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2007 ieee international symposium on electromagnetic compatibility

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34EMC <str<strong>on</strong>g>2007</str<strong>on</strong>g> ADVANCE PROGRAM(SA) and specific absorpti<strong>on</strong> rate (SAR) calculati<strong>on</strong>. We dem<strong>on</strong>stratedthat the two approaches have the same accuracy but the timedomainapproach is more straightforward in the numerical analysis.We also showed some SA/SAR calculati<strong>on</strong> results for a UWB pulseexposure to an anatomical human body model.BIOLOGICAL EFFECTSEnabling the Use of Broadband Tissue Equivalent Liquidsfor Specific Absorpti<strong>on</strong> Rate MeasurementsMark Douglas; and Chung-Kwang Chou, — Motorola LabsThe aim of this study is to determine a robust predicti<strong>on</strong> algorithmfor the change in SAR due to deviati<strong>on</strong>s in the complex permittivityof a homogeneous phantom from standardized reference values.Several antenna sizes and distances to the phantom are investigatedso as to study a large range of SAR distributi<strong>on</strong>s. Simulati<strong>on</strong>s usingthe Moment Method are presented. Results are analyzed over a frequencyrange of 30 to 6000 MHz. It is dem<strong>on</strong>strated that the predicti<strong>on</strong>algorithm, while developed using dipole antennas, worksequally well for realistic wireless devices. Employing the predicti<strong>on</strong>algorithm reduces the SAR measurement uncertainty due to permittivitychanges, thereby improving the reproducibility of SAR complianceassessment between laboratories. Another benefit of the algorithmis that it enables SAR measurement standards committees torelax their tolerances <strong>on</strong> the complex permittivity from defined targets,which allows for the use of broadband tissue equivalent liquids,thus reducing the cost of SAR measurement. The method presentedin this paper has been adopted for inclusi<strong>on</strong> in the next revisi<strong>on</strong>s ofthe IEEE 1528 and IEC 62209 measurement standards.Electromagnetic Field Radiati<strong>on</strong> of Mobile Ph<strong>on</strong>e Inside aMetallic EnclsoureC. K. Tang; W. K. Lam; K. H. Chan; L. C. Fung; S. W. Leung; and Y.M. Siu, — City University of H<strong>on</strong>g K<strong>on</strong>gA numerical study <strong>on</strong> the <strong>electromagnetic</strong> (EM) field radiati<strong>on</strong> of amobile ph<strong>on</strong>e inside a metallic enclosure, from the human safetyaspect, is presented in this paper. The study <strong>on</strong> the effects of a numberof human bodies and their positi<strong>on</strong>s inside the metallic enclosure<strong>on</strong> the induced E-field was carried out. Results have shown that theE-field induced <strong>on</strong> the human head of a mobile ph<strong>on</strong>e user is not sensitiveto the loadings of human bodies inside the metallic enclosure.However, the E-field induced away from the mobile ph<strong>on</strong>e user thatc<strong>on</strong>tributes to the E-field exposure of other people nearby is significantlychanged for different human capacities inside the metallicenclosure. Results have also indicated that the E-field induced <strong>on</strong> thehuman head of a mobile ph<strong>on</strong>e user would be increased by 34% whenother people using mobile ph<strong>on</strong>es are in proximity to the c<strong>on</strong>ductingwalls of the metallic enclosure.Inter-Laboratory Comparis<strong>on</strong> Results of the ProficiencyTesting Program of EMI Test Sites in JapanKunihiro Osabe, Voluntary EMC Laboratory Accreditati<strong>on</strong> Center, Inc.Recently, an inter-laboratory comparis<strong>on</strong> of the proficiency testingprogram based <strong>on</strong> the ISO/IEC Guide 43-1 was performed at EMItest sites in Japan by VLAC (Voluntary EMC LaboratoryAccreditati<strong>on</strong> Center Inc.), the Japanese Accreditati<strong>on</strong> Body for EMCtest laboratories. A comb generator operated by AC mains was usedfor the artifact, since the technical proficiency of EMI measurementcannot be evaluated unless both of the c<strong>on</strong>ducted emissi<strong>on</strong>s and theradiated emissi<strong>on</strong>s are measured am<strong>on</strong>g the EMI test laboratories.This program, therefore, was performed to measure the c<strong>on</strong>ductedemissi<strong>on</strong> noise from the switching regulator incorporated into thepower supply circuit of the artifact, and to measure the radiated noiseemitted from the comb generator itself through the enclosure and ACmains cable. For the radiated emissi<strong>on</strong>s measurements, the artifactwas c<strong>on</strong>nected through the VHF-Line Impedance Stabilizati<strong>on</strong>Network (LISN) to the supply and the AC mains. That is, the comm<strong>on</strong>mode impedance of of the mains power supply was specified toall participating test sites for the radiated emissi<strong>on</strong>s measurements.As a result of this program, the distributi<strong>on</strong> width of the collecteddata from the group was kept from 6 dB to 10 dB, therefore it waseasy to find the laboratory which had isolated data from the group.Testing Large Industrial Systems, Preparati<strong>on</strong>s andTechniquesKenneth Bost<strong>on</strong>, L S Research LLCThe success of EMC tests of large systems, machines which cannot beaccommodated within the typical EMC laboratory envir<strong>on</strong>ment,depends <strong>on</strong> several factors, which will require careful planning in theinitial stages of the project. Several of the issues surrounding theplanning, staging, and testing of these types of systems will be discussed,and various observati<strong>on</strong>s and c<strong>on</strong>clusi<strong>on</strong>s reached throughstudy and experience will be presented. Some of these issues are regulatory,and some are technical in nature. With the current EMCdirective being replaced in the summer of <str<strong>on</strong>g>2007</str<strong>on</strong>g>, the regulatory envir<strong>on</strong>mentfor most of these systems will also be changing.PRINTED CIRCUIT BOARD MODELINGThe Effects of Signal Trace’s Terminati<strong>on</strong> <strong>on</strong> GroundBounce and Comm<strong>on</strong>-Mode Radiati<strong>on</strong>Eng Kee Chua, Institute of High Performance Computing; Kye Yak See,Nanyang Technological University; Weng Yew Chang, Nanyang TechnologicalUniversity; and Er Ping Li, Institute of High Performance ComputingBased <strong>on</strong> the Method of Moments (MoM), the ground bounce <strong>on</strong> anyarbitrary printed circuit structure as well as the comm<strong>on</strong> mode current<strong>on</strong> any c<strong>on</strong>ductor that attached to the printed circuit structure arepredicted. The MoM is applied to obtain the impedance matrix,which could be used to determine the unknown current vector as wellas the inductance matrix. With the inductance matrix and currentvector, the potential difference between any two adjacent nodes is predicted.The effects of the signal trace’s terminati<strong>on</strong> <strong>on</strong> ground bounceand comm<strong>on</strong>-mode radiati<strong>on</strong> are discussed through numerical results.Capacitance of an Open Circuit Via PortFranz Schlagenhaufer; and Matthew Wood, — The University of WesternAustraliaThe via capacitance as part of a power plane structure is defined andcalculated using a series expansi<strong>on</strong> for the electrostatic field. Then bychoosing a suitable surface surrounding the via, Gauss’s Law isapplied to obtain a numerically stable expressi<strong>on</strong> for the capacitance,written in series form. Attenti<strong>on</strong> is paid to the influence of dimensi<strong>on</strong>sand material <strong>on</strong> the capacitance value, and comparis<strong>on</strong>s withMethod-of-Moment based simulati<strong>on</strong> packages are made.Coupling Analysis of PCB-Chassis Systems with SignalLines and Via Structures Using SPICENaoki Kobayashi, NEC Jisso and Producti<strong>on</strong> Technologies ResearchLaboratories; Todd Hubing, Clems<strong>on</strong> University; Ken Morishita; ManabuKusumoto; and Takashi Harada, — Jisso and Producti<strong>on</strong> TechnologiesResearch LaboratoriesThis paper describes the SPICE modeling of printed circuit boards(PCBs) with signal lines and via structures electrically c<strong>on</strong>nected to a©<str<strong>on</strong>g>2007</str<strong>on</strong>g> IEEE www.emc<str<strong>on</strong>g>2007</str<strong>on</strong>g>.org

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