ATxmega128A3U-MHR - E-LAB Computers

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36.1.5 I/O Pin CharacteristicsThe I/O pins comply with the JEDEC LVTTL and LVCMOS specification and the high- and low level input and outputvoltage limits reflect or exceed this specification.Table 36-7.I/O pin characteristics.Symbol Parameter Condition Min. Typ. Max. UnitsI OH (1) /I OL(2)I/O pin source/sink current -20 20 mAV CC = 2.7 - 3.6V 2 V CC +0.3V IHHigh Level Input VoltageV CC = 2.0 - 2.7V 0.7*V CC V CC +0.3VV CC = 1.6 - 2.0V 0.8*V CC V CC +0.3V CC = 2.7- 3.6V -0.3 0.8V ILLow Level Input VoltageV CC = 2.0 - 2.7V -0.3 0.3*V CCVV CC = 1.6 - 2.0V -0.3 0.2*V CCV OHHigh Level Output VoltageI = -1mA 2.0 0.96*VV = 2.3 - 2.7VI = -2mA 1.7 0.92*VV CC = 3.0 - 3.6VCCI OH = -2mAOHOH2.4 0.94*V CCCCCCVV CC = 3.3V I OH = -8mA 2.6 2.9V CC = 3.0V I OH = -6mA 2.1 2.6V CC = 1.8V I OH = -2mA 1.4 1.6V CC = 3.0 - 3.6V I OL = 2mA 0.05*V CC 0.4V OLLow Level Output VoltageI OL = 1mA 0.03*V CC 0.4V CC = 2.3 - 2.7VI OL = 2mA 0.06*V CC 0.7V CC = 3.3V I OL = 15mA 0.4 0.76VV CC = 3.0V I OL = 10mA 0.3 0.64V CC = 1.8V I OL = 5mA 0.3 0.46I IN Input Leakage Current T = 25°C
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Features8/16-bit Atmel XMEGA A3U Mi
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3. OverviewThe Atmel AVR XMEGA is a
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4. ResourcesA comprehensive set of
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The arithmetic logic unit (ALU) sup
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Six of the 32 registers can be used
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7.3.4 Production Signature RowThe p
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7.8 Data Memory and Bus Arbitration
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8. DMAC - Direct Memory Access Cont
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Figure 9-1.Event system overview an
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Figure 10-1. The clock system, cloc
Page 22 and 23: 11. Power Management and Sleep Mode
Page 24 and 25: 12. System Control and Reset12.1 Fe
Page 26 and 27: 13. WDT - Watchdog Timer13.1 Featur
Page 28 and 29: Program address(base address) Sourc
Page 30 and 31: 15.3.1 Push-pullFigure 15-1. I/O co
Page 32 and 33: 15.4 Input sensingInput sensing is
Page 34 and 35: Only Timer/Counter 0 has the split
Page 36 and 37: 18. AWeX - Advanced Waveform Extens
Page 38 and 39: 20. RTC - 16-bit Real-Time Counter2
Page 40 and 41: Multipacket transfer enables a data
Page 42 and 43: 23. SPI - Serial Peripheral Interfa
Page 44 and 45: 25. IRCOM - IR Communication Module
Page 46 and 47: 28. ADC - 12-bit Analog to Digital
Page 48 and 49: 29. DAC - 12-bit Digital to Analog
Page 50 and 51: 30. AC - Analog Comparator30.1 Feat
Page 52 and 53: 31. Programming and Debugging31.1 F
Page 54 and 55: TXDnSSMOSIMISOSCKTransmitter Data f
Page 56 and 57: Table 32-3.Port C - alternate funct
Page 58 and 59: 33. Peripheral Module Address MapTh
Page 60 and 61: 34. Instruction Set SummaryMnemonic
Page 63 and 64: Mnemonics Operands Description Oper
Page 65 and 66: 35. Packaging information35.1 64API
Page 67 and 68: 36. Electrical CharacteristicsAll t
Page 69 and 70: 36.1.3 Current consumptionTable 36-
Page 71: 36.1.4 Wake-up time from sleep mode
Page 78 and 79: 36.1.11 External Reset Characterist
Page 80 and 81: 36.1.14.3 Calibrated and tunable 32
Page 82 and 83: Table 36-28. External clock with pr
Page 84 and 85: 36.1.14.8 External 32.768kHz crysta
Page 86 and 87: Table 36-31. SPI timing characteris
Page 88 and 89: Symbol Parameter Condition Min. Typ
Page 90 and 91: Figure 36-8. Maximum Frequency vs.
Page 92 and 93: Table 36-37. Current consumption fo
Page 94 and 95: 36.2.5 I/O Pin CharacteristicsThe I
Page 96 and 97: Table 36-42. Accuracy characteristi
Page 100 and 101: 36.2.11 External Reset Characterist
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Page 104 and 105: Table 36-60. External clock with pr
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Page 108 and 109: Table 36-63. SPI timing characteris
Page 110 and 111: Symbol Parameter Condition Min. Typ
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Page 114 and 115: Table 36-69. Current consumption fo
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36.3.11 External Reset Characterist
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36.3.14.3 Calibrated and tunable 32
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Table 36-92. External clock with pr
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36.3.14.8 External 32.768kHz crysta
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Table 36-95. SPI timing characteris
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Symbol Parameter Condition Min. Typ
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Figure 36-22.Maximum Frequency vs.
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Table 36-101.Current consumption fo
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36.4.5 I/O Pin CharacteristicsThe I
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Table 36-106.Accuracy characteristi
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Table 36-110.Accuracy characteristi
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36.4.11 External Reset Characterist
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36.4.14.3 Calibrated and tunable 32
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Table 36-124.External clock with pr
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36.4.14.8 External 32.768kHz crysta
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Table 36-127.SPI timing characteris
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Symbol Parameter Condition Min. Typ
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Figure 37-3. Active mode supply cur
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Figure 37-7. Active mode supply cur
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Figure 37-11. Idle mode supply curr
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37.1.1.3 Power-down mode supply cur
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Figure 37-19. Standby supply curren
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37.1.2.2 Output Voltage vs. Sink/So
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Figure 37-27. I/O pin output voltag
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37.1.2.3 Thresholds and HysteresisF
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37.1.3 ADC CharacteristicsFigure 37
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Figure 37-39. DNL error vs. sample
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Figure 37-43. Offset error vs. V RE
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Figure 37-47. Noise vs. V CC .T = 2
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37.1.5 Analog Comparator Characteri
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Figure 37-55. Analog comparator cur
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37.1.7 BOD CharacteristicsFigure 37
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Figure 37-63. Reset pin pull-up res
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37.1.9 Power-on Reset Characteristi
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Figure 37-70. 32.768kHz internal os
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37.1.10.4 32MHz Internal Oscillator
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37.1.10.5 32MHz internal oscillator
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Figure 37-82. SDA hold time vs. sup
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Figure 37-86. Active mode supply cu
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Figure 37-90. Active mode supply cu
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Figure 37-94. Idle mode supply curr
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Figure 37-102. Standby supply curre
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Figure 37-110. I/O pin output volta
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Figure 37-126. Offset error vs. V R
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Figure 37-130. Noise vs. V CC .T =
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Figure 37-138. Analog comparator cu
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Figure 37-146. Reset pin pull-up re
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Figure 37-153. 32.768kHz internal o
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Figure 37-165. SDA hold time vs. su
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Figure 37-169. Active mode supply c
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Figure 37-177. Idle mode supply cur
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Figure 37-260. Idle mode supply cur
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39. Datasheet Revision HistoryPleas
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Table of ContentsFeatures . . . . .
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22.2 Overview . . . . . . . . . . .
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Atmel Corporation1600 Technology Dr
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