORD BY 4·BIT DYNAM
Page 159 and 160: RASCAS----{! '.,ReIVIH i~VIL I tRLC
Page 161 and 162: ~~~n_;;;z~~. ~~tTlg ;O~d ;;;t::=z~@
Page 163 and 164: ~Z~~iZ~tw '"[:;-~~~~~:TCDCO ".;:r0~
Page 165 and 166: MEMORY SUPPORTLSITMS4500ADYNAMIC RA
Page 167 and 168: TMS4500ADYNAMIC RAM CONTROLLERpin d
Page 169 and 170: TMS4500ADYNAMIC RAM CONTROLLERarbit
Page 171 and 172: TMS4500ADYNAMIC RAM CONTROLLERswitc
Page 173 and 174: TMS4500ADYNAMIC RAM CONTROLLERacces
Page 175 and 176: TMS4500ADYNAMIC RAM CONTROLLERoutpu
Page 177 and 178: TMS4500ADYNAMIC RAM CONTROLLERtypic
Page 179 and 180: TMS4500ADYNAMIC RAM CONTROLLERtypic
Page 181 and 182: Alphanumeric Index, Table of Conten
Page 183 and 184: •••••MOSLSI65,536 X 4 Org
Page 185 and 186: TM4164EC465,536 BY 4·BIT DYNAMIC R
Page 187 and 188: MOSLSITM4164EL965,536 BY 9·BIT DYN
Page 189 and 190: TM4164EL965,536 BY 9-BIT DYNAMIC RA
Page 191 and 192: ••••••••0MOSLSI65,5
Page 193 and 194: TM4164FL865,536 BY 8·BIT DYNAMIC R
Page 195 and 196: Alphanumeric Index, Table of Conten
Page 197 and 198: MOSLSITMS2516. SMJ251616.384-BIT ER
Page 199 and 200: TMS2516, SMJ251616,384-BIT ERASABLE
Page 201 and 202: TMS251616,384·BIT ERASABLE PROGRAM
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SMJ251616,384-BIT ERASABLE PROGRAMM
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o 441MS2516, SMJ251616,384·B11 ERA
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MOSLSITMS2532, SMJ253232,768·BIT E
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TMS2532, SMJ253232,768-BIT ERASABLE
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TMS253232,768-BI1 ERASABLE PROGRAMM
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MOSLSITMS2564, SMJ256465,536-BIT ER
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TMS256465,536-BIT ERASABLE PROGRAMM
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TMS2564 r SMJ256465 r536-BIT ERASAB
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MOSLSITMS2708, TMS27L08, SMJ2708, S
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TMS270B, TMS27LOBSMJ270B, SMJ27LOB1
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TMS2708. TMS27L081024·WORD BY 8·B
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SMJ2708, SMJ27L081024·WORD BY 8·B
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TMS2708, TMS27L08SMJ2708, SMJ27L081
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MOSLSITMS27162048·WORD BY 8·BIT E
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TMS27162048·WORD BY 8·BIT ERASABL
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TMS27162048-WORD BY 8-BIT ERASABLEP
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TMS2732A32,76B-BIT ERASABLE PROGRAM
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TMS2732A32,768-BIT ERASABLE PROGRAM
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TMS2732A32,768·BIT ERASABLE PROGRA
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MOSLSITMS276465,536-BI1 ERASABLE PR
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TMS276465,536·BIT ERASABLE PROGRAM
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MOSLSITMS27128131,072·BIT ERASABLE
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TMS27128131,072·BI1 ERASABLE PROGR
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TMS27128131,072·BIT ERASABLE PROGR
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TMS27128131,072·BIT ERASABLE PROGR
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MOSLSITMS46648192·WORD BY 8·BIT R
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TMS46648192·WORD BY 8·BIT READ·O
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MOSLSITMS47324096~WORD BY B·BIT RE
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MOSLSITMS47648192·WORD BY 8·BIT R
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MOSLSI, TMS49648192·WORD BY 8·BIT
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MOSLSITMS4712816,384·WORD BY 8·BI
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TMS4712816,384·WORD BY 8·BIT READ
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TMS4712816,384-WORD BY 8-BIT READ-O
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MOSLSITMS4725632.768·WORD BY 8·BI
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TMS4725632.768·WORD BY 8·BIT READ
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MOSLSITMS2114, TMS2114L1024·WORD B
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TMS2114, TMS2114L1024·WDRD BY 4·B
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TMS2114. TMS2114L1024·WORD BV 4·B
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ADVANCED MEMORYDEVELOPMENT•Fast A
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TMS2150CACHE ADDRESS COMPARATORabso
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TMS2150CACHE ADDRESS COMPARATORPARA
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MOSLSITMS40162048·WORD BY 8·BIT S
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TMS4016204H-WORD BY H-BIT STATIC RA
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TMS40162048-WDRD BY 8-BIT STATIC RA
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MOSLSITMS4044, TMS40L444096-WORD BY
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TMS4044, TMS40L444096·WORD BY 1·B
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TMS4044, TMS40L444096·WORD BY l·B
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MILITARYCMOSLSISMJ55172048-WORD BY
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SMJ5517204a·WORD BY a·BIT STATIC
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SMJ55172048·WORD BY 8·BIT STATIC
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SMJ55172048-WDRD BY 8-BIT STATIC RA
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SMJ5517204B·WORD BY B·BIT STATIC
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However, the TMS 4164 provides the
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EXPANSION OF 3242 FOR 256-CYCLE REF
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•9-6
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PAD OPENINGIN OVERCOATPADMETALPADME
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Figure 5 shows how the driver outpu
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cpI UO,leWJOJUI suo'le:>!ldd"f\)W(3
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The falling edge of RAS causes R 1
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~--------::~~:~:~~~:--------~~7,34(
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J-Lead AdvantageTexas Instruments P
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Surface Mount Component Availabilit
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fiSECONDARYVAPOR(VAPOR BLANKET)..Fi
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l>'C'2.ri'Q),..o·:::Jen5'....... o
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l>"C'2..(i"Dl...0":=(I)5"....o...3D
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An external refresh counter has bee
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l>'C'CC:)"Q).-+o·::::sen:ro ... ""
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uo!~ew"oJul suo!~ea!ldd"CD .,.., w7
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DOTCLOCKCLOCK ACLOCK C2 xWCLKRAS (A
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B. If dynamic RAM refresh is enable
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•9-38
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The TMS4416/TMS4500A board is arran
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RAS ~CAS \ I2AI \ I '-2BI '-iiD1Ro2
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9-44
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ALEACXRASMAO-MA7CASFIGURE 1 -ALE LE
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The ALE high to ClK low time is giv
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ClKALEACXRASMAO-MA7CASREFREQROY•
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CDinN~1~12 MHzClKINClKOUTWE/iOclKRD
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UO!leWJOJUI SUOlle:ludd"com~'~,i'74
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coen(J)CLOCKWRITEREADROYALEA14-A5MS
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. Access Grant CyclesThe precharge
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whereta(C)tp(BFR)(-103 + tc2 - tp(B
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•9-62
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tt(REH)TCHLLtAEL-RELRAS rise time (
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. Refresh CyclesOn refresh cycles t
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wherethus,fCLKfCLKtCACfCLK[1/2 (tCA
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R/W approach does a normal read-mod
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II(0~""6 MHzI UO!leWJO,ulSUo!le:l!l
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ClKAlE.ACR\ ,----\,\ ,----R/W\ ,---
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4. Row address setup and hold timeT
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CLKrWRITE -------I.~ ..~---REFRESH-
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The read access time on access gran
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implementations in order to relieve
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"C'2..c:rm...o·j(I)....5'o3...mo·
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RELATIVE MEMORY SIZEARCHIVAL STORAG
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increments till satisfied. This pro
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In the example shown in Figure 5, t
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»'C"E..crQ)r+0':::Jtil:;-....o...3
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•9-94
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184LOGIC SYMBOLS1. INTRODUCTIONEXPl
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LOGIC SYMBOLS4.DIAGRAMATIC SUMMARYI
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lOGIC SYMBOLSWhen RAS goes low, it
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MECHANICAL DATAgeneralElectrical ch
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MECHANICAL DATAceramic packages -ce
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MECHANICAL DATAplastic packages (N
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MECHANICAL DATAceramic chip carrier
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Texas InstrumentsSemiconductor Tech
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TI Sales Offices TI DistributorsALA
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Printed in U.S.A.•TEXASINSTRUMENT
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