to learn about DuPont⢠Vespel® Glass Handling Technology.
to learn about DuPont⢠Vespel® Glass Handling Technology.
to learn about DuPont⢠Vespel® Glass Handling Technology.
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Stacker Bar InsertsSweep-out FingersTake-out InsertsApplications in <strong>Glass</strong> Bottle PlantsTechnical SupportDuPont Vespel ® has over 40 years ofproviding material science solutions for themost demanding high temperature and wearapplications. Our team of expert engineersoffers individual technical support <strong>to</strong> optimizethe material selection and design.Products and ApplicationsDuPont Vespel ® <strong>Glass</strong> <strong>Handling</strong><strong>Technology</strong> consists of two materialofferings: Vespel ® SP-22 and Vespel ®SCP-5050 which are available in cus<strong>to</strong>mfinished parts, semi-finished blanks andplaque.DuPont Vespel ® SP-22 components are anexcellent option for short and medium runsat low/medium speeds that require morespecialized handling <strong>to</strong> minimize defects.This product has been used for more than20 years by plants around the world in glasscontainer production with excellent results.DuPont Vespel ® SCP-5050 components,a new product innovation, are the optimalchoice for either long runs at high speedsor heavier containers that require maximumlife of contact parts with minimum operationdisruption.Dead PlatesTypical Vespel ® applications are:• TAKE-OUT INSERTS• SWEEP-OUT FINGERS• STACKER and TRANSFER PADS• GUIDES and DEAD PLATESProperty ComparisonPropertyTypical PropertiesUnits SP-22 SCP-5050Carbon GraphiteStandard <strong>Glass</strong> <strong>Handling</strong> GradeIzod Impact (Notched heat aged at 315°C[600°F]/100 hr) ASTM D-256J/m (ft-lb/in) 28 (0.5) 33 (0.6) 17 (0.3)Oil Absorption (24 hr soak) % wt chg 0.12 0.02 5.7Wear (oscillating at 315°C [600°F]/25 hr) % wt loss 1.53 0.96 3.1Thermal Conductivity at 50°C (122°F) W/mK (BTU-in/hr-ft 2 -°F) 1 (7) 2 (11) 80 (550)Vespel ® SP-22 and Vespel ® SCP-5050 properties are averages of direct formed and machined shapes product offering.