2007 ieee international symposium on electromagnetic compatibility

12EMC <strong>2007</strong> ADVANCE PROGRAMdecide whether a given component design is EMC sufficient. Thepurpose of this paper is to discuss and present a qualitative schemefor defining practical EMC design targets for the components of asystem for production purposes. This is a preliminary step inattempting to address this need, using a combination of commonsense, stand-alone component level emissions testing strategy, andperiodic design reviews of components during their design cycle.Uncertainty Analysis and Novel Test Procedures Performedwith a Real-Time Time-Domain EMI Measurement SystemStephan Braun; and Peter Russer, — Institute for High FrequencyEngineering (TU-Munich)Time-domain EMI measurement systems allow for the reduction ofthe measurement time by several orders of magnitude. In this papernovel test procedures for radiated emission measurements based on areal-time time-domain EMI measurement system are presented.Those test procedures take advantage of the parallel calculation of thespectrum at several thousand frequency bins. By a full maximizationprocedure, fully automated measurements can be performed. By anenhanced pre- and final scan, a test procedure is presented thatreduces test time by at least one order of magnitude. The proposedtest reduces the critical parameters that have to be selected by theoperator. Measurements have been performed in the frequency range30 MHz to 1 GHz and compared with the results obtained by anEMI receiver. The long term stability of the emission of a brushmotor is investigated. A measurement uncertainty analysis is basedon a reliable statistic of about 200,000 quasipeak values. The standarddeviation as well as the histogram of the probability densityfunction is calculated and evaluated.SIGNAL INTEGRITY INoise Isolation Modeling and Experimental Validation ofPower Distribution Network in Chip-PackageHyunjeong Park; Joungho Kim; and Changwook Yoon, — Korea AdvancedInstitute of Science and Technology (KAIST)This paper models a chip and package power distribution network inthe simplified SPICE-level. The model is successfully validated byexperiment using a Vector Network Analyzer. By using the SPICElevelmodel, the noise isolation between the noise current source atthe chip and power distribution network at the package is analyzedfrom 1 MHz to 3 GHz. The contribution of each part in the powerdistribution network is also analyzed by experiments. The transferimpedances are simulated and measured between the chip and packagepower distribution network varying with the wire-bond and theon package decoupling capacitor, case by case.Improvements of Time-Domain Transmission Waveform inSerpentine Delay Line with Guard TracesGuang-Hwa Shiue; Chia-Ying Chao; Wei-Da Guo; and Ruey-Beei Wu,— National Taiwan UniversityAs the signal frequency goes higher, the crosstalk noise has become themajor signal integrity concern for the design of various delay lines.Since the guard trace is increasingly adopted to alleviate the mutualcoupling effect in modern highspeed digital systems, this paper qualitativelyinvestigates its effects on the time-domain transmission (TDT)waveform and eye diagram of the serpentine delay line. Based onHSPICE simulation, it is demonstrated that the utilization of theguard traces can reduce the original TDT crosstalk level by more than50%, thereby greatly improving the eye opening and jitter. Finally,the time-domain measurement is also performed to validate the proposedanalyses.Multimodal Analysis of Guard TracesPablo Rodriguez-Cepeda; Miquel Ribó; Francisco-Javier Pajares; Joan-Ramon Regué; Albert-Miquel Sánchez; and Antonio Pérez, — EnginyeriaLa Salle - Universitat Ramon LlullIn this paper a new multimodal model, useful to analyze thebehavior of two signal lines separated by a guard trace, is presented.A multimodal point of view allows a simple interpretation ofthe phenomena involved in the coupling and transmission of signalspropagating through the three traces. Three guard trace configurationsare analyzed using the model and measured in order totest the adequacy of the multimodal approach. The results show agood agreement between the measurements and the model, therebyvalidating it.Stripline Simulation Model with Tapered Cross Section andConductor Surface ProfileAntonio Ciccomancini, CST of AmericaThis paper investigates the sensitivity of on wafer interconnect tothe Si CMOS process parameters. In particular the tapered (trapezoid)etching and the conductor surface profile (Rrms) of copper foilsare numerically analyzed in order to quantify their effect on the electricalperformance of a stripline structure. Line impedance, insertionloss, and time signal attenuation are evaluated by means ofthree dimensional (3-D) electromagnetic (EM) simulations. TheHammerstad and Jensen analytical model is implemented andresults are compared with those coming from the full 3-D EM simulationmodel. Good agreement in the frequency range 0 to 50 GHzis observed.An Improved Cavity Model for the Analysis of the VoltageBounce in Power-Bus StructuresGiulio Antonini, University of L’Aquila; Mauro Lai, Intel Corporation;and Todd Bermensolo, Intel CorporationThis paper presents an improved cavity model for the analysis of transientvoltage bounces in power / ground structures. Firstly, accuratemodels from DC to the maximum frequency of interest are adoptedto describe conductor and dielectric losses; and secondly, the VectorFitting technique is used to generate a rational model which is convertedin a state-space macromodel, well suited for transient analysis.The numerical results demonstrate the high efficiency and good accuracyof the proposed method.Power and Signal Integrity and Electromagnetic Emission:The Balancing Act of Decoupling, Planes and TracksFrank Leferink, Thales NederlandThe noise voltage in the reference or ground of a printed circuitboard is often the cause of unwanted radiated emission. Powersupply planes attribute to the noise voltage. By replacing thepower supply planes with tracks, the noise voltage in the referenceor ground can be considerably reduced, which leads to a dramaticreduction of the radiated electromagnetic fields. This has beenshown using transmission line equations for a general two-conductorline. Simulation and measurements results confirm the beneficialeffect of removing power planes. A reduction of 50 dB inradiated electromagnetic field strength was obtained. The questionwas raised whether (or not) the signal integrity is negativelyinfluenced by using power tracks instead of planes. Several printedcircuit boards have been built and measured, showing that signalintegrity remains while reduction of radiated emission isachieved.©<strong>2007</strong> IEEE www.emc<strong>2007</strong>.org