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ELECTRONICSPurified GraphiteSilicon Carbide Graphite EnhancementInnovative solutions for theSemiconductor Industry

For your wafer quality get ourUltra High PurityMersen offers to OEM and electronic component makers an innovative and wide rangeof smart and cost effective high temperature graphite based solutions. Above all, Mersenprovides the lowest level of elemental contamination with its 99.9995% purified grades andallows its customers to manufacture and to process defect free materials and components.Purity Ash content (ppm)Al B Fe CA Cu Mg Ni Ti V Si Pb Sn Mo W Zn Cr TotalUnpurified 1 2 31 51 1 1 74 22 95 5 1 1 1 1 1 2 300< 20 ppm 0,5

From semiconductormaterial makingApplicationexamplesPolysilicon reactorsCrystal growing furnace equipmentProductsRequiredfunctionsPolysilicon Polysilicon Crucible holder for Resistors & spill trays Heatshields ThermalHeat exchanger chucks Si SiGe AsGa InP Crystals, insulationCaF 2 and othersGet the widest Prevent Contain hot melt and Reduce number Lower thermal Substitute dustyrange of proven arcing in gaps guarantee security of mechanical parts inertia and felts, and graphitesolutions on the field of operations for have goodGrow 300 mm ingots Save space supports to Shape in conicIncrease lifetime homogeneous heavy loads and cylindrical formand resistance layers of polysilicon Upgrade growers and Radiate heat evenlyto corrosion increase pulled mass Increase Provide a goodLower contact Slow SiC conversion and chemical inertia thermal radiationresistance Lower heat up and increase lifetime and lifetime and thermalcool down timeconduction barrierGet theAvoid hot spotsrequired resistivity Target below 1 ppm Adapt to inductiveof polycrystal impurities content Lessen electrical contact furnacesresistance and reducemalfunctionsStop dustSolutionsBestChoiceBestValueAt low temperature Soft material, High FS and appropriate Medium FS to allow for High FS: Papyex ® WPTXimpregnated very low CTE CTE to resist stress flexibility of assembly. C/C aerolor is a rigid felt,grades are of SiC conversion, 1 long resistor instead A 252 being formed tohighly recommended High Thermal Light and strong material of too many small ones: size to make conicconductivity along C/C materials C/C aerolor A252 Medium or cylindrical shapesAt high temperature, grain for cooling conductivityimpervious SiC coating Medium to high Ultrasonic control Papyex ® preventsup to 1,500°C Large grains conductivity graphite to ensure homogeneity CVD inert heat radiationincreases lifetime with lubricating C/C materials to of material and hence pyrographite while RVG 4000properties reduce wall thickness thermal performance impregnation felt preventson A252heat conductionHighly purified Diminish reactive SiC coating reducesmaterial 5 ppm area, low pore size, permeability of material A252 Papyex ® externallow porosity. composite layering preventsGrade Optimized by material features dusting2191 Below 5 ppm for computer simulation below 2 ppmstandard graphite grades, ash content Purified underbelow 2 ppm for CC Medium to high halogen gas flowAerolor components resistivity to lower A252 C/C at high temperaturethickness embodied material achieves lower thanGrades 2123, current collector in C/C 2020, 2450 5 ppm ash content2020, 2450 SiC coatingAEROLOR 2.5D C/C Below 20 ppm typical purity Flexible GraphitePapyex ®2020 Rigid carbon thermalSiC coatinginsulation2 m high C/C cylinders CALCARB ®and ISOLOR ®High Temperaturemechanical interfaceFlexural Strength(FS), TensileStrength (TS)density d, grainsize (µm) cœfficientof thermalexpansion (CTE)Thermal transferThermalConductivity λElectrical conductorResistivity ρor conductivity σContaminant freeAsh content (ppmweight)Best choice bestvalue3Chemical inertiaCoating thickness,Pore diameter

... to wafer processingApplicationexamplesProductsRequiredfunctionsWafer processing Dry Ion Packaging Electronic ContaminantCVD & Epitaxy Etching Implanting Tubes analysisBarrels and pancakes Electrodes Beam line Tools: jigs, brazing Electrodes Gas ContainersSingle wafer susceptorscomponents or sealing assemblies anode for Xray analyzing and labfor semiconductors targets crucibles accessoriesMOCVD equipmentand connectorsCompound growthAvoid peeling off Resist ablation Resist thermal shock Adapt glass or other Withstand Contain Alternativeand ensure coating material thermal expansion centrifugal force, hot melts to platinumon all surface Use under Spread out energy crucibleshigh voltage of beam impact Withstand wear Provide good NoAchieve the best match with wetting Resistlaminar gas Ablation resistant Even thermal gradients tungsten layer from most offlow pattern metals etchantsGround perfectly Increase lifetime Radiate stored and acidsGuanrantee eveness heat in vacuum Effectiveof thermal profile Faster pump down Provide a reliable resistive Nothermal resistance Be inert heating undesiredPrevent any No particle release Under Vacuum reactionscontamination or under beam impact Guarantee required Reliableimpurities diffusion electrical insulation To achieve and measurekeep reliablePerform radiativehigh vacuumor inductive processLower contaminationSolutionsBestChoiceBestValueCTE match between High density Shock resistant grade Adapted CTE: High FS Large grains No opengraphite and SIC grades, pyrocoat i.e. low Young modulus, high density grade porositygraphite precision or bulk low CTE, high High thermal Medium tomachining pyrographite conductivity, high FS High thermal conductivity conductivity high resistivity Purification toeradicateCoating emissivity Medium Very high conductivity Purification removes Low resistivity Highest purity oxidationand graphite conductivity oxidation catalysts up to 2 ppm catalystshomogeneity Fine grain, high Lower porosityHigh thermal Fine grain and density grade. Medium resistivity for Outgased grade 2191 Glassyconductivity required low porosity resistive heating: as an option carbonVery low resistivity resistance tuned Below 20 ppmImpervious SIC coating Low to medium by fine hole drillingresistivity Vitreous impregnation 2123, 2120,Tuned resistivity close porosity Reduce dust or 2320Below 20 ppm to trap dust electrically conductiveCoating and graphitetraces on glassgrades meet 20 ppm 2120, 2123 2120, 2340criteria. Specific grid pyrocoating Vitreous impregnation 2120, 2318,…patterns engineered bulk pyrographiteto avoid contamination Glassy carbonSiC coating4

fundamental reasons for you to get thsolution:1OEM and electronic component makers have 6 good fundamental reasons to order Mersengraphite based products for their High Temperature applications:When most of refractory metals contaminate and collapse at high temperatures, Mersen’s quality graphite, asthe most refractory natural element, stands mechanically in high temperature processes.RelativescaleGraphite a strong materialSpecific flexural Strength(Mpa kg/m 3 vs temperature)CGraphite a light refractory material10Refractory AlloyPyCAl203Ti5MoSiCGraphiteSteelMo101000Mg0C W2000 3000 0g/cm 35 10 15 20Mersen graphite compounds, with their steady and reliable behavior versus temperature, interfaceideally to dimensional requirements.CopperIronKovarMoGlassWCarbonGraphiteMersen wide range of thermal expansioncoefficients meet most interfacerequirements0 2 4 6 8 10 12 14 16 1810 -6 /C+100%+50%0%-50%Graphite materials typical main characteristicsvariation versus temperature to roomtemperature propertiesThermal expansion-100%0 500 1000ResistivityThermal conductivityMechanicalstrength1500 2000 2500 3000Mersen knows how to tune graphite performance to the heaviest thermal shocks, whilechoosing the adequate blend of powders, as well as the suitable process to create themost adequate microstructure.To shorten customer’s process time, Mersen features a range of special light and stronggraphite and Carbon-Carbon (C/C) products, lowering mass to be heated and then cuttingheat up and cool downtime.5

e best value from the best2Mersenputs chemical reactions with its graphite and C/C product range under control:for any given environment at high temperature, with the most aggressive etchants,Mersen offers the best grades and provides exceptional lifetime to its customers, at thelowest cost of ownership.Resistance to oxidation can be drastically increased with optimal treatments and coatings,modifying permeability up to desired tightness.Graphite Impregnated Vitreous SiC Glassy Pyrocarbon Solidgraphite impregnation coating Carbon coating PyrocarbonPermeabilitycm 2 /s 10 -1 10 -2 10 -3 10 -5 10 -11 10 -12 10 -123Mastering thermal transfer is key to high temperature processing: Mersen’s highquality and homogeneous graphite based products ensure the most even thermal profile.From thermal transfer to thermal insulation, Mersen provides engineering resources tohelp customers simulate and design the best solution to perform the desired function.Comparison of thermal conductivitiesThermal conductivityW/m/°C0 20 40 60 80 100 120 140CopperTi2191202029107785116Al2114104Graphite2123112Iron2320245085122Al2032120106Steel2318 810 100 200 300 400W/m/C2340 102Grades4Mersen materials connect electrically in your systems to secure the mostreliable grounding, to create the highest accelerating power or the mostefficient resistive or inductive heating. Selection of purified iso-molded gradeswith the correct microstructure guarantees a safe electrical contact.56Most of the functions offered by Mersen graphite based products have ahigh service to value ratio. They are a cost effective solution comparedto most refractory metals. Easier to machine, these graphite materials areproduced by the worldwide leader Mersen, in large quantities, througha lean organization at the lowest cost, according to the highest qualitystandards.Mersen is a worldwide group, and is a local partner to every customer.Its affiliates provide close service and quick delivery to every customerthroughout the world.The information contained in this brochure is given for information purposes only, and does not commit Mersen in any way whatsoever. This document shall not becopied, reproduced or translated in whole or in part without Mersen’s written permission.Data herein contained are provided for general information purpose only and are not binding. Mersen shall have no liability whatsoever with respect to informationcontained herein. Duplication, reproduction or translation of any information contained herein, in whole or in part, is strictly prohibited without prior written consentof Mersen.Our materials are in conformity with the RoHS-Directive (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment). BesidesMersen guarantees the application of the European CommunityREACH-Regulation (Registration, Evaluation, Authorization and Restriction of Chemical substances) to all its plants located in Europe.6

A wide range of high purityproductsPurified graphiteGrade Density Grain size Porosity FS CTE, Resistivity Thermalmicron % (MPa) 10 -6 °C -1 µ Ω cm conductivity Standard Max. Size* mmW/m°C2191 1.75 15 12 44 4.2 1090 116 540x540x18302020 1.77 15 9 45 4.3 1550 85 530x635x18301030x1080x325ø 610x1830ø 915x760ø 1500 on request2910 1.74 30 17 30 4.1 1600 77 ø 640x18302114 1.81 13 10 52 5.3 1240 104 308x620x9152123 1.84 13 8 58 5.5 1140 112 308x620x9152320 1.82 13 10 50 5.0 1060 122 308x620x9152450 1.86 15 8 45 4.3 1550 85 on request2120 1.84 8 7 65 6.0 1220 106 308x620x9152318 1.86 5 6 76 5.7 1600 81 152x308x6202340 1.88 4 13 90 7.2 1270 102 305x305x100SpecialtiesVitreous carbon impregnationReference T max Depth of impregnationVCI 450 °C (under O 2 atmosphere) - 2800 °C (inert) > 6 mmGlassy carbonReference Density Open porosity CTE SizeV25 1.45 0 2810 -6 limited to 3 mm wall thicknessPyrocoating and bulk pyrocarbonReference Density Open Thermalporosity conductivityCARBOGRAF ® 400XY direction2.05 ~ 0 %PYC Coating300 - 5007* ask for specific sizeSilicon Carbide coatingReference T max Density Open Rf (MPa) CTE Coating thickness Hardness Youngporosity 10 -6 °C -1 modulus GPaCARBOSIL 1700 °C 3.2 impervious to 350 4.8 50-250 µm 2280 63most gases and2950 KnoopliquidsCARBOGRAF ® 430 Z direction 7PYC BulkCarbon / Carbon AEROLOR ®Reference Density FS (MPa) Flexural modulus (GPa) Maximum SizeA252 1.70 100 10 Tube length 3000 mmRing ø 2200 mmRigid carbon insulation CALCARB ®Reference Density Thermal conductivity at 400°C (W/m°C) Thermal conductivity at 2,000°C (W/m°C) Max. sizeCBCF 18-2000 0.18 0.25 (Vacuum) 1.00 (Vacuum) 1,500 x 1,500 x 160 mmFlexible graphiteReference Thickness mm Width Density Emissivity CoefficientPAPYEX ® 0.5 to 1.5 1000 mm 1.0 0.74

Holytown, Scotland UKChongqing, ChinaSt-Marys, USAGennevilliers, FranceMain production sitesIndustrial or commercial branchA WORLD EXPERTin materials and solutionsfor high temperature processesGlobal expert in materials and solutions for extremeenvironments as well as in the safety and reliabilityof electrical equipment Mersen designs innovativesolutions to address its clients specificA GLOBAL PLAYERneeds to enable them to optimize their manufacturingprocess in sectors such as energy, transportation,electronics, chemical, pharmaceutical and processindustries.Contact in North AmericaMERSEN USA BN Corp.Bay City Branch,900 Harrison StreetBay City, MI 48708, USATel.: +1 989 894 29 11Fax: +1 989 895 77 40Contact for EuropeMERSEN France Gennevilliers SAS41 rue Jean Jaurès - BP 148F-92231 GENNEVILLIERS CEDEXFRANCETel.: +33 (0)1 41 85 45 77Fax: +33 (0)1 41 85 45 11E-mail: semicon@mersen.comContact for AsiaMERSEN Kunshan Co. Ltd.#29 South Taihu Road,Kunshan Development Zone,Kunshan, Jiangsu Province,215334, PR CHINATel.: +86 512 5763 9808Fax: +86 512 5763 9811HT25 GB 0111www.mersen.com