An Improved VLSI Test Economics Analysis System - Laboratory for ...

2.4.4 Manufacturing CostManufacturing cost means cost per chip during manufacturing phase. This cost consists ofnon-recurring part and recurring part. As shown in Section 2.4.2, the manufacturing costcan be estimated as (2.22). For simplicity, it is assumed that our company is a design house.Designs are sent to foundry for manufacturing. Therefore, we don't need to consider detailedcost in factory. Manufacturing cost can be express asCm = C mask =N v + U die + U pack + Km; (2.35)where C mask is mask cost, U die is cost per die, U pack is package cost of each chip, and Km isuser dened manufacturing cost.Die cost can be estimated from wafer cost (U wafer ) and number of good dies per wafer(n g ).Let Y be the estimated yield, d be the wafer diameter, and util be the utilization of wafer,then, number of good dies per wafer can be calculated as util (d=2) 2n g = Y : (2.36)AThus, die cost can be estimated asU die = U wafer =n g = 4AU wafer util d 2 Y(2.37)Although package cost primary depends on the package type, the more chip pins thehigher pin density package type is needed. Therefore, the package cost can be modeled asU pack = p + pp P; (2.38)where p and pp need to be estimated from exact cost and pins per package type.2.4.5 Testing CostGeneral test process includes wafer test, pre-burn-in test, and nal test. Thus, our testingcost is estimated asCt = Ct w + Ct p + Ct f + Kt; (2.39)where Ct w , Ct p , and Ct ftesting cost.is cost of wafer, pre-burn-in , and nal test. Kt is user dened24