High Speed Digital - SMTA

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Relative PriceMid-Loss CAF ResistanceGeneration 1 Generation 2 Generation 3Comp #3 w/Low Dk GlassComp #4Comp #3Comp #2Theta(MCL-HE-679G)LegacyModifiedEpoxy0.94 mmWall-to Wall Space0.78 mmWall-to Wall Space≤ 0.48 mmWall-to-Wall Space
Product Line PropertiesMid Loss Low Loss Ultra-Low LossPropertiesUnitsTheta(MCL-HE-679G)(MCL-FX-2)Under DevelopmentMaterial Type Halogen-Free Mid-Loss Low LossUltra LowLoss LamUltra LowLoss Bond PlyDk @ 1GHz 3.90 – 4.10 3.30 - 3.40 3.02 2.94Df @ 1GHz 0.008 – 0.010 0.002 - 0.003 0.0016 0.003Tg (TMA) °C 180 – 190 175 – 185 - 170Tg (DMA) °C 210 – 220 210 - 220CTE Z (< Tg) ppm/°C 35 - 45 48 - 55 58 50CTE Z (> Tg) ppm/°C 190 – 220 80 – 130UL Flammability UL-94 V-0 V-0 V-0 -IPC4101C Slash Sheet /127, /128/, /130 /102
Page 6 and 7: Market SegmentationIPInfrastructure
Page 11: Relative PriceMid-Loss Lead-Free As
Page 15 and 16: Product Line PropertiesMid Loss Low
Page 17 and 18: CAF Failure Mode• Dendritic failu
Page 19 and 20: CAF Test Results (Two Glass Supplie
Page 21 and 22: Theta(MCL-HE-679G)
Page 23 and 24: Product OverviewFeaturesHalogen Fre
Page 25 and 26: Transmission Line Characterization3
Page 27 and 28: Laminate Electrical Properties
Page 29 and 30: APPLICATIONS
Page 31 and 32: 26-Layer PCB TV26-Layer Server Clas
Page 33 and 34: 18-Layer, 3+N+3 IST OEM Coupon (Adv
Page 35 and 36: Eye Brow Crack Test VehicleThermal
Page 37 and 38: 1+N+1 Blind-Buried Stacked Microvia
Page 39 and 40: Processing• Prepreg Shelf-Life/St
Page 41 and 42: Lamination Process of HE-679GLamina
Page 43 and 44: Desmearing processDesmearProcessChe
Page 45 and 46: FX-2
Page 47 and 48: Product OverviewFeaturesHigh Tg (17
Page 49 and 50: Product Line-Up of GFA-2 (Prepreg)P
Page 51 and 52: SPP methodShort Pulse Propagation (
Page 53 and 54: Heat resistance of high layer count
Page 55 and 56: Thermal AnalysisTest Description Un
Page 57 and 58: Emerging Market Needs• We are see

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