70EMC <str<strong>on</strong>g>2007</str<strong>on</strong>g> ADVANCE PROGRAMEMC SOCIETY TECHNICAL COMMITTEESWhat is a technical committee? The technical committees play an important role in the overall success of the EMC Society by promoting activitiesin their fields and providing expert knowledge and assistance to generate and review technical papers, organize and operate sessi<strong>on</strong>s at symposia,generate and develop standards and evaluate the “state of the art” in EMC science.You are invited to join the EMC Society Technical Committees. See the committee meetings scheduled at EMC <str<strong>on</strong>g>2007</str<strong>on</strong>g> <strong>on</strong> www.emc<str<strong>on</strong>g>2007</str<strong>on</strong>g>.orgTechnical Committee 1: EMC ManagementChair: Dave Southworth (d.southworth@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)Vice Chair: Bob Scully (bob.scully@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)Secretary: Doug Kramer (drkramer@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)This committee is c<strong>on</strong>cerned with the development and disseminati<strong>on</strong>of Best Practices and Methodologies for the successful leadership,supervisi<strong>on</strong> and guidance of EMC related activities. These BestPractices and Methodologies shall be structured so as to provide assistanceto all managers, and engineers. Appropriate and c<strong>on</strong>venienttools shall serve as a foundati<strong>on</strong> to these Best Practices andMethodologies.Technical Committee 2: EMC MeasurementsChair: D<strong>on</strong> Heirman (d.heirman@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)Vice Chair: Thomas J. Fagan (tjfagan@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)Acting Secretary: Bob Hofmann (hrhofmann@att.net)This committee is c<strong>on</strong>cerned with the measurement and instrumentati<strong>on</strong>requirements in EMC standards and procedures and how they areinterpreted. Also c<strong>on</strong>cerned with the adequacy of measurement proceduresand measurement instrumentati<strong>on</strong> specificati<strong>on</strong>s for radiatedand c<strong>on</strong>ducted emissi<strong>on</strong> and susceptibility tests and the rati<strong>on</strong>ale forperformance limits for these tests.Technical Committee 3: Electromagnetic Envir<strong>on</strong>mentChair: Graham (Bill) Strauss (straussgw@navair.navy.mil)Vice Chair: vacantSecretary: vacantThe charter of TC3, the Technical Committee <strong>on</strong> ElectromagneticEnvir<strong>on</strong>ment is to encourage research <strong>on</strong> the:• Electromagnetic envir<strong>on</strong>ment (EME),• Development of standards for EME measurement and characterizati<strong>on</strong>,• Natural and man-made sources of <strong>electromagnetic</strong> envir<strong>on</strong>ment thatcomprise this envir<strong>on</strong>ment,• Effects of noise (unwanted porti<strong>on</strong>s of EME) <strong>on</strong> systems performance,and• Effects of <str<strong>on</strong>g>internati<strong>on</strong>al</str<strong>on</strong>g> civil and military standards intended to c<strong>on</strong>trolman-made intenti<strong>on</strong>al and unintenti<strong>on</strong>al emissi<strong>on</strong>s of <strong>electromagnetic</strong>energy.Technical Committee 4: Electromagnetic Interference C<strong>on</strong>trolChair: Bob Scully (bob.scully@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)Vice Chair: Kermit Phipps (KPhipps@epri-peac.com)Secretary: John Archer (archerj@indy.net)This committee is c<strong>on</strong>cerned with the fundamentals of transmissi<strong>on</strong>/propagati<strong>on</strong>media and interference c<strong>on</strong>trol technology, togetherwith associated design, analysis, and techniques useful for the identificati<strong>on</strong>,characterizati<strong>on</strong>, c<strong>on</strong>trol and mitigati<strong>on</strong> of <strong>electromagnetic</strong>interference at the system, subsystem and unit levels.Technical Committee 5: High Power ElectromagneticsChair: Dr. William A. Radasky (wradasky@aol.com)Vice Chair: Mr. Michael K. McInerney (mkmcinerney@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)Secretary: Dr. Randy J. Jost (randy.j.jost@usu.edu)This committee is c<strong>on</strong>cerned with the effects and protecti<strong>on</strong> methodsfor electr<strong>on</strong>ic equipment and systems for all types of high power <strong>electromagnetic</strong>envir<strong>on</strong>ments. These envir<strong>on</strong>ments include <strong>electromagnetic</strong>pulse (EMP), intenti<strong>on</strong>al EMI envir<strong>on</strong>ments (e.g. high powermicrowaves and ultra wideband), lightning <strong>electromagnetic</strong> currentsand fields, and electrostatic discharge. Interacti<strong>on</strong>s with aircraft andother mobile systems are included.Technical Committee 6: Spectrum ManagementChair: Thomas J. Fagan (tjfagan@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)Vice Chair: Larry Cohen (lcohen@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)Secretary: Karen Dyberg (kdyberg@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)This committee is c<strong>on</strong>cerned with frequency coordinati<strong>on</strong>, managementprocedures for efficient spectrum use, band occupancy and c<strong>on</strong>gesti<strong>on</strong>,federal regulati<strong>on</strong>s and their adequacy.Technical Committee 7: N<strong>on</strong>sinusoidal FieldsChair: Dr. William J. Croisant (w.croisant@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)Vice Chair: Michael K. McInerney (mkmcinerney@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)Secretary: Dr. Frank Sabath (frank.sabath@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)This committee is c<strong>on</strong>cerned with the applicati<strong>on</strong> of <strong>electromagnetic</strong>signals with large relative bandwidth, comm<strong>on</strong>ly referred to as n<strong>on</strong>sinusoidalwaves, delineati<strong>on</strong> of the differences between time-domainand frequency-domain principles, analytical and numerical treatmentsof the Maxwell postulates directly in time-domain, c<strong>on</strong>ceptualizati<strong>on</strong>,design, fabricati<strong>on</strong> and testing of materials and devices for ultra-widebandwidth systems.Technical Committee 8: Electromagnetic Product SafetyChair: Richard Georgerian (richardg@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)Vice Chair: Dan Modi (Dan.Modi@alc<strong>on</strong>Labs.com)Secretary: Jim Bacher (j.bacher@<str<strong>on</strong>g>ieee</str<strong>on</strong>g>.org)To provide a professi<strong>on</strong>al forum for Product Safety professi<strong>on</strong>als, bothto develop their own skills, and to provide Product Safety outreach toengineers, students, and others.Technical Committee 9: Computati<strong>on</strong>al ElectromagneticsChair: Dr. Jun Fan (jf151005@ncr.com)Vice Chair: Dr. Chuck Bunting (reverb@okstate.edu)Secretary: Dr. Alan Roden (JAlan.Roden@aero.org)This committee is c<strong>on</strong>cerned with broad aspects of Applied Computati<strong>on</strong>alElectromagnetic techniques that can be used to model electro-magneticinteracti<strong>on</strong> phenomena in circuits, devices, and systems. The primaryfocus is with the identificati<strong>on</strong> of the modeling methods that can beapplied to interference (EMC) phenomena, their validati<strong>on</strong> and delineatingthe practical limits of their applicability. Included are low and highfrequency spectral-domain techniques and time-domain methods.Technical Committee 10: Signal IntegrityChair: Jim Nadolny (jim.nadolny@samtec.com)Vice Chair: Prof. Ant<strong>on</strong>io Orlandi (orlandi@ing.univaq.it)Secretary: Prof. Giulio Ant<strong>on</strong>ini (ant<strong>on</strong>ini@ing.univaq.it)This committee is c<strong>on</strong>cerned with the design, analysis, simulati<strong>on</strong>,modeling and measurement techniques useful in maintaining thequality of electrical signals. These activities encompass all aspects ofsignal integrity from the integrated circuit level to the system level.©<str<strong>on</strong>g>2007</str<strong>on</strong>g> IEEE www.emc<str<strong>on</strong>g>2007</str<strong>on</strong>g>.org
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