2007 ieee international symposium on electromagnetic compatibility

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14EMC <strong>2007</strong> ADVANCE PROGRAMcoupling occurs both horizontally as well as vertically across layers.Thus, to catch SI and PI problems at an early stage of design requiresfast signal and power co-simulation methodologies. In this paper, weoutline the multi-layer finite-difference method and how the accuracyof the technique can be enhanced with models for fringe and gapeffects. We then briefly describe a method for integrating the signaldistribution network with the power distribution network to enableco-simulation. The method is then applied to a mixed signal boardcontaining split planes, and numerical results are compared to fullwavesimulations.Nonlinear Identification of Complex Systems Using RadialBasis Function Networks and Model Order ReductionWerner John; Christopher Wiegand; Ljubica Radic-Weissenfeld; ChristianHedayat; and Ulrich Hilleringmann, — Fraunhofer Institute of Reliabilityand Microintegration, Advanced System Engineering (FhG IZM ASE),Paderborn, GermanyAs wiring density increases with integration and miniaturization ofpackages (SIP) and PCB, the ability to simulate precisely the signalintegrity (SI) behaviour of complex systems becomes decisive, whilethe simulation time increases dramatically. Therefore it is essentialthat the design of such complex systems is supported by accuratesimulation models. This paper proposes a methodology for the identificationand the fast simulation of non-linear complex HDI/HDPsystems and integrated circuits by means of radial basis function(RBF) nets. For this purpose a specific modelling technique is presentedwith a complete flow that leads to the development of a blackbox model (BBM). This approach is then combined with the modelorder reduced (MOR) attempt and allows accelerated simulation of awhole transmission line-buffer set.Transmission Line Model for the Gapped Power Bus StructureJoe Trinkle; and Antonio Cantoni, — The Universtity of Western AustraliaA transmission line model is developed for the computation of thetransfer impedance between gapped supply zones. The model isshown to be accurate to high frequencies by validation with full wavesimulation.Fast Macromodel-based Signal Integrity Assessment for RFand Mixed-Signal ModulesPietro Brenner, Infineon Technologies AG, Germany; Flavio Canavero,Politecnico di Torino; and Stefano Grivet-Talocia, Politecnico di TorinoThis paper presents a macromodel-based approach for fast signalintegrity assessment for highly integrated Radio Frequency (RF) andMixed-Signal System on Chip (SoC) applications. In particular, weintroduce a complexity reduction process that enables the signalintegrity verification via analog circuit simulations, and we apply themethodology to complex radio transceiver chips in order to characterizethe influence of parasitic elements on the signal processing performanceof the system. Some preliminary tests show that the proposedmethodology leads to significant simulation speed-up factorswith respect to standard approaches for the specific application herewithconsidered.Determination of Propagation of Fast Induced TransientImpulses on PCB-LevelWerner John; and Mohamed Taki, — Fraunhofer Institute of Reliabilityand Microintegration, Advanced System Engineering (FhG IZM ASE),Paderborn, GermanyIn this contribution, an extended approach to determine the flow ofinduced transient noise injected into a system of interconnects will bepresented. It is now possible to create subcircuits for detailed analysisand use more than one noise source. Dominant and critical signaltraces that transfer significant noise, form multiple noise sources thatcouple with digital device input ports and are determined in the frequencydomain using advanced graph searching algorithms. Thetime domain simulation of the whole signal paths, including devicedrivers and receivers, is performed using a hybrid analysis in HSpiceenvironment. The approach is applied to an interconnect systemdriven by two sensitive inverter gates. The scattering parameters andthe waveform of the propagating impulses considering dominant signalpaths show good agreement with the total system response.SPECIAL SESSION: POWER INTEGRITY / SIGNAL INTEGRITYFOR NEXT GENERATION SYSTEMSBroadband Noise Suppression Using a Hybrid PhotonicCrystal Power/Ground Plane SubstrateTzong-Lin Wu, National Taiwan University; Yi-Che Chen, NationalTaiwan University; Ting-Kuang Wang, National Taiwan University; AlexLu, N/A; and Lexus Lan, N/AA novel hybrid photonic crystal power/ground layer (H-PCPL) conceptis proposed with broadband power noise isolation (or suppression)performance. Two different hybrid approaches are investigated;one is fixed radius but varied pitch for the high-DK disc, and theother one is varied radius and pitch for the disc. It is found the firstapproach can enhance the bandwidth of the noise rejection but cannot obtain a continuous and wide stopband because there is anabsolute passband between two gaps. However, the second approachcan obtain a continuous and wide stopband by mixing two radius ofthe disc. Gap map of the photonic crystal lattice is employed to synthesizethe stopband profile in both approaches. As an example, awide stopband ranging from 2.8 GHz to 7.9 GHz can be achievedbased on two kinds of radius, 2 mm and 1.45 mm, under the samedisc pitch 10 mm, the effective series inductance of the capacitors.Load Current Funneling Examination for Power Distributionin High Performance Multi-core Silicon DevicesJoseph T. DiBene, II, Intel CorporationPowering silicon devices today are challenging due to the increasing concentrationof current into the load at the silicon. As multi-core processingbecomes more available, larger numbers of computational units areplaced on a single piece of silicon allowing more processing and higherbandwidth in our computer systems. However, as the devices becomesmaller, the current density also increases which raises some fundamentalquestions on the impacts at the interconnect level and the performance ofthe power distribution network in general. This paper discusses the issueof current funneling into high density devices particularly around theadvent of multi-core processing and discusses some of the issues andeffects one may see as the technology moves forward into the future.Power Delivery for High Performance Processor Packages,Part IDavid Hockanson, Sun Microsystems, Inc.; and Joseph T.Dibene II, IntelCorporationThe continued reduction in processor core voltage, increases in currentrequired, and chip density and size place more pressure on effectivelycontrolling the impedance of a CPU power distribution system.Voltage fluctuations across the die limit functionality andspeed. The core-power path from the die to the voltage regulator isdiscussed herein. The path is separated into segments, and a onedimensionalcircuit model is created to aid in the discussion.©<strong>2007</strong> IEEE www.emc<strong>2007</strong>.org
EMC <strong>2007</strong> ADVANCE PROGRAM15Multi-Gigabit I/O Link Circuit Design Challenges andTechniquesJoe Wu, Intel Corporation; and Joseph T. DiBene, II, Intel CorporationThis paper describes the major challenges in designing multi-Gigabit I/O link CMOS circuits. Techniques to overcome thechallenges are presented, including transceiver design, discrete andcontinuous time equalization, termination control, and clockingcircuits.Get Ready For TheNext WaveIn EMI ReceiversIntegrated Circuit Architecture Impacts on ApplicationSignal IntegrityRoss Carlton, FreescaleIncreasing operational and data frequencies of integrated circuitsis making system design more costly and challenging as designerscope with signal integrity impacts. An understanding of thearchitecture and design of integrated circuit input/output circuitsand packaging technology can prevent undesired performancedegradation and maximize reliability. This presentation will discussa few of the aspects of IC and package design that impact signalintegrity.Early Time Charge Replenishment of the Power DeliveryNetwork in Multi-Layer PCBsGiuseppe Selli, University of Missouri-Rolla; Matteo Cocchini, University ofMissouri-Rolla; James Knighten, NCR Corporation; Bruce Archambeault,IBM Corporation; Jun Fan, NCR Corporation; Samuel Connor, IBMCorporation; Antonio Orlandi, University of L'Aquila; and JamesDrewniak, University of Missouri-RollaThe investigation of decoupling issues has been extensively treated inthe literature in both the frequency and the time domain. The twodomains describe from different perspectives the same physical phenomenon,being related by a Fourier transform. In this paper, wellknown decoupling issues usually addressed in the frequency domainare discussed in the time domain. Moreover, some modeling issuesrelated to the cavity model approach are discussed and, in particular,the circuit extraction feature associated with this methodology is utilizedthroughout the paper to carry out the time domain simulationswithin a SPICE based tool. The depletion of charges stored betweenthe power bus is investigated in the time domain as a function of theplane thickness, SMT decoupling closeness, and interconnect inductancevalues.SPECIAL SESSION: ELECTRONIC PACKAGING EMC ANDSIGNAL INTEGRITYNoise Isolation in LTCC-based X/Ku-band Transceiver SiPUsing a Double-Stacked Electromagnetic Bandgap StructureJongbae Park, Korea Advanced Institute of Science and Technology (KAIST);Junchul Kim, N/A; Albert Chee W. Lu, N/A; Yujeong Shim, KAIST; andJoungho Kim, KAISTWe experimentally investigate the isolation effect of the noisecoupling in an X/Ku-band transceiver SiP fabricated on a lowtemperatureco-fired-ceramic (LTCC) multilayer substrate, usinga double-stacked electromagnetic bandgap (DS-EBG) structure.The fabricated transceiver SiP is composed of a Ku-band transmitterand X/Ku-band receiver. To prevent the simultaneousswitching noise coupling from digital circuits, a DS-EBG structurewas designed and implemented to the transceiver SiP. Theeffect of the DS-EBG, which gives a 30 dB stopband over X/Kubandranges, was demonstrated through frequency and timedomain measurements.The CER2018 Compliant Emissions Receiveris here. And in many ways it’s unlike any receiver thatcame before it.This complete EMI test solution offers continuouscoverage from 20 Hz to 18 GHz with expandability to110 GHz. And to ensure the highest accuracy, itself-calibrates on-demand at every frequency scan.It includes a built-in computer that operates underWindows XP. Software is also included free along with a19” flat screen monitor, keyboard and mouse.Programmed-in test formats include CISPR 16-1-1,MIL-STD 461/462, ANSI C63 and FCC. Allfunctions are menu-driven. There is no need to fiddlewith switches, buttons or sliders.Like all AR products, the CER2018 is backed by thebest and most comprehensive warranty in the business.AR is here to help you – today, tomorrow and always.To learn more, visit us at www.ar-worldwide.comor for technical support: call 800-964-1424 (within U.S.)or 818-700-0330.receiver systemsOther ar divisions: rf/microwave instrumentation • modular rf • ar europeCopyright© <strong>2007</strong> AR. The orange stripe on AR products is Reg. U.S. Pat. & TM. Off.©<strong>2007</strong> IEEE www.emc<strong>2007</strong>.org
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