evaluation of stencil foil materials, suppliers and ... - IPC Outlook
evaluation of stencil foil materials, suppliers and ... - IPC Outlook
evaluation of stencil foil materials, suppliers and ... - IPC Outlook
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As originally published in the SMTA International Conference Proceedings.Each <strong>of</strong> these metrics can be applied to the <strong>stencil</strong> printingprocess to characterize the relationship between processinputs <strong>and</strong> outputs. In the following study, they are used toselect the best <strong>stencil</strong> options for a high volume, productionoperation.EXPERIMENTAL SETUPTest VehicleTest VehicleFigure 1. Test Vehicle (non-BGA circuitry on closeup isintentionally blurred)The PCB shown in fig 1 is a typical high-volume productionproduct. Each 32-up array measures approximately 3x7inches, <strong>and</strong> has nearly 15,000 SMT pads. Of the 14,468pads, roughly 8500 are mask-defined (SMD) BGA pads <strong>and</strong>1900 are metal-defined (NSMD) 0201 pads. The same set<strong>of</strong> 10 PCBs were used for all tests.Suppliers A & D applied the coating at their sites, prior toshipping the <strong>stencil</strong>s. The same coating product was appliedto <strong>stencil</strong>s provided by <strong>suppliers</strong> B & C after arriving at theVicor facility.Test MatrixFour <strong>suppliers</strong>, coded A-D, submitted <strong>stencil</strong>s in a variety <strong>of</strong>configurations. Materials, coded 1-5, included: Electr<strong>of</strong>ormed <strong>stencil</strong>s (#1) Electr<strong>of</strong>ormed nickel <strong>foil</strong>s that were laser cut (#2) St<strong>and</strong>ard 301SS (#5) 304SS designed for laser cutting (#3) 301SS with modified grain size (#4)Thicknesses <strong>of</strong> the <strong>foil</strong>s included 0.0045” <strong>and</strong> 0.004”. Thecurrent production st<strong>and</strong>ard is 0.0045” laser cut nickel <strong>foil</strong>s.0.004” is under consideration because the preferred 0.0045”is not available in rolled steel.Electropolished <strong>stencil</strong>s were not tested in this <strong>evaluation</strong>,because not all <strong>suppliers</strong> provide electropolishing capability,<strong>and</strong> while electropolised apertures have been reported torelease higher volumes <strong>of</strong> paste due to their roundedcorners, 2 they have also reported to produce higher rates <strong>of</strong>variation in volume consistency. 3For each <strong>stencil</strong>, 10 prints were taken, providing roughly85,000 BGA paste deposit measurements <strong>and</strong> 19,000 0201deposit measurements. The test prints were producedsequentially on a well maintained <strong>and</strong> calibrated 2009 DEKhorizon <strong>stencil</strong> printer using, both front-to-back <strong>and</strong> backto-frontsqueegee strokes, with an automatic dry wipe aftereach print. Print parameters were: Print speed: 15 mm/sec Print pressure: 5 kg (250mm blades) Separation speed: 20mm/secThe solder paste used in all tests was Indium 3.2 HF Type 3,water soluble, lead-free, halogen-free, lot # 37310. Freshpaste was used on each <strong>stencil</strong>. The paste was not kneaded;2 dummy prints were produced before measurements weretaken. The 27 <strong>stencil</strong>s were print tested in a climatecontrolled NPI manufacturing area over 5 different runs.During the tests the climate ranged from 23.0 to 25.5 o C, <strong>and</strong>relative humidity ranged from 32.9 to 46.9%.The PCB was supported with a flat, non-vacuum toolingplate <strong>and</strong> edge clamps. Deposit volume measurements weretaken with a Koh Young 3030VAL.StencilsEach supplier was invited to submit <strong>stencil</strong>s in pairs. One<strong>stencil</strong> was printed in the as-received condition; the otherhad a hydrophobic nanocoating applied before printing.