2007 ieee international symposium on electromagnetic compatibility

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34EMC <strong>2007</strong> ADVANCE PROGRAM(SA) and specific absorption rate (SAR) calculation. We demonstratedthat the two approaches have the same accuracy but the timedomainapproach is more straightforward in the numerical analysis.We also showed some SA/SAR calculation results for a UWB pulseexposure to an anatomical human body model.BIOLOGICAL EFFECTSEnabling the Use of Broadband Tissue Equivalent Liquidsfor Specific Absorption Rate MeasurementsMark Douglas; and Chung-Kwang Chou, — Motorola LabsThe aim of this study is to determine a robust prediction algorithmfor the change in SAR due to deviations in the complex permittivityof a homogeneous phantom from standardized reference values.Several antenna sizes and distances to the phantom are investigatedso as to study a large range of SAR distributions. Simulations usingthe Moment Method are presented. Results are analyzed over a frequencyrange of 30 to 6000 MHz. It is demonstrated that the predictionalgorithm, while developed using dipole antennas, worksequally well for realistic wireless devices. Employing the predictionalgorithm reduces the SAR measurement uncertainty due to permittivitychanges, thereby improving the reproducibility of SAR complianceassessment between laboratories. Another benefit of the algorithmis that it enables SAR measurement standards committees torelax their tolerances on the complex permittivity from defined targets,which allows for the use of broadband tissue equivalent liquids,thus reducing the cost of SAR measurement. The method presentedin this paper has been adopted for inclusion in the next revisions ofthe IEEE 1528 and IEC 62209 measurement standards.Electromagnetic Field Radiation of Mobile Phone Inside aMetallic EnclsoureC. K. Tang; W. K. Lam; K. H. Chan; L. C. Fung; S. W. Leung; and Y.M. Siu, — City University of Hong KongA numerical study on the electromagnetic (EM) field radiation of amobile phone inside a metallic enclosure, from the human safetyaspect, is presented in this paper. The study on the effects of a numberof human bodies and their positions inside the metallic enclosureon the induced E-field was carried out. Results have shown that theE-field induced on the human head of a mobile phone user is not sensitiveto the loadings of human bodies inside the metallic enclosure.However, the E-field induced away from the mobile phone user thatcontributes to the E-field exposure of other people nearby is significantlychanged for different human capacities inside the metallicenclosure. Results have also indicated that the E-field induced on thehuman head of a mobile phone user would be increased by 34% whenother people using mobile phones are in proximity to the conductingwalls of the metallic enclosure.Inter-Laboratory Comparison Results of the ProficiencyTesting Program of EMI Test Sites in JapanKunihiro Osabe, Voluntary EMC Laboratory Accreditation Center, Inc.Recently, an inter-laboratory comparison of the proficiency testingprogram based on the ISO/IEC Guide 43-1 was performed at EMItest sites in Japan by VLAC (Voluntary EMC LaboratoryAccreditation Center Inc.), the Japanese Accreditation Body for EMCtest laboratories. A comb generator operated by AC mains was usedfor the artifact, since the technical proficiency of EMI measurementcannot be evaluated unless both of the conducted emissions and theradiated emissions are measured among the EMI test laboratories.This program, therefore, was performed to measure the conductedemission noise from the switching regulator incorporated into thepower supply circuit of the artifact, and to measure the radiated noiseemitted from the comb generator itself through the enclosure and ACmains cable. For the radiated emissions measurements, the artifactwas connected through the VHF-Line Impedance StabilizationNetwork (LISN) to the supply and the AC mains. That is, the commonmode impedance of of the mains power supply was specified toall participating test sites for the radiated emissions measurements.As a result of this program, the distribution width of the collecteddata from the group was kept from 6 dB to 10 dB, therefore it waseasy to find the laboratory which had isolated data from the group.Testing Large Industrial Systems, Preparations andTechniquesKenneth Boston, L S Research LLCThe success of EMC tests of large systems, machines which cannot beaccommodated within the typical EMC laboratory environment,depends on several factors, which will require careful planning in theinitial stages of the project. Several of the issues surrounding theplanning, staging, and testing of these types of systems will be discussed,and various observations and conclusions reached throughstudy and experience will be presented. Some of these issues are regulatory,and some are technical in nature. With the current EMCdirective being replaced in the summer of <strong>2007</strong>, the regulatory environmentfor most of these systems will also be changing.PRINTED CIRCUIT BOARD MODELINGThe Effects of Signal Trace’s Termination on GroundBounce and Common-Mode RadiationEng Kee Chua, Institute of High Performance Computing; Kye Yak See,Nanyang Technological University; Weng Yew Chang, Nanyang TechnologicalUniversity; and Er Ping Li, Institute of High Performance ComputingBased on the Method of Moments (MoM), the ground bounce on anyarbitrary printed circuit structure as well as the common mode currenton any conductor that attached to the printed circuit structure arepredicted. The MoM is applied to obtain the impedance matrix,which could be used to determine the unknown current vector as wellas the inductance matrix. With the inductance matrix and currentvector, the potential difference between any two adjacent nodes is predicted.The effects of the signal trace’s termination on ground bounceand common-mode radiation are discussed through numerical results.Capacitance of an Open Circuit Via PortFranz Schlagenhaufer; and Matthew Wood, — The University of WesternAustraliaThe via capacitance as part of a power plane structure is defined andcalculated using a series expansion for the electrostatic field. Then bychoosing a suitable surface surrounding the via, Gauss’s Law isapplied to obtain a numerically stable expression for the capacitance,written in series form. Attention is paid to the influence of dimensionsand material on the capacitance value, and comparisons withMethod-of-Moment based simulation packages are made.Coupling Analysis of PCB-Chassis Systems with SignalLines and Via Structures Using SPICENaoki Kobayashi, NEC Jisso and Production Technologies ResearchLaboratories; Todd Hubing, Clemson University; Ken Morishita; ManabuKusumoto; and Takashi Harada, — Jisso and Production TechnologiesResearch LaboratoriesThis paper describes the SPICE modeling of printed circuit boards(PCBs) with signal lines and via structures electrically connected to a©<strong>2007</strong> IEEE www.emc<strong>2007</strong>.org
EMC <strong>2007</strong> ADVANCE PROGRAM35metal chassis. First, a PCB model is proposed, considering the couplingbetween signal lines and the power bus due to via structures.Next, the model is expanded to include the chassis and groundingposts. The calculated results using SPICE are shown to be consistentwith experimental data. Furthermore, positioning of the groundingposts near the edges of the PCB is shown experimentally and numericallyto reduce radiated emissions.High-Accuracy Emission Simulation Models for VLSI ChipsIncluding Package and Printed Circuit BoardThomas Steinecke, Infineon Technologies AGThe electromagnetic emissions of complex, very large scale, integratedcircuits is determined by their operational activity plus the manifoldnoise propagation paths through the on-chip power routing, the packagetraces, and the planes and traces on the printed circuit board. Thedesign of any emission test board influences the emissions finally measuredat defined connector probes. The emissions to be expected from amicrocontroller plugged onto application boards are determined by themicrocontroller’s noise characteristics and the board’s propagation characteristics.Good simulation models have to serve two main interests:1) identification of emission-related IC design weaknesses and estimationof measured emissions from the IC manufacturer’s point of view,and 2) identification of emission-related application board design weaknessesand estimation of measured emissions from the system manufacturer’spoint of view. This paper presents a target-leading approach fora full system emission simulation model which serves both the IC andsystem manufacturer’s interests. The simulation model has been conductedfor a 30-million transistor 32-bit automotive microcontroller.SPICE-Compatible Cavity and Transmission Line Model forPower Bus with Narrow SlotsYao Jiang Zhang, N/ASegmental lumped circuits are derived from a coupled transmissionline model for a narrow slot on the power bus. Both electric andmagnetic coupling are taken into account by distributed inductancesand capacitances. Then a SPICE compatible circuit model for thepower bus with the narrow slot is proposed by connecting the segmentallumped circuits to the equivalent circuit derived by a hybridcavity model and segmentation method for irregular power/groundplanes. The model is validated by comparing it with the finite elementmethod (FEM) for the self or mutual impedances calculation oftwo ports located in the power bus.Modeling of a Mixed Signal Processor Susceptibility toNear-Field AggressionAlexandre Boyer; Sonia Bendhia; and Etienne Sicard, — Institut Nationaldes Sciences Appliquées (INSA) of ToulouseThis paper deals with the measurement and modelling of the susceptibilityof an integrated analog-to-digital converter of a 16 bit microcontrollerto near-field localized aggression using a miniature near-field probe. A predictivesimulation of the susceptibility threshold is detailed. Comparisonbetween experimental and simulation results shows interesting correlationsbetween measured and simulated susceptibility thresholds.EM MODELING IEMI Prediction Under a Different Program BehaviorShih-Yi Yuan, Feng Chia University; Chi-Feng Yang, Feng ChiaUniversity; Etienne Sicard, INSA of Toulouse; Chiu-Kuo Chen, M.O.E.A;and Shry-Sann Liao, Feng Chia UniversityThis paper discusses the estimation, measurement, and prediction ofthe EMI behaviors of a simple PIC controller under different programconsiderations. Using the “instruction current” concept, this workcan predict, in the time domain, a very accurate current behavior ofthe conduct emissions. This paper also proposes a way to modify anICEM model to achieve a good prediction of the impact of EMI bydifferent program behavior. Prediction improvement can be done iffurther considerations are made of other effects. Various kinds ofeffects can also be applied to the adapted ICEM model with furtherstudies. This work will be of great help to reduce parasitic emissionsby SW technology and may propose another dimension of techniquesfor embedded system software design, software design methodology,driver design, and compiler optimization.Patch Antenna Modeling Issues Using CommercialSoftwareWilliam Coburn; Canh Ly; and Steven Weiss, — U. S. Army ResearchLaboratoryThe Method of Moments, implemented in 2.5-D for multilayerantenna structures, or implemented as a fully 3-D solution ofMaxwell’s equations, is a popular method for microwave antenna simulations.Commercial software was used to simulate an aperture-coupledpatch and a pin-fed patch antenna element. The simulationresults are compared with experimental data measured for antennaprototypes having finite substrate and ground plane dimensions. Theaperture coupled patch has a microstrip feed line extending to theedge of the substrate where a coaxial connector is installed betweenthe microstrip and ground plane. The pinfed patch has a coaxial connectorfeed with a finite size ground plane and radome withoutdielectric substrates. We use a 3-D simulation to capture the effectof a finite ground plane compared to a 2.5-D model. We compare thecalculated and measured antenna performance and conclude that the2.5-D simulations are sufficient for the design of conventional patchantennas but detailed analysis or novel designs may require a fully 3-D model.EM Fields Between Two Parallel Plates Supported byConductive Multi-PolesHiroshi Echigo, Tohoku Gakuin UniversityIn conductive multi-plates like printed circuit boards (PCBs) or pingrid array (PGA) connectors of CPU ICs, EM fields should be analyzedbecause undesired coupling between the vias and pins will occur.Adding them, the shield effectiveness of the pin-array to prevent theleakage of EM field should be estimated. In this paper, some examplesare shown to prove that the analysis method for the scattering of amulti-wire system is effective. Some calculated results giving the electricnear-field images are given for the thin wire systems and the multiplateconductors. They clearly give the field pattern scattering outfrom the pole conductors. These results will give the estimations of theEMI intuitively and it leads to better treatments in the design.EM MODELING IIMeasurement of a Point Source Radiator Using a MagneticProbeKevin Slattery; and Xiaopeng Dong, — Intel CorporationA set of measurements have been performed on a test point sourceradiator. The near field, here assumed to be less than 0.01 m, wasmeasured with a near field scanning system using a simple magneticloop probe. This paper develops the analysis of those measurementsand shows that the loop probe measures the far field component ofthe near radiated fields of a point source radiator when magneticdipole equations are assumed to describe the radiation characteristics.©<strong>2007</strong> IEEE www.emc<strong>2007</strong>.org
Page 3 and 4: WELCOME FROM THE CHAIRJanet O’Nei
Page 5 and 6: Why Meet The StandardsWhen You Can
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