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2007 ieee international symposium on electromagnetic compatibility

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32EMC <str<strong>on</strong>g>2007</str<strong>on</strong>g> ADVANCE PROGRAMArif Ege Engin; Tae H<strong>on</strong>g Kim; and Madhavan Swaminathan, — GeorgiaInstitute of TechnologyElectromagnetic bandgap (EBG) structures in a parallel plane pair arequite effective for suppressing simultaneous switching noise, buttheir size is large to apply to compact electr<strong>on</strong>ic devices. The authorshave so far investigated the miniaturizati<strong>on</strong> of EBG structures by twoapproaches: 1) two narrow slits <strong>on</strong> each patch; and 2) use of a high-Kmaterial for a thin dielectric layer. In this paper, furthermore, a thirdapproach was investigated: the inserti<strong>on</strong> of a high-permeability magneticmetal sheet between the parallel plane pair. As a result, theminiaturizati<strong>on</strong> of 10 % was achieved by performing these threeapproaches simultaneously.EMI Suppressi<strong>on</strong> in Microprocessor Packages UsingMiniaturized Electromagnetic Bandgap Structures withHigh-k DielectricsBaharak Mohajer Iravani, University of Maryland; and Omar Ramahi,University of WaterlooA novel miniaturized planar <strong>electromagnetic</strong> bandgap (EBG)structure is proposed for microprocessor packages. The design ofthe proposed EBG structure c<strong>on</strong>sisting of meander lines andpatches are based <strong>on</strong> the use of high-k dielectric material with arelative permeability greater than or equal to 100. High-k dielectricmaterial increases the effective capacitance of the EBG cell incomparis<strong>on</strong> to comm<strong>on</strong>ly used materials with a much lowerdielectric c<strong>on</strong>stant. Simulati<strong>on</strong> results are provided to show thatusing the proposed EBGs with periodicities less than 2 mm; it ispossible to obtain a very wide stop band (~10 GHz) in additi<strong>on</strong>to more than 10 times in unit cell size reducti<strong>on</strong>. This widebandgap can cover the operating frequency of current processorsand a wide range of the res<strong>on</strong>ant frequencies of a typical package.Simplified Computati<strong>on</strong> of Electromagnetic Band-GapProperties of Via-Holed Metal PatchesJens Bornemann, University of Victoria; Karumudi Rambabu, N/A; andMarjan Mokhtaari, University of VictoriaAn extended analytical method for the analysis and design of <strong>electromagnetic</strong>band-gap (EBG) structures formed by via-holed metalpatches is presented. C<strong>on</strong>trary to a known approach, this techniquecorrectly predicts the first stopband, which is often utilized in printedantenna applicati<strong>on</strong>s and, therefore, significantly extends the frequencyrange of applicati<strong>on</strong>. The approach is verified by comparis<strong>on</strong>with results of commercially available software.Noise Suppressi<strong>on</strong> in High Speed Digital Circuits by Meansof a Novel EBG Structure with Triangle Patches andHexag<strong>on</strong>al ArraysAnt<strong>on</strong>io Ciccomancini, CST of AmericaThe aim of this paper is to describe the simultaneous switchingnoise (SSN) mitigati<strong>on</strong> by means of a novel <strong>electromagnetic</strong> bandgap (EBG) structure with triangle patches and hexag<strong>on</strong>al arrays.The proposed EBG achieves -40 dB of stop band in the range 6.5to 9 GHz. Parametric studies including the radius effect of themetal plated vias and the substrate thickness are performed bymeans of full wave simulati<strong>on</strong>s. The impact of the proposed design<strong>on</strong> the signal integrity is also investigated both in time (eye-diagramsand TDR) and frequency domain (S-parameters). Finally,dispersi<strong>on</strong> diagram and mode pattern distributi<strong>on</strong> of the singularunit EBG cell are analyzed by means of eigenmode solver and periodicboundary c<strong>on</strong>diti<strong>on</strong>s.PRODUCT SAFETY TESTINGHow to Perform EMI Testing within an Existing EMI Chamber<strong>on</strong> an EUT with Low Particle Count Cleanliness RequirementsLarry Freeman, Harris Corporati<strong>on</strong>The ability to perform EMI measurements <strong>on</strong> an EUT having cleanlinessrequirements has represented a significant obstacle for manycompliance testing agencies. Whether due to inexperience or c<strong>on</strong>cernwith overly restrictive requirements, many agencies simplydecline the opportunity outright. This paper details the approachand techniques used to gauge viability of performing EMI measurementtesting <strong>on</strong> high reliability hardware with low particle count,clean room requirements. The main emphasis is <strong>on</strong> exploring variousopti<strong>on</strong>s, outlining and weighing the benefits of each technique,as well as determining the pertinent parameters involved with makinga clean envir<strong>on</strong>ment within an EMI chamber capable of performingEMI measurements.Medical Equipment Immunity Assessment by Time DomainAnalysis Applicati<strong>on</strong> to GSM SignalsMireya Fernandez Chimeno, GCEM-UPC; Miguel Angel GarciaG<strong>on</strong>zalez, UPC; and Ferran Silva, GCEM-UPCThis paper presents a measurement method to assess the immunity ofmedical equipment (bioelectrical signal recording systems) to shortdurati<strong>on</strong> interferences, like that of a GSM signal during the callestablishment and ringing phase. Frequency domain measurementmethods do not allow the analysis of these signals due to their shortdurati<strong>on</strong> and transient nature. To measure these interferences we usethe intermediate frequency (IF) signal output of a spectrum analyzerworking in “zero span” to obtain a signal in the time domain, and wec<strong>on</strong>nect it to the input of a digital oscilloscope. Then, we demodulatethe IF signal to obtain the interference in base band. The combinati<strong>on</strong>of the characteristics of both instruments allow us to measurethe interfering signal and to assess the effect of these kinds of signalsin medical systems that record low-level, low-frequency signals.Sensor Development and Data Collecti<strong>on</strong> for Hero TestingJohn Chavarria, White Sands Missile RangeThis paper provides a method for assembling Hazards ofElectromagnetic Radiati<strong>on</strong> to Ordnance (HERO) testing instrumentati<strong>on</strong>and data collecti<strong>on</strong>. During HERO testing, inert ordnance isexposed to high <strong>electromagnetic</strong> fields based <strong>on</strong> criteria set by militarystandards. Specialized sensors are developed using fiber-opticthermocouples and unique molding methods to m<strong>on</strong>itor critical areasfor induced currents. The sensor is calibrated against a known currentto provide a calibrati<strong>on</strong> curve used during test data collecti<strong>on</strong>.Frequency, field intensities, and current levels are used to calculatemaximum exposure levels and safety factors. The data is then formattedinto a table suitable for inclusi<strong>on</strong> in the test report based <strong>on</strong>military standards. This document will discuss the aspects of thistesting to include equipment utilized, the development of sensors,calibrati<strong>on</strong>, test setup, data collecti<strong>on</strong>, and display format.Recent Developments in Standardizati<strong>on</strong> Related to EMCand Functi<strong>on</strong>al SafetyBernd Jaekel, Siemens AGIssues related to <strong>electromagnetic</strong> <strong>compatibility</strong> are dealt with in abroad range of standards, whereas the main focus lies in the IEC61000-X-Y series of EMC documents, and this series is furtheraccompanied by a lot of product specific standards. For several years,the topic of functi<strong>on</strong>al safety of electrical and electr<strong>on</strong>ic systems has©<str<strong>on</strong>g>2007</str<strong>on</strong>g> IEEE www.emc<str<strong>on</strong>g>2007</str<strong>on</strong>g>.org

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