ATxmega128A3U-MHR - E-LAB Computers

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1. Ordering InformationOrdering codeFlash (bytes)EEPROM(bytes)SRAM(bytes)Speed (MHz)PowersupplyPackage(1)(2)(3)Temp.ATxmega256A3U-AU 256K + 8K 4K 16KATxmega256A3U-AUR (4) 256K + 8K 4K 16KATxmega192A3U-AU 192K + 8K 2K 16KATxmega192A3U-AUR (4) 192K + 8K 2K 16KATxmega128A3U-AU 128K + 8K 2K 8K64AATxmega128A3U-AUR (4) 128K + 8K 2K 8KATxmega64A3U-AU 64K + 4K 2K 4KATxmega64A3U-AUR (4) 64K + 4K 2K 4KATxmega256A3U-MH 256K + 8K 4K 16KATxmega256A3U-MHR (4) 256K + 8K 4K 16KATxmega192A3U-MH 192K + 8K 2K 16K32 1.6 - 3.6V-40C - 85CATxmega192A3U-MHR (4) 192K + 8K 2K 16KATxmega128A3U-MH 128K + 8K 2K 8K64M2ATxmega128A3U-MHR (4) 128K + 8K 2K 8KATxmega64A3U-MH 64K + 4K 2K 4KATxmega64A3U-MHR (4) 64K + 4K 2K 4KNotes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information.2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.3. For packaging information, see “Packaging information” on page 65.4. Tape and Reel.Package Type64A64M264-lead, 14 x 14mm body size, 1.0mm body thickness, 0.8mm lead pitch, thin profile plastic quad flat package (TQFP)64-pad, 9 x 9 x 1.0mm body, lead pitch 0.50mm, 7.65mm exposed pad, quad flat no-lead package (QFN)Typical ApplicationsIndustrial control Climate control Low power battery applicationsFactory automation RF and ZigBee ® Power toolsBuilding control USB connectivity HVACBoard control Sensor control Utility meteringWhite goods Optical Medical applicationsXMEGA A3U [DATASHEET]8386C–AVR–02/20132
Page 1: Features8/16-bit Atmel XMEGA A3U Mi
Page 5 and 6: 3.1 Block DiagramFigure 3-1.XMEGA A
Page 7 and 8: 6. AVR CPU6.1 Features• 8/16-bit,
Page 9 and 10: 6.5 Program FlowAfter reset, the CP
Page 11 and 12: 7.3 Flash Program MemoryThe Atmel A
Page 13 and 14: Table 7-3.Data memory map (Hexadeci
Page 15 and 16: Table 7-5.Number of bytes and pages
Page 17 and 18: 9. Event System9.1 Features• Syst
Page 19 and 20: 10. System Clock and Clock options1
Page 21 and 22: 1kHz output. The oscillator is auto
Page 23 and 24: 11.3.3 Power-save ModePower-save mo
Page 25 and 26: 12.4.2 Brownout DetectionThe on-chi
Page 27 and 28: 14. Interrupts and Programmable Mul
Page 29 and 30: 15. I/O Ports15.1 Features• 50 ge
Page 31 and 32: Figure 15-4. I/O configuration - To
Page 33 and 34: 16. TC0/1 - 16-bit Timer/Counter Ty
Page 35 and 36: 17. TC2 - Timer/Counter Type 217.1
Page 37 and 38: 19. Hi-Res - High Resolution Extens
Page 39 and 40: 21. USB - Universal Serial Bus Inte
Page 41 and 42: 22. TWI - Two-Wire Interface22.1 Fe
Page 43 and 44: 24. USART24.1 Features• Seven ide
Page 45 and 46: 27. CRC - Cyclic Redundancy Check G
Page 47 and 48: Figure 28-1. ADC overview.ADC0•AD
Page 49 and 50: The DAC has high drive strength, an
Page 51 and 52: Figure 30-1. Analog comparator over
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32. Pinout and Pin FunctionsThe dev
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32.2 Alternate Pin FunctionsThe tab
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Table 32-5.Port E - alternate funct
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Base address Name Description0x04A0
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Mnemonics Operands Description Oper
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Mnemonics Operands Description Oper
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35.2 64M2DMarked Pin# 1 IDECSEATING
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Table 36-3.Operating voltage and fr
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Table 36-5.Current consumption for
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36.1.5 I/O Pin CharacteristicsThe I
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36.1.11 External Reset Characterist
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36.1.14.3 Calibrated and tunable 32
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Table 36-28. External clock with pr
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36.1.14.8 External 32.768kHz crysta
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Table 36-31. SPI timing characteris
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Symbol Parameter Condition Min. Typ
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Figure 36-8. Maximum Frequency vs.
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Table 36-37. Current consumption fo
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Table 36-42. Accuracy characteristi
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Figure 36-15.Maximum Frequency vs.
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Table 36-69. Current consumption fo
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Figure 36-22.Maximum Frequency vs.
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Table 36-101.Current consumption fo
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Table 36-106.Accuracy characteristi
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Table 36-110.Accuracy characteristi
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Table 36-124.External clock with pr
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Table 36-127.SPI timing characteris
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Figure 37-3. Active mode supply cur
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Figure 37-7. Active mode supply cur
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Figure 37-11. Idle mode supply curr
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37.1.1.3 Power-down mode supply cur
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Figure 37-19. Standby supply curren
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37.1.2.2 Output Voltage vs. Sink/So
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Figure 37-27. I/O pin output voltag
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37.1.2.3 Thresholds and HysteresisF
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37.1.3 ADC CharacteristicsFigure 37
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Figure 37-39. DNL error vs. sample
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Figure 37-43. Offset error vs. V RE
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Figure 37-47. Noise vs. V CC .T = 2
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37.1.5 Analog Comparator Characteri
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Figure 37-55. Analog comparator cur
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37.1.7 BOD CharacteristicsFigure 37
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Figure 37-63. Reset pin pull-up res
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37.1.9 Power-on Reset Characteristi
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Figure 37-70. 32.768kHz internal os
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37.1.10.4 32MHz Internal Oscillator
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37.1.10.5 32MHz internal oscillator
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Figure 37-82. SDA hold time vs. sup
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Figure 37-86. Active mode supply cu
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Figure 37-90. Active mode supply cu
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Figure 37-94. Idle mode supply curr
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Figure 37-102. Standby supply curre
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Figure 37-110. I/O pin output volta
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Figure 37-126. Offset error vs. V R
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Figure 37-130. Noise vs. V CC .T =
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Figure 37-138. Analog comparator cu
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Figure 37-146. Reset pin pull-up re
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Figure 37-153. 32.768kHz internal o
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Figure 37-165. SDA hold time vs. su
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Figure 37-169. Active mode supply c
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Figure 37-177. Idle mode supply cur
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Figure 37-260. Idle mode supply cur
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39. Datasheet Revision HistoryPleas
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Table of ContentsFeatures . . . . .
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22.2 Overview . . . . . . . . . . .
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Atmel Corporation1600 Technology Dr
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