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BUILDING ON THE PAST, READY FOR THE FUTURE: - MEMC

BUILDING ON THE PAST, READY FOR THE FUTURE: - MEMC

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diameter silicon wafers. We will also begin<br />

building for the future by proceeding immediately<br />

with plans to construct a new facility for 200mm<br />

wafers for both TI and general market demands.”<br />

That expansion came to fruition in 1997 and<br />

represented an investment of almost $300 million.<br />

This freed up <strong>MEMC</strong> Southwest’s existing<br />

manufacturing facility for the captive production<br />

of TI’s smaller diameter wafer requirements.<br />

MeMC, InC.: a gloBal CoMPany<br />

Through its joint ventures and other alliances,<br />

<strong>MEMC</strong> implemented a process whereby localized<br />

sourcing and technical service provided significant<br />

competitive advantages. <strong>MEMC</strong>’s geographically<br />

diverse production network allowed the company<br />

to service the world’s key semiconductor<br />

markets while remaining close, strategically and<br />

geographically, to its most important asset—the<br />

customer. Other than the Korean Plan, which is 20<br />

percent owned by Samsung, currently, all original<br />

joint ventures are 100 percent <strong>MEMC</strong> owned and<br />

operated.<br />

Fifty years after its inception as a pioneering<br />

plant in St. Peters, Missouri, <strong>MEMC</strong> Electronic<br />

Materials, Inc., remains a global leader in the<br />

silicon wafer industry. With a worldwide network<br />

for manufacturing polysilicon, wafer production,<br />

and finishing, <strong>MEMC</strong>’s scope is truly global.<br />

the large-sCale IntegratIon (lsI) era<br />

When first developed, integrated circuits<br />

contained only a few transistors. Referred to as<br />

small-scale integration or SSI, they used circuits<br />

containing transistors numbering in the tens. By<br />

the late 1960s, devices contained hundreds of<br />

transistors on each chip, called medium-scale<br />

integration or MSI. The mid-1970s ushered in the<br />

era of large-scale integration or LSI with tens of<br />

thousands of transistors per chip. Predictably, the<br />

next generation, starting in the 1980s, was that<br />

of Very Large-Scale Integration or VLSI, using<br />

Double side wafer grinder at <strong>MEMC</strong> Southwest’s modifications<br />

area, April 1997.<br />

First completed crystal at <strong>MEMC</strong> Southwest, December 1996.<br />

hundreds of thousands of transistors. The term<br />

VLSI has since been supplanted by ULSI or Ultra<br />

Large-Scale Integration to refer to an integrated<br />

circuit with more than one million components<br />

per chip.<br />

Each successive generation of IC capacity requires<br />

increasing levels of perfection in silicon wafer<br />

technology. Throughout the 1990s, <strong>MEMC</strong><br />

developed silicon wafers that provided optimal<br />

solutions for VLSI-era device manufacturers and<br />

A Global Company 57

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